Products in Packaging & Assembly: Low Shrinkage

CHT Group QSil 214 is a transparent and colorless silicone formulation that is ideal for optical applications. Its viscosity profile enables excellent flow around components, and it is excellent for potting complex parts. The chemical composition results in a cured product that is hydrolytically stable as well as reversion-resistant. The silicone elastomer provides electrical insulation and physical shock resistance for components and enables environmental protection.

CHT Group QSil 223 is a transparent and colorless silicone formulation that is ideal for optical applications. Its viscosity profile enables excellent flow around components, and it is excellent for potting complex parts. The chemical composition results in a cured product that is hydrolytically stable as well as reversion-resistant. The silicone elastomer provides electrical insulation and physical shock resistance for components and enables environmental protection.

CHT Group QSil 220 is a transparent and colorless silicone formulation that is ideal for optical applications. Its viscosity profile enables excellent flow around components, and it is excellent for potting complex parts. The chemical composition results in a cured product that is hydrolytically stable as well as reversion-resistant. The silicone elastomer provides electrical insulation and physical shock resistance for components and enables environmental protection.

EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals.

EC-1850FT with EH-10E Hardener is a very low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EC-1012MFR-HT is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EB-430-1HT is a highly versatile epoxy adhesive formulated for semiconductor industry. An easy to dispense liquid paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is designed for protecting IC's in TAB, as well as glob-top encapsulant for COB placement. Other applications include fabricating heat sinks, bonding semiconductors and transistors to heat sinks and general-purpose bonding of electronic components.

EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.

EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EC-1015 is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EC-1012M/EH-20M is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

108-50MG is a one component, thermally conductive, low stress, low shrink potting compound and adhesive. 108-50MG features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring Class "F" service temperature rating. 108-50MG can also be used as an adhesive for bonding stress sensitive substrates when low ionics or low hydrolyzable chloride is required. 108- 50MG is a microelectronics grade version of 108-50.Features Microelectronics grade Low stress Moderate thermally conductive adhesive/potting compound

The 811-64 System is a two component, high performance, room temperature curing, highly filled potting / encapsulating compound. 811-64 is the carbon filled version of 812-48.FeaturesTwo component, high performance, exhibits exceptional wetting and void free during pouring, with low shrinkage.

109-12 is a one component, highly thermally conductive, low stress, low shrink potting compound and adhesive. 109-12 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring class "F+" service temperature rating. 109-12 is a more thermally conductive version of 108-50.Features Low stress High thermally conductive adhesive/potting compound

904-64 is a two-component, thermally conductive, red, high performance room temperature addition curing siliconeFeaturesTwo component, easy air release and low shrinkage addition cured silicone potting compound

High Thermal Conductivity Epoxy, Encapsulating & Potting Compound 834HTC is a 2-part, black, rigid, flameretardant thermal epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This epoxy resin is designed for applications where thermal management and selfextinguishing are critical. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

BD5460 is a two-part, epoxy hybrid room temperature cure adhesive designed industrial bonding, small potting and laminating where excellent strength and toughness, structural bonding, and mechanical and electrical properties are required. This 2-part adhesive cures at room temperature, exhibits good wetting, and develops high strength, low shrink bonds to most materials including fiberglass, ceramics, metals and many plastics. It has great dimensional stability over a wide range of temperatures. Fully cured bd5420 is a durable electrical insulator with resistance to water, weather, ozone and oxygen, various solvents, fuels, oils, alcohols, mild acids and alkalis and many other organic compounds including diesel fuel and gasoline. It is especially formulated for a 2:1 mix ratio for use in side by side cartridges, or to be used by hand mixing, or use with meter mix equipment. A handling cure is normally achieved at room temperature within 120 minutes with a full cure at room temperature within 24 hours. To accelerate the final cure, or to quicken the handling simply elevate the temperature.

