Products in Electrical & Electronics: Good Thermal Conductivity

WACKER® Silicone Paste P 12 is a pure white, soft-consistency heat sink paste with marked thermal conductivity. It is electrically insulating. WACKER® PASTE P 12 is used especially in semiconductor technology as a heat sink paste. When there is a need for good heat transfer from a semiconductor to a cooling element, applying a thin coating of WACKER® PASTE P 12 is advisable. In the assembly of semiconductors such as diodes, transistors, and thyristors, microscopic irregularities may exist on the mating surfaces of the semiconductor and the cooling surface. These surface irregularities can hinder firm metal-to-metal contact when assembled.

ELASTOSIL® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber with a two-part formulation and a 1:1 mixing ratio. It features a very high hardness (Shore A) and excellent heat stability. This silicone rubber is particularly known for its high thermal conductivity, making it ideal for the encapsulation of electronic components.

SEMICOSIL® 961 TC A/B is a shear-thinning, easy-dispensing, non-slump, two-part silicone rubber that cures at room temperature. It transforms into a soft and tacky rubber with excellent thermal conductivity. Specifically designed as an interface material, SEMICOSIL® 961 TC A/B is ideal for heat sink applications in the electronics industry.

SEMICOSIL® 962 TC A/B is a gap filler paste material with excellent thermal conductivity. It is a two-part silicone rubber that is shear-thinning, easy to dispense, and non-slump. This addition-curing formulation cures at room temperature, resulting in a soft, flexible, and tacky rubber with outstanding thermal conductivity properties.

SEMICOSIL® 9981 TC is a one-part, thermally conductive paste with electrical conductivity that cures into a gap-filling silicone. The thermal paste efficiently fills the finest gaps of heat-generating and ablating substrates, minimizing contact resistance. The thermal resistance is minimized due to an exceptional thermal conductivity of 10 W/mK, in combination with the possibility of reducing bond line thickness to 10 μm.

SEMICOSIL® 9672 TC is a thermally conductive gap filler silicone material designed for heat sink applications in the electronics industry. It is a shear-thinning, non-slump, two-part silicone gel that cures at room temperature to a soft gel with excellent thermal conductivity.

SEMICOSIL® 9671 TC2 A/B is a thermal conductive gap filler silicone material used in heat sink applications for the electronics industry. It is a shear-thinning, easy-dispensing, non-slump, addition-curing, two-part silicone rubber that cures at room temperature. This material is specifically designed to enhance heat dissipation and provide efficient thermal management in electronic devices. SEMICOSIL® 9671 TC2 A/B is ideal for filling gaps and ensuring effective heat transfer in heat sink applications.

CHT Group AS1803 is a non-corrosive, neutral-cure, 1-part, RTV (Room Temperature Vulcanizing) silicone adhesive sealant. It is one in a range of acetone-cure products that are solvent-free. It exhibits excellent primerless adhesion to many substrates and cures rapidly at room temperature to form a tough rubber when in contact with atmospheric moisture. This product will not corrode copper or its alloys and is suitable for use with electronic components.

EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals.

EC-1850FT with EH-10E Hardener is a very low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EC-1012MFR-HT is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EB-430-1HT is a highly versatile epoxy adhesive formulated for semiconductor industry. An easy to dispense liquid paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is designed for protecting IC's in TAB, as well as glob-top encapsulant for COB placement. Other applications include fabricating heat sinks, bonding semiconductors and transistors to heat sinks and general-purpose bonding of electronic components.

EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.

EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EC-1015 is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EC-1012M/EH-20M is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

125-31FPC is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, pre-catalyzed epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-31FPC is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. 125-31FPC is a finer particle version of 125-31C.Features Highly thermally conductive epoxy adhesive B-Stageable Low temperature curing

EC-1106F-LD is a low viscosity, easily pourable, epoxy syntactic foam. It features low density, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where added weight is undesired but resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.

