Cosmic Epoxy E484-FDA

Cosmic Epoxy E484-FDA is a mineral-filled, glass-reinforced, electrical-grade epoxy molding compound supplied in granular form. It has received approval for direct food contact. Notably, it possesses outstanding mechanical strength and electrical properties, especially at high temperatures, and has met the rigorous NASA outgassing standards. This material is used in electrical hardware applications such as underwater connectors and other insulation needs.

Brand: Cosmic Epoxy (25 products)

Polymer Name: Epoxy Resins & Compounds

End Uses: Connectors, Electrical Insulation

Volume Resistivity: 100,000,000.0 Ohm-m

Flexural Strength: 130.91 MPa

Technical Data SheetSafety Data Sheet

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Knowde-enriched technical product data sheet

Identification & Functionality

Chemical Family
Fillers Included
Polymer Name
Plastics & Elastomers Functions
Technologies
Product Families

Features & Benefits

Materials Features
Key Features

It has excellent mechanical strength and electrical properties, especially at high temperatures. It has passed NASA out-gassing tests.

Applications & Uses

Markets
Applications
Plastics & Elastomers End Uses
Product Applications

Used in electrical hardware applications such as underwater connectors and other insulation applications.

Properties

Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength19000psi-
Flexural Modulus2.6 x 10⁶psi-
Compressive Strength30000psi-
Tensile Strength14000psi-
Impact Strength (Izod Notched)0.6ft-lb / inch-
Barcol Hardness65 - 75--
Thermal Properties
ValueUnitsTest Method / Conditions
Heat Deflection Temperature260°C-
Glass Transition Temperature (Tg)165°C-
Thermal Conductivity10 x 10⁻⁴cal/sec/cm²/°C/cm-
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance186seconds-
Volume Resistancemin. 10¹⁰Ohm - cm-
Surface Resistancemin. 1 x 10¹⁵Ohm - cm-
Dielectric Strength (Kv Step-by-Step, Wet)350volts/mil-
Dielectric Breakdown (Step-by-Step, Wet)60Kv-
Dielectric Constant (at 1 KHz, Wet)5.4--
Dissipation Factor (at 1KHz, Wet)0.011--
Dielectric Constant (at 1 MHz, Wet)4.7--
Dissipation Factor (at 1MHz, Wet)0.008--
Moisture Properties
ValueUnitsTest Method / Conditions
Water Absorption (at 50 °C,48 hours)0.25%-
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Specific Gravity1.95--
Bulk Factor2.0 - 5.0--
Molding Pressure500 - 8,000psi-
Molding Temperature150 - 180°C-
Mold Shrinkage0.002 - 0.004In / In-

Regulatory & Compliance

Certifications & Compliance