AI Technology ESP 8660-HK-DAF

Product Type: Conductive Adhesive

Application Area: Die/Chip Attach

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Features & Benefits

Applications & Uses

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivitymax. 4x10⁻⁴Ω-cm-
Thermal Conductivitymin. 8.0W/m-°K-
Die Shear Strengthmin. 3000psi-
Glass Transition Temperature175°C-
Film Thickness20, 40microns-

Regulatory & Compliance

Certifications & Compliance
Quality Standards