AI Technology MC 7685-GTS

Product Type: Encapsulant, Potting Compound

Cure Method: Chemical Cure

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Features & Benefits

Applications & Uses

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivitymin. 2X10¹⁴Ω-cm-
Viscosity (at 5 rpm, Thixotropic Index=2.5)60000cPs-
Glass Transition Temperature175°C-
Device Push Off Strengthmin. 4000psi-
Hardnessapprox. 90Shore D-
Cured Density (for Conductive Adhesive Portion)2.5g/cc-
Thermal Conductivitymin. 1.8W/m-°K-
Coefficient of Thermal Expansion (X-Y=Z, Isotropic)19ppm/°C-
Maximum Continuous Operation Temperaturemin. 200°C-
Decomposition Temperature (at 5% Weight Loss)min. 450°C-
Recommended Curing Temperature (for 120minutes)min. 125°C-

Regulatory & Compliance

Certifications & Compliance