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Creative Materials 127-03-F

127-03-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 127-03-F include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and high temperature properties and is able to absorb stress when bonding mismatched CTE substrates. This product has been formulated to have improved handling in the B-staged form and is available in thicknesses from 1 to 5 mils

Features

  • Excellent Thermal Conductivity.
  • Easy Liner Release.
  • Excellent Chemical Resistance.
  • Minimal Flow During Cure.
  • Low CTE.
  • Excellent High Temperature Performance.

Product Type: Conductive Adhesive, Epoxy Adhesive

Application Area: Electrical Components, Heat Sink, LEDs, Printed Circuit Boards, Semiconductors

Chemical Family: Epoxy & Epoxy Derivatives

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Chemical Family
Epoxy & Epoxy Derivatives
Product Type
Conductive Adhesive,
Epoxy Adhesive
Technologies
Ready-to-Use Products
Product Families
Ready-to-Use Products — Adhesives & Sealants
Conductive Adhesives

Features & Benefits

Ready-to-Use Product Features
Chemical Resistant,
Ease of Handling,
Good Thermal Stability,
High Temperature Performance,
Low Thermal Expansion,
Thermally Conductive

Applications & Uses

Markets
Consumer Goods,
Electrical & Electronics,
Industrial
Applications
Consumer Goods — Appliances & Electronics
Industrial — Chemical & Industrial Manufacturing
Equipment & Parts
Electrical & Electronics — Devices & Assemblies
Consumer Electronics,
Displays
Electrical & Electronics — Packaging & Assembly
Adhesives & Sealants
Electrical & Electronics — Parts & Components
Printed Circuit Boards (PCBs),
Semiconductor Manufacturing
Application Area
Electrical Components,
Heat Sink,
LEDs,
Printed Circuit Boards,
Semiconductors

Properties

Typical Cured Properties
ValueUnitsTest Method / Conditions
Volume Resistivity1x10^16Q-cm-
Dielectric Constant (1 KHz)4.1--
Dielectric Constant (1 MHz)3.9--
Dissipation Factor (1 KHz)0.027--
Dissipation Factor (1 MHz)0.038--
Thermal Conductivity4.3W/mK-
Operating Temperature-55 to 230°C-
Peak Temperature325°C-
Glass Transition Temperature (Tg)1.15°C-
Coefficient of Thermal Expansion below Tg50 x 10^-6In/in/°C-
Coefficient of Thermal Expansion above Tg60 x 10^-6In/in/°C-
T-Shear Strengthmin. 2000psi-
Peel Strength (Copper to copper at 90°)9Pli-

Regulatory & Compliance

Certifications & Compliance
ISO 9001

Technical Details & Test Data

General Film Description

Substrate Type: PET Release Liner
Conductive Coating Type: Aluminum Nitride/Polymer

Product Code

Adhesive Thickness (mils)
127-03-F1 1
127-03-F2 2
127-03-F3 3
127-03-F4 4
127-03-F5 5

Storage & Handling

Shelf Life
1 month at 25°C, 3 months at -10°C
Curing Guidelines

These temperatures and times are presented as a guide only. The end-user is encouraged to experiment to determine optimum curing schedule. 

Temperature (°C) Time (min.)
160 60
175 30
200 15
Handling

This product is shipped frozen and should be stored frozen to optimize shelf life. Care should be taken in handling frozen/cold sheets, they are more likely to crack at this point (avoid flexing film if stored at -40°C). Allow material to warm to room temperature before handling.

Shelf Life

1 month at 25°C or 3 months at -10°C.