FLASHBOND™ UV-5403S
UV-5403S is a filled, low shrinkage, light curing epoxy adhesive that offers low CTE and high bonds strength. UV-5403S cures to a high bond strength polymer with excellent adhesive to metals, ceramics, and glass. This epoxy was specifically designed as a glob top encapsulant for smart card applications and encapsulations of chip modules. UV-5403S is free of solvents, has high ionic purity, and is resistant to moisture and humidity. This epoxy cures quickly under LED and UVA light.
Brand: FLASHBOND (13 products)
Product Type: Epoxy Adhesive, Radiation Curable Coating
Application Area: Chip Module
Compatible Substrates & Surfaces: Ceramic, Glass, Metal
Cure Method: Radiation Cure
Chemical Family: Epoxy & Epoxy Derivatives