Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
Applications & Uses
- Markets
- Applications
- Application Method
- B-stage Procedure
Apply adhesive to substrate. Apply heat to advance curing to the non-tacky stage (when cooled to room temperature). A temperature of 125°C for 2 – 3 minutes is required (B-stage time is mass related). The user is encouraged to experiment for optimum drying time at a given temperature. Store on release liner to prevent contamination.
- Bonding Procedure
To use, carefully align parts to be bonded, apply uniform pressure to maintain location. Follow curing guidelines given above. Timing should start once adhesive and substrate reach curing temperature.
Properties
- Typical Properties
Value Units Test Method / Conditions Pot Life Latent - - Conductivity 5.5 W/mK - Chloride max. 10 ppm. - Sodium Content max. 10 ppm. - Potassium Content max. 10 ppm. - - Uncured Properties
Value Units Test Method / Conditions Brookfield Viscosity - HAT Viscometer (at 10 rpm at 25°C) 23000 cps - Specific Gravity 1.85 water = 1 - Theoretical Coverage (at 0.001" Thickness) 30 in^2 - Screen Life 8 hrs - Solid Content 87 % - - Typical Cured Properties
Value Units Test Method / Conditions Thermal Conductivity 5.5 W/mK - Dielectric Strength 440 volts/mil - Volume Resistivity 1 x 10^16 ohms cm - Dielectric Constant (at 1 Hz) 5.2 - - Dielectric Factor (60 Hz) 0.018 - - Thermal Stability Good to 325 °C - Useful Temperature Range -55 to 230 ºC - Glass Transition Temperature (Tg) 100 ºC - Coefficient of Thermal Expansion below Tg 29.5 x 10^-6 in/in/ºC - Coefficient of Thermal Expansion above Tg 13.5 x 10^-5 in/in/°C - Dynamic Tensile Modulus (at -65°C) 8780 Mpa - Dynamic Tensile Modulus (at 25°C) 6710 Mpa - Dynamic Tensile Modulus (at 150°C) 182 Mpa - Dynamic Tensile Modulus (at 200°C) 152 Mpa - T-Shear Strength 1800 psi - Weight Loss (at 300°C, TGA) 2.98 % - Differential Scanning Calorimetry (DSC) Peak Tc 184 °C - Differential Scanning Calorimetry (DSC) ∆ Hc -28.7 J/g -
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Test Data
Safety & Health
- Safety & Handling
- Use with adequate ventilation.
- Keep away from sparks and open flames.
- Avoid prolonged contact with skin and breathing of vapors.
- Wash with soap and water to remove fro skin.
Storage & Handling
- Curing Guidelines
These temperatures and times are presented as a guide only. The end-user is encouraged to experiment to determine optimum curing schedule.
Temperature (°C) Time (min.) 150 60 175 30 200 15 - Handling And Storage
122-07(SP) is a one component epoxy system and is ready to use as received. Product should be stored frozen to maintain consistent flow properties. Allow 122-07(SP) to warm up to room temperature before opening container. Prior to using, mix thoroughly to re-suspend fillers. If needed, 122-07(SP) can be thinned with small amounts of Creative Materials’ 113-12 thinner.
Storage Temperature Containers B-Staged Film 25°C 2 months 1 month -10°C 6 months 6 months