Inks & Pastes

In answer to a demand in the printing market for faster and higher productivity Sterling Color has developed the 390G range of fluorescent offset inks. The 390G Series inks offer high color strength, minimal waste through rapid color achievement, excellent dot reproduction, stable printing, good drying and excellent rub resistance. Printing and finishing has to be fast, trouble-free and reliable. From an environmental concern 390G Series inks are vegetable oil based and do not use mineral oils.

WACKER® Silicone Paste P 12 is a pure white, soft-consistency heat sink paste with marked thermal conductivity. It is electrically insulating. WACKER® PASTE P 12 is used especially in semiconductor technology as a heat sink paste. When there is a need for good heat transfer from a semiconductor to a cooling element, applying a thin coating of WACKER® PASTE P 12 is advisable. In the assembly of semiconductors such as diodes, transistors, and thyristors, microscopic irregularities may exist on the mating surfaces of the semiconductor and the cooling surface. These surface irregularities can hinder firm metal-to-metal contact when assembled.

SEMICOSIL® 9672 TC is a thermally conductive gap filler silicone material designed for heat sink applications in the electronics industry. It is a shear-thinning, non-slump, two-part silicone gel that cures at room temperature to a soft gel with excellent thermal conductivity.

SEMICOSIL® 962 TC A/B is a gap filler paste material with excellent thermal conductivity. It is a two-part silicone rubber that is shear-thinning, easy to dispense, and non-slump. This addition-curing formulation cures at room temperature, resulting in a soft, flexible, and tacky rubber with outstanding thermal conductivity properties.

SEMICOSIL® 9671 TC2 A/B is a thermal conductive gap filler silicone material used in heat sink applications for the electronics industry. It is a shear-thinning, easy-dispensing, non-slump, addition-curing, two-part silicone rubber that cures at room temperature. This material is specifically designed to enhance heat dissipation and provide efficient thermal management in electronic devices. SEMICOSIL® 9671 TC2 A/B is ideal for filling gaps and ensuring effective heat transfer in heat sink applications.

SEMICOSIL® 961 TC A/B is a shear-thinning, easy-dispensing, non-slump, two-part silicone rubber that cures at room temperature. It transforms into a soft and tacky rubber with excellent thermal conductivity. Specifically designed as an interface material, SEMICOSIL® 961 TC A/B is ideal for heat sink applications in the electronics industry.

SEMICOSIL® 9981 TC is a one-part, thermally conductive paste with electrical conductivity that cures into a gap-filling silicone. The thermal paste efficiently fills the finest gaps of heat-generating and ablating substrates, minimizing contact resistance. The thermal resistance is minimized due to an exceptional thermal conductivity of 10 W/mK, in combination with the possibility of reducing bond line thickness to 10 μm.

110-03 is a silver-based electrically conductive ink and coating suitable for application by flexographic and rotogravure printing methods. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 110-03 include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments and static elimination.Features Solvent based conductive ink

127-48D is a matte finish, flexible, electrically insulating ink and coating suitable for application by screen printing, dipping, and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, polycarbonate, glass, and a variety of other surfaces. Unlike conventional insulating materials, this product is very resistant to flexing and creasing. Some applications for 127-48D include, but are not limited to, insulating polyimide flexible circuits, polymer thick film circuitry, and membrane switches. 127-48D is a thermosetting version of 124- 18T.Features Solvent resistant washable dielectric ink ideal for fabrics