Products in Battery & Electronic Materials

IAM B is Hexamethyldisiloxane of high purity.

DiTech DiFunctional C is a dual-functional PEGylation reagent. Antifog coatings can be formed from combinations of polyalkylene oxide functional silanes and film-forming hydrophilic silanes. It functions as an intermediate and reagent and is commonly used in cathode material manufacturing and chemical production.

IAM Oxidizing Agent is an enzyme that presents in the cells of plants, animals and aerobic (oxygen requiring) bacteria. It promotes the conversion of hydrogen peroxide, a powerful and harmful oxidizing agent, into water and molecular oxygen. It is widely used for removal of H2O2 in textile industry, semiconductor and electronics factory. It saves time and energy and is environmental-friendly.

IAM Cathode Material is a carbonyl-process pure nickel powder with filamentary morphology used in specialized powder metallurgical and battery applications.

DiTech Nucleating Agent is a high-performance I-type nucleator tor polyolefin. It can improve the impact strength and porosity of PP materials. This product is suitable for household appliances, PPR pipes, automobile bumpers, accumulator tanks, batteries, micropore PP fibers, ventilated packaging membranes, lithium battery diaphragms, etc.

DiTech Reinforcement is an ultrafine mat of polyacrylonitrile produced by electrospinning. This product is a free standing flexible sheet with microstructural features not available from a bulk material. The fine scale of fiber diameters produces a membrane material with an inherently high surface area to volume ratio. The interconnected irregular shape pores within the fibers largely increases the pore volume (porosity) and accessible surface area.

SEMICOSIL® TEOS 999-LB is an ultra-high-purity tetraethoxysilane (TEOS) known for its exceptional chemical purity, very good trace metal purity, and very good purity in terms of boron and chloride. This product has been specifically developed for the semiconductor industry and finds typical applications as a precursor for low-dielectric constant interlayer dielectrics and other related uses.

ELASTOSIL® LR 6200 A/B is a liquid silicone rubber (LSR) that is solvent-free and free-flowing. It utilizes additive curing and consists of two components. This grade is specifically designed for textile coatings. ELASTOSIL® LR 6200 A/B has a very low viscosity, allowing for good penetration into the substrate and a dry surface touch. It is particularly well suited for textile coating applications that require enhanced flame retardancy.

SEMICOSIL® HMDSO-EL is a high-purity hexamethyldisiloxane (HMDSO) known for its exceptional purity, low metal content, and low chloride content. This product has been specifically developed to cater to the needs of the semiconductor industry. It finds applications in various processes such as chemical vapor deposition (CVD) and spin-on dielectrics (SOD).

SEMICOSIL® 2M2M is a high-purity dimethoxydimethylsilane with low levels of metal, chloride, and methanol content. It was developed specifically for the semiconductor industry, serving as a precursor for low-dielectric-constant interlayer dielectrics. This product is commonly used in chemical vapor deposition (CVD) and spin-on dielectric (SOD) applications.

SEMICOSIL® 6C2S is a hyperpure hexachlorodisilane with ultra-high purity and low metal content. This product falls under the category of silanes used for chemical vapor deposition (CVD) and spin-on dielectrics (SOD). It was specifically developed for the semiconductor industry, serving as a precursor for low-temperature deposition processes and other applications within the field.

SEMICOSIL® HMN-EL is a high-purity hexamethyldisilazane specifically developed for use in photoresists for semiconductor manufacturing. It serves as an adhesion promoter and silylating agent in processes like chemical amplification. This product is characterized by its high purity, low metal content, low chloride content, and low residue on evaporation, ensuring optimal performance in semiconductor applications.

HDK® N20P is a hydrophilic, synthetic, amorphous silica produced through flame hydrolysis. It is a standard product widely used in various industrial applications. HDK® N20P is commonly applied in the electronics industry as a white colloidal powder of high purity.

SEMICOSIL® M3E is a high-purity methyltriethoxysilane (M3E) known for its excellent purity, low metal content, and low chloride content. This product has been specifically developed for the semiconductor industry, serving as a precursor for low dielectric constant interlayer dielectrics and other applications.

SEMICOSIL® 4MS-EL is a high-purity silane compound specifically developed for the semiconductor industry. It is used as a precursor for low-dielectric-constant interlayer dielectrics in applications such as chemical vapor deposition (CVD) and spin-on dielectrics (SOD). This product is known for its high purity, low metal content, and low chloride content, ensuring optimal performance in semiconductor processes.

TEGO® Surten 202 E is a non-ionic polyether siloxane with a 100% active content. This product is particularly effective for surface wetting in adhesive applications, especially on challenging substrates. It is also well-suited for curtain coating applications. One of its key advantages is that it is a solvent-free, easy-to-handle liquid.

TEGO® Surten 219 E surfactant is 100% active Gemini wetting agent technology for use in a wide range of aqueous applications. TEGO® Surten 219 E surfactant shows excellent dynamic surface tension reduction with low foam tendency. TEGO® Surten 219 E surfactant is easy-to handle liquid that contains no added alkylphenol ethoxylates (APEs).

γ - Butyrolactone (GBL) has a wide range of practical applications because of its low freezing point, high boiling point, and a unique combination of solvent and electrical properties. It has applications as a solvent for special resins, in photography, in batteries, and as an electrolyte. Also a number of derivatives are synthesized from GBL.

