Products in Wire & Cable: Epoxy & Epoxy Derivatives

Composite Materials Laminate B is a high strength, medium weave glass epoxy laminate that retains a minimum of 50 percent of its room temperature flexural strength when tested at 150ºC. Typical applications include insulation in power generation equipment and other structural applications when used in elevated temperatures. Composite Materials Laminate B is certifiable to MIL-I-24768/3, Type GEB.

Cosmic Epoxy E484 is a mineral-filled, glass-reinforced, electrical-grade epoxy molding compound supplied in granular form. It boasts excellent mechanical strength and electrical properties, particularly at high temperatures, and has successfully passed NASA outgassing tests. This compound finds applications in electrical hardware, including underwater connectors and various insulation needs.

Cosmic Epoxy E484-FDA is a mineral-filled, glass-reinforced, electrical-grade epoxy molding compound supplied in granular form. It has received approval for direct food contact. Notably, it possesses outstanding mechanical strength and electrical properties, especially at high temperatures, and has met the rigorous NASA outgassing standards. This material is used in electrical hardware applications such as underwater connectors and other insulation needs.

EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals.

EC-1850FT with EH-10E Hardener is a very low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EC-1012MFR-HT is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EB-430-1HT is a highly versatile epoxy adhesive formulated for semiconductor industry. An easy to dispense liquid paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is designed for protecting IC's in TAB, as well as glob-top encapsulant for COB placement. Other applications include fabricating heat sinks, bonding semiconductors and transistors to heat sinks and general-purpose bonding of electronic components.

EB-142HT-1 is unfilled, low viscosity, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates.

EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.

EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EC-1015 is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EC-1012M/EH-20M is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

MC511FR is a high strength, medium weave glass epoxy laminate that retains a minimum of 50 percent of its room temperature flexural strength when tested at 150ºC. Typical applications include structural applications when used in elevated temperatures. MC511FR also complies with MIL-I-24768/28, Type GEB-F. Certification to IEC standard is pending.

MC511A is a high strength, glass epoxy laminate that is specially formulated to meet power generation producer’s exacting standards where higher strength at elevated temperatures are required. MC511A is certifiable to MIL-I-24768/3, Type GEB, IEC-60893-3-2 EP GC 203 and is halogen free to meet the European restrictions.

EC-1106F-LD is a low viscosity, easily pourable, epoxy syntactic foam. It features low density, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where added weight is undesired but resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.

MC511AF is a high strength, medium weave glass epoxy laminate that retains a minimum of 50 percent of its room temperature flexural strength when tested at 150ºC. Typical applications include insulation in power generation equipment and other structural applications when used in elevated temperatures. MC511AF is certifiable to MIL-I-24768/3, Type GEB.

NP510A is a woven glass fabric composite combined with epoxy resin system. It is engineered to provide NEMA grade FR-4 properties. This material contains bromine on the epoxy resin backbone. NP510A is certifiable to MIL-I-24768/27, Type GEE-F.

NP613 is constructed from electrical grade of kraft paper and a specially modified epoxy resin system. It is designed to be used in tap changers, coil support plates and terminal panels for transformers and their accessories.

NP511 consists of a woven glass fabric combined with high temperature epoxy resin system. NP511 has excellent mechanical strength and electrical properties from cryogenic to elevated temperatures. Continuous operating temperature is 175°C. This material meets NEMA G-11, MIL-I-24768/3, Type GEB and IEC-60893-3-2 EP GC 203.

NP511EM is constructed of a woven glass fabric combined with a high temperature, easy machining epoxy resin. It has excellent mechanical strength and electrical properties at elevated temperatures. The continuous operating temperature is 190°C, in mechanical applications. This material meets NEMA G-11 and MIL-I-24768/3, Type GEB.

NP643 is constructed from an electrical grade kraft paper and a high temperature specially modified epoxy resin system. It is designed to be used in tap changers, coil support plates and terminal panels for transformers and their accessories.

EC-1850FT is a pourable filled epoxy resin system offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. It is a lower viscosity version of EC-1850FT. It rapidly transfers heat, eliminates hot spot, and increases the operating efficiency of most encapsulated devices. Its low shrinkage minimizes risk of damage to fragile components.

