jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

DYTEK® DCH-99 (1,2-diamainecyclohexane) is a cyclic aliphatic diamine made of 100% reclaimed material that is used primarily in epoxy coatings and composites. It provides chemical resistance over a broad range of chemicals, which makes it a superior choice for industrial and marine coatings. Other applications include mining, oil & gas, and pharmaceutical intermediates.

WARADUR® E is an ester wax consisting of esters of montanic acids with multihydroxyl alcohols. Montanic acids are straight-chained monocarboxylic acids with a chain length in the range of C28 – C32. The corresponding esters exhibit chain length in the range of C58 – C66 and provide this wax with a low volatility, good thermostability and low migration rates.

Epoxy functional silane used used to improve dry and wet strength in cured composites reinforced with glass fiber rovings. Silanes are used in a variety of industrial applications. Organofunctional Silanes have an organic functional end group and an alkoxy functional end group which allow the silane to act as a bridge between organic materials and inorganic substrates. The organic functional group is matched to the resin system while the alkoxy group provides the reactive site for crosslinking. These materials are useful as adhesion promoters, crosslinking agents, surface modifiers and hydrophobizing agents.

Divinycell F50 foam is a recyclable, prepreg compatible sandwich core offering excellent Fire, Smoke and Toxicity (FST) properties, good mechanicals and processing characteristics. It meets the US and European regulatory requirements for commercial aircraft interiors. Other key features include vacuum bag processing up to 220°C and matched tooling and press processing up to 220°C, exceptional fatigue life, good chemical resistance and excellent heat aging at 180°C. Divinycell F50 is compatible with most common aerospace composite manufacturing processes.

Divinycell PY is Diab’s newest addition to the PET family. All our PET materials are recyclable and are excellent thermoplastic sandwich core materials. The material is suitable for a variety of processes including infusion, prepreg and press bonding. Divinycell PY provides high shear strain and a very low resin consumption. The core material has been desgned and developed to meet blade designs in an optimal manner.

Divinycell H provides excellent mechanical properties to low weight. The unique IPN chemical structure, yields impressive mechanical performance to a low weight. Divinycell H has been widely used and has a proven track record in virtually every application area where sandwich composites are employed including the marine (leisure, military and commercial), land transportation, wind energy, civil engineering/infrastructure and general industrial markets. Divinycell H is ideal for applications subject to fatigue, slamming or impact loads. Other key features of Divinycell H include consistent high quality, excellent adhesion/peel strength, excellent chemical resistance, low water absorption and good thermal/acoustic insulation. Divinycell H is compatible with virtually all commonly used resin and manufacturing systems.

Divinycell HCP grade meets the demand for a high performance, low density buoyancy material with excellent characteristics. It is widely used in submarines, subsea buoyancy units, ROVs, diving bells and impact protection structures. As a result of its excellent hydraulic compressive properties and closed cell structure, it has very low buoyancy loss and water absorption under long-term loading conditions. HCP stands for Hydraulic Crush Point and is defined as the point of pressure in Bar, where the material when subjected to an increasing pressure of 1-2 Bar/sec has lost 5% of its initial volume. The design of subsea buoyancy applications is complex and consideration has to be given to the required buoyancy loss and updrift over the expected lifetime and service conditions, with respect to long and short term hydraulic compressive creep, water absorption and hydraulic fatigue. Please contact Diab Technical Services for design proposal.

WR® 525 is a thermoplastics composite consisting of carbon fiber in a PEEK™ matrix. WR provides excellent chemical resistance, non-galling and nonseizing properties, impact resistance and thermal shock and hydrolysis resistance.WR 525 allows the pump user to increase pump efficiency by running tighter wear rings clearances while decreasing potential pump damage when pumos are cavitated or experience down-line bearing failures.

Utility version of NP320E. Meets most, but not all, NEMA properties for L and LE, and is not certifiable as a NEMA Grade.

MC511SN, StatNot™, is a static dissipative epoxy, woven glass based material with excellent control of the static dissipative properties. This material is used where static dissipation is required from surfaces to surface of the composite, in the x, y and z directions.

NP500CR (commonly referred to as G10 CR) consists of a glass fabric with an epoxy resin system resulting in excellent electrical characteristics and superior physical properties at cryogenic temperatures (-270 °C to 135 °C operating temperature range). Previously designated as Westinghouse/International Paper Micarta Cryogenic Grade 56 G12, it has low thermal conductivity and utilizes chemistry specifically designed for cryogenic applications.