Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
Applications & Uses
Properties
- Typical Properties
Value Units Test Method / Conditions Electrical Resistivity min. 2X10¹⁴ Ω-cm - Viscosity (at 5 rpm, Thixotropic Index=2.5) 60000 cPs - Glass Transition Temperature 175 °C - Device Push Off Strength min. 4000 psi - Hardness approx. 90 Shore D - Cured Density (for Conductive Adhesive Portion) 2.5 g/cc - Thermal Conductivity min. 1.8 W/m-°K - Coefficient of Thermal Expansion (X-Y=Z, Isotropic) 19 ppm/°C - Maximum Continuous Operation Temperature min. 200 °C - Decomposition Temperature (at 5% Weight Loss) min. 450 °C - Recommended Curing Temperature (for 120minutes) min. 125 °C -
Regulatory & Compliance
- Certifications & Compliance