| Electrical Resistivity | max. 0.0003 | Ω-cm | - |
| Viscosity (at 5 rpm, Thixotropic Index=>4) | 20000 | cPs | - |
| Glass Transition Temperature | -20 | °C | - |
| Device Push Off Strength | min. 2000 | psi | - |
| Hardness | approx. 80 | Shore A | - |
| Cured Density (for Conductive Adhesive Portion) | 4.8 | g/cc | - |
| Thermal Conductivity | min. 12 | W/m-°K | - |
| Coefficient of Linear Thermal Expansion (Tab-Composite, X-Y=Z, Isotropic) | 90 | ppm/°C | - |
| Maximum Continuous Operation Temperature | min. 180 | °C | - |
| Decomposition Temperature (at 5% Weight Loss) | min. 450 | °C | - |
| Recommended Curing Temperature (for 10minutes) | min. 175 | °C | - |