AI Technology LESP 7670-HF

Product Type: Conductive Adhesive

Application Area: Lid Seal

Cure Method: Chemical Cure

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Features & Benefits

Applications & Uses

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivitymin. 5X10¹⁴Ω-cm-
Viscosity (at 5 rpm, Thixotropic Index=>4)65000cPs-
Glass Transition Temperature130°C-
Device Push Off Strengthmin. 3000psi-
Hardnessapprox. 90Shore D-
Cured Density (for Conductive Adhesive Portion)1.6g/cc-
Thermal Conductivitymin. 0.20W/m-°K-
Coefficient of Thermal Expansion (X-Y=Z, Isotropic)35ppm/°C-
Maximum Continuous Operation Temperature150°C-
Decomposition Temperature (at 5% Weight Loss)min. 450°C-
Recommended Curing Temperature (for 30minutes)min. 150°C-

Regulatory & Compliance

Certifications & Compliance