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AI Technology ESP 7455

Tack-Free ESP 7455 is an alumina-filled, epoxy film adhesive designed for bonding component and substrate to a mismatched substrate or carrier. The dry, tack-free handling of the film makes it suitable for an automated assembly. The adhesive film has very low ionic impurities of less than 10 ppm and high thermal stability with TGA degradation at 450°C. ESP7455 has good thermal conductivity. The extra low Tg of -60°C helps to minimize thermal stress on the bonded parts during thermal cycling or shock testing from -55 to 150°C.

Product Type: Epoxy Adhesive, Insulation Adhesive, Thermal Adhesive

Application Area: Die/Chip Attach, Heat Sink

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Chemical Family
Epoxy & Epoxy Derivatives
Product Type
Epoxy Adhesive,
Insulation Adhesive,
Thermal Adhesive
Technologies
Ready-to-Use Products
Product Families
Ready-to-Use Products — Adhesives & Sealants
Other Adhesives & Sealants

Features & Benefits

Ready-to-Use Product Features
Electrically Insulating,
Good Thermal Stability,
High Reliability,
High Temperature Performance,
High Temperature Strength,
Low Glass Transition Temperature,
Low Ionic Impurities,
Low Moisture Absorption,
Low Stress,
Tack-free,
Thermally Conductive
Product Features
  • Flexible epoxy film adhesive.
  • "2nd generation".
  • Thermally conductive.
  • Outstanding thermal stability.
  • Meets 883/5011 spec.
  • Heatsink attach.
  • Substrate attach.
  • Die & component attach.
  • In-line direct bonding.
  • Large area & mismatched CTE bonding.

Applications & Uses

Markets
Consumer Goods,
Electrical & Electronics,
Industrial
Applications
Consumer Goods — Appliances & Electronics
Industrial — Chemical & Industrial Manufacturing
Equipment & Parts
Electrical & Electronics — Packaging & Assembly
Adhesives & Sealants
Electrical & Electronics — Parts & Components
Semiconductor Manufacturing
Application Area
Die/Chip Attach,
Heat Sink
Application Procedures
  • Keep at room temperature for 15 minutes before using.
  • Before using, remove protective liner from film.
  • Cut to desired size.
  • Place on substrate and cure according to one of the recommended schedules.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Dielectric Strengthmin. 750Volts/mil-
Glass Transition Temperature-60°C-
Glass Transition Temperature-45°C-
Lap Shear Strength3.5N/mm²-
Device Push Off Strength10.3N/mm²-
Hardness82Shore A-
Cured Density2.3g/cc-
Thermal Conductivity1.71W/m-°C-
Coefficeint of Linear Thermal Expansion110ppm/°C-
Maximum Continuous Operation Temperature150°C-
Electrical Resistivitymin. 1x10¹⁴Ω-cm-
Die Shear Strengthmin. 1500psi-

Regulatory & Compliance

Certifications & Compliance
ISO 9001

Technical Details & Test Data

Cure Schedules
Temperature Time Pressure
100°C 4 hrs 5-10 psi
125°C 2 hrs 5-10 psi
150°C 1 hr 5-10 psi

The die or component can also be tacked on the substrate at 125°C or higher with 5-10 psi. When a filet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle.

Packaging & Availability

Product Availability

ESP7455 is available in sheet sizes or as custom preforms. Standard thicknesses are 0.003" and 0.006". Special thicknesses are available. The film is self supporting without the need of fiberglass mesh reinforcement.

Storage & Handling

Shelf Life
1 Year (at 0-5°C)
Storage Information

Storage temperature: 0- 5°C in sealed package.