Products in Packaging & Assembly: Good Thermal Stability

RTU Foam C is a two-part, room-temperature, platinum-cure, self-blowing silicone foam designed for liquid dispensing. This product is ideal for potting in applications where lightweight and thermal protection are required. Its viscosity profile enables excellent flow around components, and it is excellent for potting complex parts. The chemical composition results in a cured product that is hydrolytically stable as well as reversion-resistant. The cured product provides electrical insulation and physical shock resistance for components and enables environmental protection.

ELASTOSIL® N288 is a low-viscosity, ready-to-use, neutral crosslinking silicone rubber. It cures at room temperature under the influence of atmospheric moisture. It exhibits excellent heat stability, excellent primerless adhesion to many substrates, permanent temperature exposure up to 200 °C, and peak temperatures up to 250°C.

ELASTOSIL® RT 602 A/B is a pourable, addition-curing RTV-2 silicone rubber with a two-part formulation and a 9:1 mixing ratio. It has low viscosity and offers rapid heat cure. The cured rubber exhibits a medium hardness and excellent heat stability. This product is suitable as a general purpose encapsulant.

ELASTOSIL® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber with a two-part formulation and a 1:1 mixing ratio. It features a very high hardness (Shore A) and excellent heat stability. This silicone rubber is particularly known for its high thermal conductivity, making it ideal for the encapsulation of electronic components.

ELASTOSIL® E70 is a flowable, one-component, acetoxy-cure silicone rubber that cures at room temperature under the influence of atmospheric moisture. It shows excellent primerless adhesion to many substrates and outstanding heat stability even in long-term exposure. It is a high-temperature-resistant grade for sealing and bonding applications under high thermal stress.

ELASTOSIL® RT 607 A/B is a pourable, addition-curing RTV-2 silicone rubber with a two-part formulation and a 9:1 mixing ratio. It has low viscosity and offers rapid heat cure. The cured rubber exhibits high hardness and excellent heat stability. Additionally, it is flame retardant, making it suitable for general purpose encapsulation. This product can also be used as a potting material for electrical coils of lifting magnets and for slot exit potting of electrical coils.

CHT Group SilSo Clear 21002 is a transparent and colorless silicone formulation that is ideal for optical injection molding applications. Its viscosity profile enables excellent flow around components, and it is excellent for potting complex parts. The chemical composition results in a cured product that is hydrolytically stable as well as reversion-resistant. The silicone elastomer provides electrical insulation and physical shock resistance for components and enables environmental protection.

CHT Group SilSo Lite 21025 is a two-part, room-temperature, platinum-cure, self-blowing silicone foam designed for liquid dispensing. This product is ideal for potting in applications where lightweight and thermal protection are required. Its viscosity profile enables excellent flow around components, and it is excellent for potting complex parts. The chemical composition results in a cured product that is hydrolytically stable as well as reversion-resistant. The cured product provides electrical insulation and physical shock resistance for components and enables environmental protection.

CHT Group QSil 58 is a high-temperature, self-leveling, two-component silicone material that is primarily used for potting applications. The two applicable catalysts are 0.5% DBT by weight and 10% deep-section catalyst by weight. The 0.5% catalyst level can be increased or decreased to obtain the desired cure speed. Cure speed can be accelerated by adding DBT catalyst in 0.1% increments. This can be catalyzed with a 10% deep-section catalyst for applications requiring a deeper cure. The material can also be vulcanized at temperatures up to 70°C to increase cure speed.

127-31 is an extremely flexible one-component, syringe dispensable, 100% solids, thermally conductive, electrically insulating soft epoxy adhesive, encapsulant, and potting compound. This system features excellent thermal stability, chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 127-31 features a low durometer and is highly flexible allowing it to absorb stress when bonding mismatched CTE substrates. 127-31 even displays some elastomeric properties. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding.Features Elastomeric Flexible thermally conductive adhesive/potting compound

SC-550-LV-TC-1 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-1 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

SC-550-LV-TC-2 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-2 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

SC-550-LV-RT is a 100% silicone solid elastomer designed for electronic potting applications. This two-component, room temperature curing system offers a hard, self-bonding, thermally conductive, low modulus material that is readily re-workable.

