Leebond 37-75

Enhanced TDS

Chemical Family: Epoxy & Epoxy Derivatives
Product Type: 2K (2 component) Adhesive,
Encapsulant,
Epoxy Adhesive,
Potting Compound,
Structural Adhesive
CAS No.: 25068-38-6
Technologies: Ready-to-Use Products
Product Families: Ready-to-Use Products — Adhesives & Sealants
Encapsulants,
Structural Adhesives

Ready-to-Use Product Features: Good Adhesion,
Good Toughness,
High Impact Resistance

Markets: Adhesives & Sealants,
Consumer Goods,
Electrical & Electronics
Applications: Consumer Goods — Appliances & Electronics
Adhesives & Sealants — Other Adhesives & Sealants Applications
Electrical & Electronics — Packaging & Assembly
Adhesives & Sealants,
Potting Compounds
Electrical & Electronics — Wire & Cable
Other Wire & Cable Applications
Cure Method: Heat Cure
Directions for Use: Parts to be bonded should be clean and free of all greases and oils. All surfaces to be bonded should also be dry. The adhesive can be applied using any of the conventional manual or
automated mechanical methods. The gel time of LEEBOND 37-75 depends on temperature and mass of material. Large masses and/or elevated temperatures will shorten the gel time. Cure can be accomplished at room temperature or with heat if faster cures are desired. Typical cure schedules for smallmasses are:
50oC 1 – 2 hours
65oC 40 – 60 minutes
Longer cure schedules may be needed when curing thin sections or where the epoxy is adjacent to a mass of material that will act as a heat sink.

Appearance

Amber liquid, Red liquid

Typical Properties

Handling Properties

Storage & Handling: Some individuals may be sensitive to epoxy compounds. Care should be taken to minimize contact. If skin contact occurs wash with soap and water. If eye contact occurs, flush with
copious quantities of water. Keep containers closed when not in use to prevent contamination. Minimize exposure to Part B to air and moisture
Shelf life: 12 months