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AI Technology ME 7156

ME7156 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding large area die and components. ME7156 can be readily reworked at 80-100°C. Positive displacement dispensing equipment with ceramic auger is recommended..

Product Type: Epoxy Adhesive

Application Area: Die/Chip Attach

Cure Method: Heat Cure

Compatible Substrates & Surfaces: Aluminum, Copper, Metal

Application Method: Injection

Technical Data Sheet

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Product Type
Epoxy Adhesive
Technologies
Ready-to-Use Products
Product Families
Ready-to-Use Products — Adhesives & Sealants
Conductive Adhesives

Features & Benefits

Ready-to-Use Product Features
Electrically Conductive,
Excellent Flexibility,
Good Bonding Strength,
Good Thermal Conductivity,
Stress-free
Product Features
  • Stress free.
  • Thermally conductive.
  • Reworkable.
  • Epoxy paste adhesive.
  • Substrate and component.
  • Reworkability.
  • Mismatched CTE's

Applications & Uses

Markets
Consumer Goods,
Electrical & Electronics
Applications
Consumer Goods — Appliances & Electronics
Electrical & Electronics — Packaging & Assembly
Adhesives & Sealants
Electrical & Electronics — Parts & Components
Semiconductor Manufacturing
Application Area
Die/Chip Attach
Application Method
Injection
Compatible Substrates & Surfaces
Aluminum,
Copper,
Metal
Cure Method
Heat Cure
Application Procedures
  • Leave at ambient temperature until thawed before opening jar or dispensing syringe.
  • Dispense adhesive onto clean substrate.
  • Pre-bake the substrate with dispensed adhesive at 60°C for 30 to 60 minutes to achieve optimum bonding. Pre-bake not needed in all applications
  • Cure according to one of the recommended schedules.

Properties

Physical Form
Paste
Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity (at 150°C, 60minutes)min. 1x10¹⁴Ω-cm-
Dielectric Strengthmin. 750Volts/mil-
Glass Transition Temperature- 27.5 to -22.5°C-
Glass Transition Temperature-25°C-
Lap Shear Strengthmin. 6.2N/mm²-
Device Push Off Strengthmin. 16.6N/mm²-
Hardness72 - 88Shore A-
Cured Density2.07 - 2.53g/cc-
Thermal Conductivity1.53 - 1.87W/m-°C-
Thermal Conductivitymin. 1.7W/m-°C-
Coefficeint of Linear Thermal Expansion102 - 138ppm/°C-
Maximum Continuous Operation Temperaturemax. 150°C-
Average Viscosity (at 25°C, 0.5rpm, Spindle CP51)115200 - 172800cPsBrookfield Viscometer DV-1
Electrical Resistivitymin. 1x10¹⁴Ω-cm-
Die Shear Strengthmin. 2400psi-
Viscosity (at 0.5 rpm)144000cPs-

Regulatory & Compliance

Certifications & Compliance
ISO 9001

Technical Details & Test Data

Cure Schedules
Temperature Time
80°C 8 hrs
125°C 4 hrs
150°C 2 hrs
175°C 1 hr

For higher temperature curing, above 12 °C and/or bonding area of over 1cmx1cm, it is recommended that the dispensed adhesive be pre-baked, open faced without parts, at 60°C for 30 minutes, before parts are mounted and cured.

Packaging & Availability

Product Availability

ME7156 is available in syringes for automatic needle dispense applications or in jars. Both viscosity and thixotropic index can be modified to your specific needs.

Storage & Handling

Shelf Life
1 Year
Storage Information

Storage temperature: -40°C.

Pot life: 72 hrs at 25°C.