Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Base Oil Type
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- Ready-to-Use Product Features
- Key Features and Benefits
- Good Thermal Performance- (2.0 HW/m°k)
- Low Interface Thermal Resistance - (0.05 C-In2/W)
- Thin Bond lines to ≤ 1 mil.
- Low bleed and evaporation.
- Non-Toxic.
- Reworkable/Easy to Remove.
- Easy to Apply by Dispensing or Screen Printing/Stencil
Applications & Uses
- Markets
- Applications
- Application Area
- Typical Application
STG-41 Heat Sink Compound is applied to the base and mounting studs of transistors, diodes and silicone controlled rectifiers. In these situations, a small amount of the thermal grease is applied using either the dispensing of screen printing/stencil methods STG-41 can be used as a high- voltage corona suppressant/non-flammable coating, in connections for fly back transformers located in TV sets and similar design applications. It is also used in mounting semiconductor devices; thermoelectric modules; power transistors and diodes; coupling entire heat generating assemblies to chassis; heat transfer medium on ballasts; thermal joints; thermocouple wells; mounting power resistors; and for any devices where efficient cooling is required in major industries including, electronic (computer, appliance, wireless, etc.), automotive and electrical.
- Clean Up
Standard approved clean-up and disposal procedures should be followed in every situation. The use of disposable containers and utensils are recommended whenever possible to simplify and expedite clean-up. However, when disposable containers are impractical, STG-41 can be removed by cleaning solvents with such as Mineral Spirit (Paint Thinner), Heptane or Isopropyl Alcohol.
Properties
- Typical Properties
Value Units Test Method / Conditions Viscosity Thixotropic Paste - - Specific Gravity (at 25°C) 2.5 - - Evaporation (at 200°C, 24 hrs) 0.5 %wt - Bleed (at 200°C, 24 Hrs) 0.4 %/Wt - Thermal Conductivity 2 W/m °K ASTM D5470 Thermal Resistance 0.05 °C-In/W - Dielectric Strength (0.05" gap) 390 Volts/mil ASTM D150 Dielectric Constant (at 25°C, 1000Hz) 4.4 - ASTM D150 Dissipation Factor (at 25°C, 1000 Hz.) 0.0021 - ASTM D150 Volume Resistivity 2.8 x 10^14 Ω-cm ASTM D257 Operating Temperature Range -50 to 200 °C -
Regulatory & Compliance
- Certifications & Compliance
Storage & Handling
- Shelf Life
- 5 Years
- Shelf Life
STG-41 has a shelf-life of 5 years at room temperature (25°C) in unopened containers. Slight settling of the filler may occur during long-term storage. In this case, it is recommended to re-disperse the filler by hand or mechanical mixing. Refrigerate material at 0-10°C to avoid any settling.