RS-2272 is a patented, castable, lead free insulating grade filled epoxy resin specifically designed for high voltage insulator applications requiring X-Ray shielding. This material provides good electrical grade insulation properties, high mechanical properties, and superior arc resistance to any lead oxide filled epoxy. This material is non-flammable and meets UL94V-0.

EPOXIBOND™ EB-119SP is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.

EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.

RS-2279 is a castable, filled epoxy resin specifically designed to operate under high voltage conditions in outdoor applications, as well as SF6 environments. This material provides excellent electrical grade insulation properties, high mechanical properties, and superior resistance to chemicals including concentrated acids and mild alkalines.

FLASHBOND™ UV-5608DC is an innovative light cure epoxy adhesive. It has unique features that allow for fast processing and fixturing of parts. Once the adhesive has been activated with UV light, it has set open time that allows for assembly of parts. The product continues to cure at room temperature or rapidly cures when exposed to low temperature heat. The cured product exhibits low shrinkage and excellent thermal, water and chemical resistance. Typical applications include bonding of optics, connectors, fibers, lenses, prisms and other electronic components where low shrinkage and low outgassing are required.

RS-2242 is a castable, filled epoxy resin specifically designed for high voltage insulator applications. This material provides excellent electrical grade insulation properties, high mechanical properties, and superior resistance to chemicals including concentrated acids and mild alkalines. This material has superior arc resistance as compared to standard electrical grade epoxy materials. In addition, this material is non-flammable and meets UL 94/V-0 requirements.

EPOXIBOND™ EB-177 is a low viscosity, high Tg, two part epoxy that can be used for potting, encapsulating, or bonding. It is used highly in the medical, optical, and semiconductor industries.EB-177 has excellent high temperature resistance at 300°C and excellent solvent, chemical, and moisture resistance including gamma rays, autoclave, and ETO. It is an excellent choice for semiconductor applications including capillary under fill or flipchip die attach.

RS2240 is a castable, filled epoxy resin specifically designed for high voltage insulator applications. This material provides excellent electrical grade insulation properties, high mechanical properties, and superior resistance to chemicals including concentrated acids, and mild alkalines. This material also offers superior arc resistance as compared to standard electrical grade epoxy materials. In addition, this material is non-flammable and meets UL94V-0 requirements.

FLASHBOND™ UV-3607HTis a 1-component, UV/Thermal cure adhesive & sealant. This material can cure under moderate intensity UV light as well as elevated temperatures for shadowed areas. Its low viscosity is ideal for coating, capillary action, and doming applications. Unlike traditional dual cure epoxy systems which need light + heat, UV-3607HT can cure either with UV/LED light or with heat.

EPOXIBOND™ EB-107LP-2 is a two component - optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.

LEECAST 38-191 is a proprietary two-part epoxy adhesive and encapsulating compound. It has been used extensively for potting lead wires in UL-listed commercial gasoline pumps. LEECAST 38-191 has exceptional chemical resistance, especially in respect to gasoline, various gasoline alcohol additives, and other aggressive organic solvents. It also features fast room temperature cure and excellent adhesion to a variety of wire coatings and other substrates. It is formulated with enough thixotropy to inhibit sag on vertical surfaces and self-leveling when applied in a bead on horizontal surfaces.

RS-2243 is a castable, filled epoxy resin specifically designed for high temperature, high voltage insulator applications. This material provides excellent electrical grade insulation properties, high mechanical properties, and superior resistance to chemicals including concentrated acids and mild alkalines. This material has superior arc resistance as compared to standard electrical grade epoxy materials. In addition, this material is non-flammable and meets UL94V-0 requirements.

RS-2320 is a castable, filled epoxy resin with good overall general properties and enhanced impact strength over other highly filled epoxy materials. This material provides excellent electrical grade insulation properties, high mechanical properties, and low thermal expansion. This material is self extinguishing.

LEEBOND 37-75 is a proprietary two-part epoxy adhesive used in both electrical-grade potting and structural adhesive applications. Cured systems demonstrate excellent toughness, impact resistance and exceptional bond strength for hard to bond to substrates. This system can be cured at both room temperature or accelerated with modest heating.