Thermal Adhesive 8349TFM is a 2-part, flame retardant, thermally conductive epoxy adhesives. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is most often used to bond heatsinks to CPUs, LEDs and other electronics components. For a shorter working time, use 8329TFF. For a longer working time, use 8329TFS.

8329TFF is a 2-part, flame retardant, thermally conductive epoxy adhesive with a 5-minute working time. It is an off white, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal glue is often used to bond heatsinks to CPUs, LEDs and other electronics components. This product has a very short working time. For a longer working time, use 8349TFM or 8329TFS.

8329TFS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermally conductive adhesive is used to glue heatsinks to LED’s, CPU’s, and other heat generating components. This product cures slowly. For a faster cure version, use 8329TFF or 8349TFM.

8329TFM is a thermally conductive two-part epoxy adhesive. It is dark gray, smooth, thixotropic, and bonds well to a wide variety of substrates. This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips, and automatic dispensing systems. For a faster working life, use 8329TFF. For a longer working life, use 8329TFS.

8329TCS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. 8329TCS has been designed for maximum thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity, use 8329TFS. For a shorter working time, use 8329TCM.

8329TCF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. It is also flame retardant and meets the UL 94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 4 hours. This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems. 8329TCF has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFF. For a longer working life, use 8329TCM or 8329TCS.

8329TCM is a 2-part thermally conductive epoxy adhesive. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This adhesive is most often used as heatsink glue, attaching heatsinks to CPUs, LEDs, or other heat generating electronics components. This compound has been formulated for high thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity use 8349TFM. For a shorter working time, use 8349TFM. For a longer working time, use 8329TCS.

SC-550-LV-TC-2 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-2 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

EC-1850FT is a pourable filled epoxy resin system offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. It is a lower viscosity version of EC-1850FT. It rapidly transfers heat, eliminates hot spot, and increases the operating efficiency of most encapsulated devices. Its low shrinkage minimizes risk of damage to fragile components.

RTK7556 is a reworkable, boron nitride-filled, tacky epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. This B-staged conductive adhesive offers excellent reworkabilty at 80-150°C. RTK7556 has high thermal conductivity and the low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

122-07SP is a screen-printable, B-Stageable, highly thermally conductive, one part epoxy coating and adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include die attach adhesives, printed circuit board fabrication, advanced material composites, sealing and high performance coatings.Features Excellent Thermal Conductivity] Outstanding Printability B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance Low Ionics Highly thermally conductive epoxy adhesive, B-Stageable

HTG-72 – is our highest temperature resistance thermal grease, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 360°C, maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

STG-51TC Heat Sink Compound is silicone thermal grease material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. STG-51TC specially developed to solve the problems of contamination and migration associated with silicone-based products. The compound is a unique synthetic-based thermal grease use to insure quick, efficient heat transfer and dissipation

TC8750 is a silver-filled, B-staged epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. Its low Tg imposes minimum thermal stress on bonded parts during thermal cycling or shock testing. It has excellent thermal conductivity and can be used for most applications at temperatures from -65 to 150°C. It is reworkable at 80-150°C. Customers must test the adhesive for their specific applications to confirm its suitability. TC8750 is designed to meet the hybrid adhesive specification MIL-STD-883; Method 5011. It exhibits low outgassing at 125°C and passes NASA Outgassing requirements.

CGSTAPE - 7659 is a CM polyimide film formed by sputtering metal aluminum, then develops thin aluminum layer, with one side insulation, the other side high conduct electricity. It not only has the performance of excellent heat resistant, mechanical, chemical stability, radiation resistant, and self-extinguishing, but also emi shielding, high thermal conductivity. Now we have HN polyimide film sputtering aluminum and black polyimide film sputtering aluminum.

ME 8418-SC is a rapid curing version of ME 8418-FP-LV. This silver filled paste is solvent free, electrically and thermally conductive. It is designed for automated, online die attach processing.

STG-41 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink. This compound is ideally suited for use in thin cross-sectional thicknesses down to ≤ 1 mil.