9200 is a toughened, 2-part epoxy adhesive, designed to create long-lasting load-bearing joints. It creates tough vibration-resistant bonds and is especially useful for joining dissimilar materials that will experience thermal cycling stresses or harsh environmental conditions. This smooth, non-sagging, thixotropic adhesive is excellent for use on vertical surfaces, for gap filling, and for potting electronics enclosures with gaps where a non-thixotropic encapsulant would flow through. For a flame retardant version, use 9200FR.

9200FR is a toughened, flame retardant, 2-part epoxy adhesive, designed to create long-lasting load-bearing joints. It creates tough vibration resistant bonds and is especially useful for joining dissimilar materials that will experience thermal cycling stresses or harsh environmental conditions. This smooth, non-sagging, thixotropic adhesive is excellent for use on vertical surfaces, for gap filling, and for potting electronics enclosures with gaps where a non-thixotropic encapsulant would flow through.

UV-5403S is a filled, low shrinkage, light curing epoxy adhesive that offers low CTE and high bonds strength. UV-5403S cures to a high bond strength polymer with excellent adhesive to metals, ceramics, and glass. This epoxy was specifically designed as a glob top encapsulant for smart card applications and encapsulations of chip modules. UV-5403S is free of solvents, has high ionic purity, and is resistant to moisture and humidity. This epoxy cures quickly under LED and UVA light.

EC-1850FT is a pourable filled epoxy resin system offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. It is a lower viscosity version of EC-1850FT. It rapidly transfers heat, eliminates hot spot, and increases the operating efficiency of most encapsulated devices. Its low shrinkage minimizes risk of damage to fragile components.

FLASHBOND™ UV-8300LV is a low viscosity, light curing epoxy adhesive that bonds well to a wide variety of substrates including metals, glass, ceramics and some plastics. This product exhibits good surface wetting and adhesion to glass and many plastics. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (405nm) as well as down to 365nm. Flashbond UV-8300LV has been tested to and passes ISO-10993-5 for cytotoxicity.

SETWORX™ 60 is a toughened, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties.

CoolMag™ 29 is a thermally conductive composite PDMS based elastomeric compound of encapsulant two component system, designed for Power Electronics in general and for Automotive, especially in Electrified Vehicles with multiple functionalities: Heat Transfer, reduction of hot spots and minimizing average temperature of systems Electric Isolation Mechanical protection Flame and fire protection (Retardant and Extinction)

SetWORX™ 1510 is a fast setting, toughened epoxy adhesive designed for industrial grade applications. This epoxy system has 1:1 mixing ratio by volume & cure fast at room temperature. When cured it is resistant to a wide range of chemicals and solvents, and acts as an excellent electrical insulator. The cured adhesive exhibits high impact resistance and exceptional bond strength. It can be used for bonding glass, metals, woods and some plastics.

APPLI-TEC 5336 Epoxy is a black, electrically isolating, thermally conductive epoxy designed specifically for staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies, transformers, and coils. This material is ideal for applications requiring a thermally conductive epoxy with resistance to solvents and chemicals. 5336 is supplied in frozen syringes.

NuSil™ EPM-2480 is used as a low stress alternative for electronic packaging, NuSil Technology's silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications.Benefits of Silicone for Electronics: Wide Operating Temperature Range of -115 °C to 250 °C Low moisture absorption, < 0.4% Typical Corrosion Resistance High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm Fillers can be added to provide thermal and electrical conductive properties Low Modulus (Typically less than 5.5 MPa/800 psi) Stable chEMIcal and mechanical properties when exposed to high temperatures Low Shrinkage Available as gels, elastomers, film adhesives sheeting, and greases General Purpose: GelsComments: Useful for Potting Intricate Assemblies Due to Low Viscosity.

The NGAC TC907-07 adhesive is thermally conductive and electrically insulating, and it can be cured at room temperature. It was created for the purpose of assembling heat sensitive components onto printed circuit boards. It is recommended for any application that necessitates strong adhesive bonds as well as excellent thermal transfer. NASA outgassing and weight loss requirements are met by NGAC TC907-07.

