Search
the marketplace
through 230,000 Chemicals and Raw Ingredients
through 8,000+ Supplier owned storefronts

Creative Materials 127-31

127-31 is an extremely flexible one-component, syringe dispensable, 100% solids, thermally conductive, electrically insulating soft epoxy adhesive, encapsulant, and potting compound. This system features excellent thermal stability, chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 127-31 features a low durometer and is highly flexible allowing it to absorb stress when bonding mismatched CTE substrates. 127-31 even displays some elastomeric properties. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding.

Features

  • Elastomeric
  • Flexible thermally conductive adhesive/potting compound

Product Type: 1K (1 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Potting Compound, Solvent free (100% Solids) Adhesive

Application Method: Injection

Chemical Family: Epoxy & Epoxy Derivatives

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Chemical Family
Epoxy & Epoxy Derivatives
Product Type
1K (1 component) Adhesive,
Conductive Adhesive,
Epoxy Adhesive,
Potting Compound,
Solvent free (100% Solids) Adhesive
Technologies
Ready-to-Use Products
Product Families
Ready-to-Use Products — Adhesives & Sealants
Conductive Adhesives

Features & Benefits

Ready-to-Use Product Features
Chemical Resistant,
Electrically Insulating,
Flexible,
Good Thermal Stability,
High Temperature Performance,
Low Modulus,
Thermally Conductive

Applications & Uses

Markets
Electrical & Electronics
Applications
Electrical & Electronics — Packaging & Assembly
Potting Compounds
Electrical & Electronics — Parts & Components
Printed Circuit Boards (PCBs)
Application Method
Injection
Application Method
  • Syringe dispense

Properties

Physical Form
Liquid
Typical Properties
ValueUnitsTest Method / Conditions
Pot LifeLatent--
Conductivity3W/mK-
Typical Cured Properties
ValueUnitsTest Method / Conditions
FillerAluminum Nitride--
Percent Fillermin. 60--
Volume Resistivitymax. 1X 10^16Q-cm-
Dielectric Constant (1KHz)4.1--
Dielectric Constant (1MHz)3.9--
Dissipation Factor (1KHz)0.027--
Dissipation Factor (1MHz)0.038--
Useful Temperature Range-55 to 230ºC-
Thermal StabilityGood to 325°C-
Thermal Conductivity3W/m-K-
Hardness (100°C cure)max. 40AShore A-
Hardness (175°C post cure)max. 60AShore A-

Safety & Health

Safety & Handling
  • Use with adequate ventilation.
  • Keep away from sparks and open flames.
  • Avoid prolonged contact with skin and breathing of vapors.
  • Wash with soap and water to remove from skin.

Storage & Handling

Shelf Life
6 months at -10°C, max. 4 days at 25°C
Suggested Handling & Curing

If frozen remove product from freezer and allow material to warm to room temperature before opening container. Best results are obtained when curing at one of the following schedules:

100°C 1 hour
125°C 30 min