MG Chemicals 8329TCF - Fast Cure Thermal Adhesive, High TC

• Thermal conductivity of 1.0 W/(m·K)
• 1:1 mix ratio
• Working life: 4 minutes
• Set time: 15 minutes
• Cure time: 4 hours at room temperature or 10 minutes at 65 °C (149 °F)
• Flame retardant—meets UL 94V-0 standard
• Provides strong electrical insulation
• Low CTE prior Tg
• High tensile and compressive strength
• Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
• RoHS 3 compliant

For best results, follow the procedure below. For quantities less than 1 mL or for stricter stoichiometry control, mix by weight with a high-precision balance. Heat cure to achieve optimal conductivity.

Syringe or Cartridge

To insert the cartridge in the gun, see the Application Guide section for dispensing accessories.

• Twist and remove the cap from the cartridge or syringe. Do not discard cap.
• Dispense a small amount to ensure even flow of both parts.
• (Optional) Attach a static mixer.
  • a. Dispense and discard 3 to 5 mL of the product to ensure a homogeneous mixture.
  • b. After use, dispose of static mixer.
• Without a static mixer, dispense material on a mixing surface or container, and thoroughly mix parts A and B together.
• To stop the flow, pull back on the plunger.
• Clean nozzle to prevent contamination and material buildup.
• Replace the cap on the cartridge or syringe.

Dispensing Accessories

Consult the table below for appropriate accessory selection. See the Application Guide for instructions on using the dispensing accessories

Adhesion - 8329TCF epoxy adheres to most plastics and metals used to house printed circuit assemblies; however, it is not compatible with contaminants like water, oil, or greasy flux residues, which may affect adhesion. In case of contamination, first, clean the surface to be coated with MG Chemicals 824 Isopropyl Alcohol. For substrate substances with weak adhesion strengths, surface preparation such as sanding or pre-coating with a suitable primer may improve adhesion.

Chemical resistance - Once cured, the epoxy adhesive is inert under normal conditions. It will resist water and salt exposure. It is expected to resist short term exposures to fuels or similar non-polar organic solvents, but it is not suitable for prolonged exposures. Avoid use with strong acids, strong bases, or strong oxidizers.

Substrate Adhesion (In Decreasing Order)

Physical Properties

• Note : Specifications are for epoxy samples cured at 22 °C for 24 h and conditioned at ambient temperature and humidity.
• ^a) N/mm2 = mPa; lb/in2 = psi

Electrical Properties and Thermal Properties

• Note : Specifications are for epoxy samples cured at 22 °C for 24 h and conditioned at ambient temperature and humidity.
• ^a) To allow comparison between products, the dielectric strength was recalculated with the Tautscher equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8” (3.175 mm).
• ^b) Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10-6 = unit/unit/°C × 10^-6

Uncured Properties :Mixture (A:B)

• a) To allow comparison between products, the dielectric strength was recalculated with the Tautscher equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8” (3.175 mm).
• b) Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10-6 = unit/unit/°C × 10-6

• ^a) Brookfield viscometer at 1 rpm with spindle RV F96
• ^b) Brookfield viscometer at 1 rpm with spindle RV C93