Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Highlights
- Rapid Curing
- High Strength
- Electrically Conductive
- Epoxy Paste Adhesive
Applications & Uses
- Markets
- Applications
- Application Area
- Applications
- Low Temperature Die-Attach
- Smart Card Die and Module Attach
- Application Process
- Thaw for 30 minutes before opening jar or using syringes.
- Dispense adhesive onto clean substrate with a suitable pattern to assure full die coverage.
- Cure according to one of the recommended schedules.
Properties
- Physical Form
- Typical Properties
Value Units Test Method / Conditions Average Viscosity (0.5 rpm, 24°C) 8000 - 12000 cp Brookfield DV-1, Spindle CP51 Cured Density 3.15 - 3.85 gm/cc - Current Carrying Capabilities min. 50 Amp/mm² - Device Push-off Strength min. 22.0 N/mm² - Electrical Resistivity (100°C/60 min) 4x10⁻⁴ ohm-cm - Glass Transition Temperature 81 - 99 °C - Hardness (Type) 72 - 88 Shore D - Linear Thermal Expansion Coefficient 34 - 46 ppm/°C - Maximum Continuous Operation Temperature max. 150 °C - Thermal Conductivity 3.6 - 4.4 W/m-°C -
Technical Details & Test Data
- Cure Schedules
Temperature Time 85°C <120 min 100°C <60 min 125°C <20 min 150 C <10 min
Packaging & Availability
- Availability
ME8418-SC is available in syringes or in jars.
Storage & Handling
- Shelf Life
- 1 year (-40°C), 5 days (25°C)