Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- Ambient curable.
- Thermally conductive.
- 2-component epoxy paste.
- High bond strength.
- Heat-sink attach.
- Substrate attach.
- Component attach.
Applications & Uses
- Markets
- Applications
- Application Area
- Application Procedures
- Store Part A and Part B at ambient.
- Mix A and B 1:1 by weight.
- Cure according to one of the recommended schedules.
- Applications
- Heat-Sink Attach
- Substrate Attach
- Component Attach
Properties
- Physical Form
- Typical Properties
Value Units Test Method / Conditions Electrical Resistivity (at 150°C, 30minutes) min. 1x10¹⁴ Ω-cm - Dielectric Strength min. 750 Volts/mil - Glass Transition Temperature 54 - 66 °C - Lap Shear Strength min. 6.9 N/mm² - Device Push Off Strength min. 17.2 N/mm² - Cured Density 2.07 - 2.53 g/cc - Thermal Conductivity 1.53 - 1.87 W/m-°C - Coefficeint of Linear Thermal Expansion 45 ppm/°C - Maximum Continuous Operation Temperature max. 150 °C - Average Viscosity (at 25°C, 0.5rpm, Spindle CP51) 228000 - 342000 cPs Brookfield Viscometer DV-1 Thixotropic Index 6 - -
Regulatory & Compliance
- Certifications & Compliance
- Quality Standards
Technical Details & Test Data
- Cure Schedules
Temperature Time 25°C 24 hrs 80°C 120 mins 100°C 60 mins 125°C 30 mins 150°C 15 mins - Note
Mixed components gel, an additional 80°C at 120 min. is suggested for complete cure.
Packaging & Availability
- Product Availability
EG7635 is available in syringes for automatic needle dispense applications or in jars. Upon request, the material can be shipped premixed and frozen.
Storage & Handling
- Shelf Life
- 1 Year (at 25°C)