AI Technology RTK 7556

RTK7556 is a reworkable, boron nitride-filled, tacky epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. This B-staged conductive adhesive offers excellent reworkabilty at 80-150°C. RTK7556 has high thermal conductivity and the low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

Product Type: Insulation Adhesive

Application Area: Die/Chip Attach

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Features & Benefits

Ready-to-Use Product Features
Product Features
  • Stress free.
  • High thermal conductivity.
  • Tacky epoxy film adhesive.
  • Substrate and component.
  • Die attach.
  • Heat sink attach.

Applications & Uses

Markets
Applications
Application Area
Application Procedures
  • Keep product at room temperature for at least minutes before using.
  • Cut to desired size.Clean contact surfaces if needed.
  • Remove one side of the release liner by peeling up a corner of the release liner. Fold the release liner over, approaching a 180° angle.
  • Pull the release liner quickly, removing it with one stroke.
  • Apply to substrate, then remove other side of release liner and attach die or component.
  • Cure according to one of the recommended cure schedules.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivitymin. 1x10¹⁴Ω-cm-
Thermal Conductivitymin. 3.0W/m-°C-
Thermal Conductivity3.06 - 3.74W/m-°C-
Die Shear Strengthmin. 1500psi-
Glass Transition Temperature-66 to -54°C-
Glass Transition Temperature-45°C-
Electrical Resistivity (at 150°C, 30minutes)min. 1x10¹⁴Ω-cm-
Dielectric Strength675 - 825Volts/mil-
Lap Shear Strengthmin. 3.5N/mm²-
Device Push Off Strengthmin. 6.9N/mm²-
Hardness73.8 - 90.2Shore A-
Cured Density1.08 - 1.32g/cc-
Coefficeint of Linear Thermal Expansion93.5 - 126.5ppm/°C-
Maximum Continuous Operation Temperaturemax. 150°C-

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Cure Schedules
Temperature Time Pressure
100°C 4 hrs 5 -10 psi
125°C 2 hrs 5 -10 psi
150°C 1 hr 5 -10 psi

The die or component can also be tacked on the substrate at 125C or higher with 10 psi. When a filet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle.

Packaging & Availability

Product Availability
  • RTK7556 is available in reels, sheets, or as custom preforms.
  • Standard thicknesses are 0.003" and 0.006".
  • Special thicknesses are available.
  • This material is a self-supporting, tacky epoxy film adhesive.

Storage & Handling

Shelf Life
1 Year (at -40°C)
Storage Information

Storage temperature:0 - 5°C in sealed container.