Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- Low CTE.
- Low moisture absorption.
- Low ionic impurities.
- High electrical conductivity.
- High thermal conductivity.
- Chip or component adhesive.
- High temperature devices.
- High power devices.
Applications & Uses
- Markets
- Applications
- Application Area
- Application Method
- Cure Method
- Application Procedures
- Thaw to room temperature before opening container.
- Dispense adhesive onto clean die or substrate.
- Cure according to the recommended schedules.
- Note
The monomer contained in this product is subject to crystallization even at room temperature. If product is thawed and remains crystallized, simply place in 40°C environment for as long as needed to return product to the liquid state i.e. usually not more that 15-20 minutes.
Properties
- Typical Properties
Value Units Test Method / Conditions Electrical Resistivity (at 150°C, 60minutes) max. 5x10⁻² Ω-cm - Glass Transition Temperature 216 - 264 °C - Glass Transition Temperature 240 °C - Glass Transition Temperature 220 °C - Lap Shear Strength min. 6.9 N/mm² - Device Push Off Strength min. 3000 psi - Device Push Off Strength min. 17.2 N/mm² - Hardness 72 - 88 Shore D - Hardness approx. 99 Shore D - Cured Density 3.15 - 3.85 g/cc - Thermal Conductivity min. 9 W/m-°C - Thermal Conductivity min. 8 W/m-°K - Coefficeint of Linear Thermal Expansion 19.55 - 26.45 ppm/°C - Maximum Continuous Operation Temperature min. 250 °C - Maximum Continuous Operation Temperature max. 300 °C - Average Viscosity (at 25°C, 5rpm, Spindle CP51) 52000 - 78000 cPs Brookfield Viscometer DV-1 Electrical Resistivity max. 5x10⁻² Ω-cm - Electrical Resistivity max. 0.003 Ω-cm - Die Shear Strength min. 2500 psi - Viscosity (at 5 rpm) 65000 cPs - Viscosity (at 5 rpm, Thixotropic Index=>4) 10000 cPs - Cured Density (for Conductive Adhesive Portion) 4 g/cc - Coefficient of Linear Thermal Expansion (Tab-Composite, X-Y=Z, Isotropic) 26 ppm/°C - Decomposition Temperature (at 5% Weight Loss) min. 500 °C - Recommended Curing Temperature (for 10minutes) min. 150 °C -
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedules
Temperature Time 125°C 2 hrs 150°C 45 mins 175°C 10 mins Pot life is 5 days at 25°C.
Packaging & Availability
- Product Availability
MC8880 is available in syringes for automatic dispense application.
Storage & Handling
- Shelf Life
- 1 Year
- Storage Information
Storage temperature: -40 °C.