Products in Packaging & Assembly: Good Thermal Conductivity

WACKER® Silicone Paste P 12 is a pure white, soft-consistency heat sink paste with marked thermal conductivity. It is electrically insulating. WACKER® PASTE P 12 is used especially in semiconductor technology as a heat sink paste. When there is a need for good heat transfer from a semiconductor to a cooling element, applying a thin coating of WACKER® PASTE P 12 is advisable. In the assembly of semiconductors such as diodes, transistors, and thyristors, microscopic irregularities may exist on the mating surfaces of the semiconductor and the cooling surface. These surface irregularities can hinder firm metal-to-metal contact when assembled.

ELASTOSIL® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber with a two-part formulation and a 1:1 mixing ratio. It features a very high hardness (Shore A) and excellent heat stability. This silicone rubber is particularly known for its high thermal conductivity, making it ideal for the encapsulation of electronic components.

EC-1850FT with EH-10E Hardener is a very low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals.

EB-430-1HT is a highly versatile epoxy adhesive formulated for semiconductor industry. An easy to dispense liquid paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is designed for protecting IC's in TAB, as well as glob-top encapsulant for COB placement. Other applications include fabricating heat sinks, bonding semiconductors and transistors to heat sinks and general-purpose bonding of electronic components.

EC-1012MFR-HT is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.

EC-1015 is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EC-1012M/EH-20M is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

Thermal Adhesive 8349TFM is a 2-part, flame retardant, thermally conductive epoxy adhesives. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is most often used to bond heatsinks to CPUs, LEDs and other electronics components. For a shorter working time, use 8329TFF. For a longer working time, use 8329TFS.

8329TFM is a thermally conductive two-part epoxy adhesive. It is dark gray, smooth, thixotropic, and bonds well to a wide variety of substrates. This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips, and automatic dispensing systems. For a faster working life, use 8329TFF. For a longer working life, use 8329TFS.

8329TFS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermally conductive adhesive is used to glue heatsinks to LED’s, CPU’s, and other heat generating components. This product cures slowly. For a faster cure version, use 8329TFF or 8349TFM.

8329TFF is a 2-part, flame retardant, thermally conductive epoxy adhesive with a 5-minute working time. It is an off white, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal glue is often used to bond heatsinks to CPUs, LEDs and other electronics components. This product has a very short working time. For a longer working time, use 8349TFM or 8329TFS.

8329TCS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. 8329TCS has been designed for maximum thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity, use 8329TFS. For a shorter working time, use 8329TCM.

8329TCF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. It is also flame retardant and meets the UL 94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 4 hours. This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems. 8329TCF has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFF. For a longer working life, use 8329TCM or 8329TCS.

8329TCM is a 2-part thermally conductive epoxy adhesive. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This adhesive is most often used as heatsink glue, attaching heatsinks to CPUs, LEDs, or other heat generating electronics components. This compound has been formulated for high thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity use 8349TFM. For a shorter working time, use 8349TFM. For a longer working time, use 8329TCS.

SC-550-LV-TC-2 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-2 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

HTG-72 – is our highest temperature resistance thermal grease, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 360°C, maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

EC-1850FT is a pourable filled epoxy resin system offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. It is a lower viscosity version of EC-1850FT. It rapidly transfers heat, eliminates hot spot, and increases the operating efficiency of most encapsulated devices. Its low shrinkage minimizes risk of damage to fragile components.

RTK7556 is a reworkable, boron nitride-filled, tacky epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. This B-staged conductive adhesive offers excellent reworkabilty at 80-150°C. RTK7556 has high thermal conductivity and the low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

CGSTAPE - 7659 is a CM polyimide film formed by sputtering metal aluminum, then develops thin aluminum layer, with one side insulation, the other side high conduct electricity. It not only has the performance of excellent heat resistant, mechanical, chemical stability, radiation resistant, and self-extinguishing, but also emi shielding, high thermal conductivity. Now we have HN polyimide film sputtering aluminum and black polyimide film sputtering aluminum.

TC8750 is a silver-filled, B-staged epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. Its low Tg imposes minimum thermal stress on bonded parts during thermal cycling or shock testing. It has excellent thermal conductivity and can be used for most applications at temperatures from -65 to 150°C. It is reworkable at 80-150°C. Customers must test the adhesive for their specific applications to confirm its suitability. TC8750 is designed to meet the hybrid adhesive specification MIL-STD-883; Method 5011. It exhibits low outgassing at 125°C and passes NASA Outgassing requirements.

STG-51TC Heat Sink Compound is silicone thermal grease material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. STG-51TC specially developed to solve the problems of contamination and migration associated with silicone-based products. The compound is a unique synthetic-based thermal grease use to insure quick, efficient heat transfer and dissipation

MC8880 is a one part, silver-filled cyanate ester adhesive that is electrically and thermally conductive. It is designed for use in both chip and component level attach application to reduce stress. It can withstand temperatures up to 300°C without thermal degradation. Its unique chemistry results in very low moisture absoption, high adhesive strength.

HTG-72TC is our highest temperature resistance thermal grease along with very high thermal conductivity. It is a heavily filled system with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 360°C, maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

ME7156 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding large area die and components. ME7156 can be readily reworked at 80-100°C. Positive displacement dispensing equipment with ceramic auger is recommended..

CoolMag™ PU 10 is a thermally conductive composite PDMS based elastomeric compound of encapsulant two component system, designed for Power Electronics in general and for Automotive, especially in Electrified Vehicles with multiple functionalities: Heat Transfer, reduction of hot spots and minimizing average temperature of systems Electric Isolation Mechanical protection Flame and fire protection (Retardant and Extinction)

TG-69 compound grease-like NON-SILICONE, NON- FLOWABLE material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. TG-69 has been engineered to solve the problems of contamination and migration associated with silicone-based products. Unique polysynthetic-based thermal grease used to insure quick, efficient heat transfer and dissipation for the full operational life of your hardware.

TG-61 is Non-Silicone thermal grease is exceptionally soft, non-silicone thermal grease. In addition to solving the problems of contamination and migration associated with traditional silicone-based thermal grease, this unique material can be spread into an extremely thin film while remaining a homogenous mixture.

STG-41 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink. This compound is ideally suited for use in thin cross-sectional thicknesses down to ≤ 1 mil.

EG7635 is a alumina filled, electrically insulating and thermally conductive rigid epoxy paste adhesive. While bonding at ambient temperature can be achieved overnight, elevated temperatures will accelerate curing, exponentially. EG7635 high thermal conductivity and high strength makes it excellent for bonding substrates, components and heat sinks where thermal management is critical. It has more than 15 years of proven records of providing bonding to difficult substrates. EG7635 exibits reduced bond strength at 80-100°C for easier rework.