Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
Properties
- Typical Properties
Value Units Test Method / Conditions Electrical Resistivity min. 5X10¹⁴ Ω-cm - Viscosity (at 5 rpm, Thixotropic Index=>4) 65000 cPs - Glass Transition Temperature 130 °C - Device Push Off Strength min. 3000 psi - Hardness approx. 90 Shore D - Cured Density (for Conductive Adhesive Portion) 1.6 g/cc - Thermal Conductivity min. 0.20 W/m-°K - Coefficient of Thermal Expansion (X-Y=Z, Isotropic) 35 ppm/°C - Maximum Continuous Operation Temperature 150 °C - Decomposition Temperature (at 5% Weight Loss) min. 450 °C - Recommended Curing Temperature (for 30minutes) min. 150 °C -
Regulatory & Compliance
- Certifications & Compliance