Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
Applications & Uses
- Markets
- Applications
- Application Area
- Product Applications
- It offers the excellent heat transfer, high voltage insulation and dimensional stability over a wide temperature range.
- As an encapsulant for power devices it distributes heat evenly throughout the casting, providing greater efficiency and longer working life.
- Excellent performance in densely packaged power supplies, integrated circuits, thick film hybrid devices, D/A converters, oscillators, amplifiers, relays, transformers and semiconductors etc.
- Instruction for Use
Stir well the contents of each container every time before removing material. If the contents are hard or lumpy, warm to 80°C and mix thoroughly before removing material.
1. Weigh each 100 grams of EC-1850FT to 20 grams of Hardener EH-10E.
2. Mix until uniform. Scrape the sides and bottom of container repeatedly during mixing.
3. Apply to clean bonding surfaces and cure as recommended to achieve the desired properties.
4. Typical cured properties were determined using recommended cure schedule. Some difference in properties may occur with the alternate or other cure schedules.- Industrial Usage
Practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
- Product Applications
Low density, epoxy potting compound for potting electronic components with minimal weight gain.
Properties
- Color
- Typical Properties
Value Units Test Method / Conditions Mix Ratio by Weight 100/20 - - Resin Viscocity (at 25°C) 250,000±50,000 cPs - Mixed Viscocity (at 25°C) 3000 - 5000 cPs - Pot Life (at 25°C, 500g) min. 8 hours - Recommended Cure (at 70°C) 2 hours - Recommended Cure (at 150°C) 2 hours - Alternate Cure (at 100°C) 4 hours - - Typical Cured Properties
Value Units Test Method / Conditions Specific Gravity 1.95 - - Hardness 92 Shore D - Linear Shrinkage 0.3 % - Water Absorption (24 hr at Room Temperature) 0.04 % - Thermal Conductivity 1.2 W/m °K - Service Temperature Range 55 to 180 °C - Glass Transition Temperature (Tg) 130 °C - Coefficient of Thermal Expansion (Below Tg) 34 10^-6/°C - Coefficient of Thermal Expansion (Above Tg) min. 140 10^-6/°C - Flexural Strength 12300 psi - Flexural Modulus 1.2x10^5 psi - Dielectrie Constant (at 1 kHz, 25°C) 4,73 - - Dielectrie Constant (at 1 kHz, 100°C) 4.84 - - Dissipation Factor (at 1 kHz, 25°C) 0.01 - - Dissipation Factor (at 1 kHz, 100°C) 0.01 - - Volume Resistivity (at 25°C) 1x10^16 Ω-cm - Volume Resistivity (at 100°C) 1.5x10^15 Ω-cm -
Safety & Health
- Warning
Adequate ventilation of work place and ovens is essential.
Packaging & Availability
- Available Packaging
2 parts Kit - Packaged in Pint, Quart, Gallon, and 5-Gallon size.
Storage & Handling
- Shelf Life
The shelf life of these materials is greater than one year when stored in unopened containers at an average temperature of 25°C.