MG Chemicals 8329TFM - Thermal Adhesive, Flowable

• Thermal conductivity: 1.1 W/(m·K)
• 1:1 mix ratio
• Working life: 45 minutes
• Cure time: 24 hours at room temperature or 2 hours at 65 °C (149 °F)
• Provides strong electrical insulation
• High tensile strength
• Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
• RoHS 3 compliant

For best results, follow the procedure below. For quantities less than 1 mL or for stricter stoichiometry control, mix by weight with a high-precision balance. Heat cure to achieve optimal conductivity.

Syringe or Cartridge

• To insert the cartridge in the gun, see the Application Guide section for dispensing accessories.
• Twist and remove the cap from the cartridge or syringe. Do not discard cap.
• Dispense a small amount to ensure even flow of both parts.
• (Optional) Attach a static mixer.
  • Dispense and discard 3 to 5 mL of the product to ensure a homogeneous mixture.
  • After use, dispose of static mixer.
• Without a static mixer, dispense material on a mixing surface or container, and thoroughly mix parts A and B together.
• To stop the flow, pull back on the plunger.
• Clean nozzle to prevent contamination and material buildup.
• Replace the cap on the cartridge or syringe.

Dispensing Accessories

Consult the table below for appropriate accessory selection. See the Application Guide for instructions on using the dispensing accessories.

Adhesion : 8329TFM epoxy adheres to many materials found on printed circuit assemblies; however, contaminants like water, oil, and greasy flux residues may affect adhesion. If contamination is present, clean the printed circuit assembly with an electronic cleaner such as MG Chemicals 824 Isopropyl Alcohol. For substrate substances with weak adhesion strengths, surface preparation such as sanding or pre-coating with a suitable primer may improve adhesion.

Chemical Resistance : Once cured, the epoxy adhesive is inert under normal conditions. It will resist water and salt exposure. It is expected to resist short term exposures to fuels or similar non-polar organic solvents, but it is not suitable for prolonged exposures. Avoid use with strong acids, strong bases, or strong oxidizers.

Substrate Adhesion (In Decreasing Order)

• ^a) Brookfield viscometer at 2 rpm with spindle RV S95

• a) To allow comparison between products, the dielectric strength was recalculated with the Tautscher equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8” (3.175 mm).
• b) Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10-6 = unit/unit/°C × 10-6

Cured Properties

Physical Properties

• Note: Specifications are for epoxy samples cured at 65 °C for 2.5 h and conditioned at ambient temperature and humidity.
• ^a) N/mm2 = mPa; lb/in2 = psi

Electrical Properties and Thermal Properties

• Note : Specifications are for epoxy samples cured at 65 °C for 2.5 h and conditioned at ambient temperature and humidity.
• ^a) To allow comparison between products, the dielectric strength was recalculated with the Tautscher equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8” (3.175 mm).
• ^b) Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10-6 = unit/unit/°C × 10-6

Store between 22 to 27 °C [72 to 81 °F] in a dry area, away from sunlight. Some of the components are sensitive to air, always recap firmly when not in use to maximize shelf life.

• ^a) Temperature that can be withstood for short periods without sustaining damage.