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AI Technology TC 8750

TC8750 is a silver-filled, B-staged epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. Its low Tg imposes minimum thermal stress on bonded parts during thermal cycling or shock testing. It has excellent thermal conductivity and can be used for most applications at temperatures from -65 to 150°C. It is reworkable at 80-150°C. Customers must test the adhesive for their specific applications to confirm its suitability. TC8750 is designed to meet the hybrid adhesive specification MIL-STD-883; Method 5011. It exhibits low outgassing at 125°C and passes NASA Outgassing requirements.

Product Type: Conductive Adhesive, Epoxy Adhesive

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Chemical Family
Epoxy & Epoxy Derivatives
Product Type
Conductive Adhesive,
Epoxy Adhesive
Technologies
Ready-to-Use Products
Product Families
Ready-to-Use Products — Adhesives & Sealants
Conductive Adhesives

Features & Benefits

Ready-to-Use Product Features
Electrically Conductive,
Flexible,
Good Bonding Strength,
Good Thermal Conductivity,
High Reliability,
Low Glass Transition Temperature,
Low Outgassing,
Stress-free,
Temperature Resistance
Product Features
  • Stress free.
  • Reworkable.
  • Electrically conductive.
  • B-staged epoxy film adhesive.
  • Substrate and component.
  • Reworkability.
  • Mismatched CTE's.

Applications & Uses

Markets
Consumer Goods,
Electrical & Electronics
Applications
Consumer Goods — Appliances & Electronics
Electrical & Electronics — Packaging & Assembly
Adhesives & Sealants
Application Procedures
  • Let adhesive thaw in bag or plastic box for 30 min. Cut to desired size.
  • Lift the corner ofa release liner on one side of the tack film.
  • Peel the release liner over to 180° and pull quickly to remove the liner in one stroke.
  • Attach to components, and then peel the 2nd release liner.
     
Note

When this product is removed from the freezer, used and refrozen, the shelf life at -40°C and pot life 25°C is lowered depending on the amount of time out of the -40°C freezer.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity (at 150°C, 60minutes)max. 5x10⁻⁴Ω-cm-
Glass Transition Temperature0°C-
Lap Shear Strengthmin. 6.1N/mm²-
Device Push Off Strengthmin. 16.6N/mm²-
Hardness73.8 - 90.2Shore A-
Cured Density3.15 - 3.85g/cc-
Thermal Conductivitymin. 8.0W/m-°C-
Thermal Conductivity6.4W/m-°C-
Coefficeint of Linear Thermal Expansion93.5 - 126.5ppm/°C-
Maximum Continuous Operation Temperaturemax. 150°C-
Electrical Resistivitymax. 4x10⁻⁴Ω-cm-
Die Shear Strengthmin. 1500psi-

Regulatory & Compliance

Certifications & Compliance
ISO 9001
Quality Standards
MIL-STD-883F,
NASA Low Outgassing Test

Technical Details & Test Data

Cure Schedules
Temperature Time Pressure
80°C 12 hrs 3-5 psi
100°C 6 hrs 3-5 psi
125°C 3 hrs 3-5 psi
150°C 2 hrs 3-5 psi

Post-curing at 125°C for 24 hours is required to pass NASA outgassing testing. The die or component can be tacked on the substrate with 3-5 psi, at 80°C to 100°C. When a filet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle. Use 100°C, 1 hr prior to using the 125°C and 150°C cures. Pot life is 48 hrs at 25°C.

Packaging & Availability

Product Availability

TC8750 is available in sheet sizes or as custom preforms. Standard thicknesses are 0.003" and 0.006". Special thicknesses are available.

Storage & Handling

Shelf Life
12 Months (at -40°C)
Storage Information

Storage temperature: 0- 5°C in sealed package.