CGSTAPE - 8458 is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

CGSTAPE - 8257S is a polyimide backing and silicone adhesive offers ex- cellent chemical and thermal resistance with excellent electrical insulating properties.

CGSTAPE - 8558 is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

STG-51TC Heat Sink Compound is silicone thermal grease material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. STG-51TC specially developed to solve the problems of contamination and migration associated with silicone-based products. The compound is a unique synthetic-based thermal grease use to insure quick, efficient heat transfer and dissipation

125-50 is an opaque white, screen printable, one component, epoxy, solder mask. This product features excellent adhesion to Kapton, Mylar, aluminum, FR-4 boards, glass and a variety of other substrates. Unlike conventional dielectric materials, this product is very resistant to abrasion, scratching, and thermal aging. Applications for 125-50 include, but are not limited to, solder resistant coatings for electrical and electronic devices.Features Opaque White epoxy dielectric, adheres to ITO.

CGSTAPE - 8258K is a Kapton® HN backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

904-64-4 is a two component, thermally conductive, high performance room temperature addition curing silicone.

127-03-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 127-03-F include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and high temperature properties and is able to absorb stress when bonding mismatched CTE substrates. This product has been formulated to have improved handling in the B-staged form and is available in thicknesses from 1 to 5 milsFeatures Excellent Thermal Conductivity. Easy Liner Release. Excellent Chemical Resistance. Minimal Flow During Cure. Low CTE. Excellent High Temperature Performance.

CGSTAPE - 8358HT is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

CGSTAPE - 8468 is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

CGSTAPE - 8458K is a Kapton® HN backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

CGSTAPE - 8459 is a polyimide backing and acrylic adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat are required.

ME7857-SC is a medium viscosity, silicon carbide filled, flexible epoxy for snap curing application. It is a reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility down to -60°C. Ideal for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible adhesive maintains good stable bond strength of 100 psi from 150-250°C and has outstanding thermal stability.

Tack-Free ESP 7455 is an alumina-filled, epoxy film adhesive designed for bonding component and substrate to a mismatched substrate or carrier. The dry, tack-free handling of the film makes it suitable for an automated assembly. The adhesive film has very low ionic impurities of less than 10 ppm and high thermal stability with TGA degradation at 450°C. ESP7455 has good thermal conductivity. The extra low Tg of -60°C helps to minimize thermal stress on the bonded parts during thermal cycling or shock testing from -55 to 150°C.

CGSTAPE - 8358 is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

114-26 B is a medical grade, electrically conductive, polymer coated polyester film composition. It is typically used as a component for fabricating electrodes in medical testing applications. This product has been formulated to have improved conductivity and high electrical dissipation properties. Some added applications for 114-26 B include, but are not limited to, emi/rfi shielding, polymer thick film circuitry, membrane switches and electrical static dissipation. 114-26 B is available in rolls ranging in widths up to 20 inches and lengths up to 2000 feet.

CGSTAPE - 8158 is a polyimide backing and acrylic adhesive offers excellent chemical and thermal resistance with excellent electrical insulating properties. This tape is used where toughness and puncture resistance are required.

FLASHBOND™ UV-5402 is a low viscosity, flexible, light curing epoxy adhesive that offers excellent strenth and flexibility for reduced cracking. UV-5402 is low viscosity and high elongation. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400-415nm) and can also cure down to 365nm.

102-32G1 is a flexible electrically conductive silicone adhesive. 102-32G1 features the highest degree of thermal and mechanical reliability over any other conductive adhesive technology and provides no failures during thermal cycling, heat aging, shocking or vibration due to the reliability from the elasticity of theproduct. Some applications for 102-32G1 include, but are not limited to, elastomeric conductive bridging and bonding, conductive bonding of low surface energy materials, conductive via filling and electrical attachments for stress sensitive devices. 102-32G1 is one of the few conductive adhesives that can bond to silicone substrates and surfaces. In addition, it can be bonded to some types of Teflon® surfaces. 102-32G1 features better conductivity than 102-32 when cured at lower temperatures