NuSil™ CF20-2186 is used as a low stress alternative for electronic packaging, NuSil Technology's silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications.Benefits of Silicone for Electronics: Wide Operating Temperature Range of -115 °C to 250 °C Low moisture absorption, < 0.4% Typical Corrosion Resistance High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm Fillers can be added to provide thermal and electrical conductive properties Low Modulus (Typically less than 5.5 MPa/800 psi) Stable chEMIcal and mechanical properties when exposed to high temperatures Low Shrinkage Available as gels, elastomers, film adhesives sheeting, and greases General Purpose: Adhesives and SealantsComments: Longer Work Time.

LightSpan® LS-3440 is from LEDs to fiber optics, NuSil Technology's LightSpan™ brand product line delivers the most comprehensive line of refractive index matching adhesives, encapsulants and thermosets available.The benefits of silicone include the following: Thermal Stability Low Ionic Species Maintain Optical Clarity (90% minimum @ 400nm) Low Moisture Absorption (<0.4%) Optimization for UV Resistance Adjustable Cure Low Outgassing Low Shrinkage, <1% Low Modulus: Stress reduction for bonding materials with different coefficients of thermal expansion Gernal Purpose: Optical GelsComments: Very Soft, Penetration 9.0 mm, non-phenyl containing.

Nuceq C9-4183/HD-3520 is a C9-4183 resin with HD-3520 hardener that is a 100% solids casting system.

LightSpan® LS-3354 is from LEDs to fiber optics, NuSil Technology's LightSpan™ brand product line delivers the most comprehensive line of refractive index matching adhesives, encapsulants and thermosets available.The benefits of silicone include the following: Thermal Stability Low Ionic Species Maintain Optical Clarity (90% minimum @ 400nm) Low Moisture Absorption (<0.4%) Optimization for UV Resistance Adjustable Cure Low Outgassing Low Shrinkage, <1% Low Modulus: Stress reduction for bonding materials with different coefficients of thermal expansion Gernal Purpose: Optical GelsComments: Use with Phosphor.

LightSpan® LS2-3354 is from LEDs to fiber optics, NuSil Technology's LightSpan™ brand product line delivers the most comprehensive line of refractive index matching adhesives, encapsulants and thermosets available.The benefits of silicone include the following: Thermal Stability Low Ionic Species Maintain Optical Clarity (90% minimum @ 400nm) Low Moisture Absorption (<0.4%) Optimization for UV Resistance Adjustable Cure Low Outgassing Low Shrinkage, <1% Low Modulus: Stress reduction for bonding materiaLS with different coefficients of thermal expansion Gernal Purpose: Optical GeLSComments: Contains adhesion promoter, use with Phosphor.

Cast-Coat Inc. CC3-300 is a high viscosity, alumina filled casting resin offering high thermal conductivity, high heat distortion, excellent electrical insulation, low coefficient of thermal expansion and extremely low shrinkage during cure. It will withstand the most rugged tests of temperature, chemical attack and voltage shock, and is easier to fabricate than metals or ceramics at a lower cost. Supplied as a pourable resin, it cures to a rigid, opaque plastic at room temperature or with heat. The thermal coefficient of expansion is closely matched to aluminum. CC3-300 has excellent adhesion to a wide variety of materials, i.e., metal, plastic, glass, ceramic. To reduce viscosity, warm the resin between 100°F to 150°F prior to adding the hardener.

Tough-Seal 23 A a tough and durable two component, hybrid epoxy elastomer that features a higher viscosity than KEY Tough-Seal 21 to limit lateral flow in “glob top” encapsulation. KEY PC2023A/Bis a superior electrical potting compound with excellent thermal cycling performance.

NGAC P907-30 is a controlled flow encapsulant with a high viscosity designed for microelectronics applications requiring low shrinkage and high reliability performance.