N - Methyl - 2 - Pyrrolidone (NMP) is a solvent in the pyrrolidones family. Recognized for its high solvency, low freezing point, and hygroscopic properties, NMP serves diverse applications. With a low freezing point, high boiling point, and high flash point, it excels in industrial additives, particularly in lithium-ion batteries for the electrical and electronics market. Packaged in drums, tanks. Our NMP is ensured with high purity by integrated production process from butane - based maleic anhydride.

DEHESIVE® PSA 630 T is a solvent-based silicone pressure-sensitive adhesive intended particularly for coating films but also other substrates. It can be used for coating several film substrates, such as polyester, polyamide, polyimide, and other substrates, for the manufacture of different silicone pressure-sensitive adhesive tapes and other articles.

Stanyl® SN-PURE (Succinonitrile) is a high-purity form of succinonitrile used as an electrolyte additive in lithium-ion batteries. It enhances battery safety and extends the service life by reducing the generation of harmful gasses. The lifetime of nickel (Ni), manganese (Mn), and cobalt (Co) cathode chemistries is increased with the inclusion of Stanyl® SN-PURE. It forms a protective layer at the cathode, preventing electrolyte decomposition, protecting against oxidation, and inhibiting dendrite formation.

Flyadd® B1 is a high-performance β-type nucleator tor polyolefin. It can improve the impact strength and porosity of PP materials. This product is suitable for household appliances, PPR pipes, automobile bumpers, accumulator tanks, batteries, micropore PP fibers, ventilated packaging membranes, lithium battery diaphragms, etc.

Gelest N,N'-BIS-[(3-TRIETHOXYSILYLPROPYL)AMINOCARBONYL]POLYETHYLENE OXIDE (10-15 EO) (SIB1824.82) is a dual-functional PEGylation reagent. Antifog coatings can be formed from combinations of polyalkylene oxide functional silanes and film-forming hydrophilic silanes. It functions as an intermediate and reagent and is commonly used in cathode material manufacturing and chemical production.

Boratherm™ SG25/10 is produced from carefully selected synthetic aluminum hydroxide (ATH). Boratherm™ SG25/10 is a micronized functional filler used in formulations for applications in which thermal conductivity is an important property. It has very good chemical inertness (for outdoor and chemical applications). The standardized quality of Boratherm™ SG25/10 is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation. Boratherm™ SG25/10 is perfectly suited for formulations needing good flowability. It is specially designed to offer an ultra-low surface area and large particle sizes.

Hi-Sil® WB10 is a high-quality precipitated silica that is designed to enhance the performance of coatings, adhesives, and sealants. This versatile product offers excellent reinforcing properties, improved viscosity control, and enhanced durability. Additionally, Hi-Sil® WB10 enhances the flow, stability, and surface properties of the final product. With its superior performance and flexibility, Hi-Sil® WB10 is the perfect choice for manufacturers looking to optimize their products' performance and efficiency.

Boratherm™ SG200 E is produced from carefully selected synthetic aluminum hydroxide (ATH). Boratherm™ SG-E grades are used in various applications because of their high thermal conductivity, flame retardancy, smoke suppression, and low viscosity. Combining these grades with finer products (ATH or Al2O3-based) makes it possible to obtain a high packing density, resulting in excellent thermal conductivity. Boratherm™ SG is perfectly suited for formulations needing good flowability. It is specially designed to offer an ultra-low surface area and large particle sizes.

Boratherm™ SG 200LVS is a blended product produced from carefully selected synthetic aluminum hydroxide (ATH). This product is used in applications where heat-dissipation and fire-retardancy are critical properties, e.g., in thermal interface materials (including electronic vehicle battery heat management), casting resins for power transformers, and potting and encapsulating materials in electric and electronic applications. The particle size distribution of the Boratherm™ SG 200LVS is already optimized, so blends with other finer or coarser aluminum-containing grades are no longer needed to obtain the optimum packing density, resulting in the right balance between flow and thermal conductivity.

Boratherm™ SG150 E is produced from carefully selected synthetic aluminum hydroxide (ATH). Boratherm™ SG-E grades are used in various applications because of their high thermal conductivity, flame retardancy, smoke suppression, and low viscosity. Combining these grades with finer products (ATH or Al2O3-based) makes it possible to obtain a high packing density, resulting in excellent thermal conductivity. Boratherm™ SG is perfectly suited for formulations needing good flowability. It is specially designed to offer an ultra-low surface area and large particle sizes.

OSC® G - 450 is an inorganic compound substance. It is the synthetic precipitated silica (silica amorphous), obtained by the chemical precipitated reaction in an aqueous solution of high-purity sodium silicate and sulfuric acid.

OSC® G - 418 is an inorganic compound substance. It is the synthetic precipitated silica (silica amorphous), obtained by the chemical precipitated reaction in an aqueous solution of high-purity sodium silicate and sulfuric acid.

OSC® C3350 is a free-flow microgranule product.

Esschem MMA - AMA Bead Copolymers are a versatile range of copolymers combining methyl methacrylate (MMA) with allyl methacrylate (AMA). These copolymers showcase the unique characteristics of AMA as a crosslinker in polymers. With varying MMA and AMA concentrations, Esschem offers a wide range of copolymer beads with different properties. Higher MMA content in the copolymer results in elevated glass transition temperatures, melting points, and tensile strengths, making them ideal for applications requiring high strength and rigidity. On the other hand, increasing the AMA content lowers these properties while enhancing crosslinking and hardness. By adjusting the molecular weight, Esschem can further customize the copolymer's rigidity and crosslinking behavior. The particle size of the beads can also be modified to optimize processing and surface properties, including adhesion characteristics.

Esschem MMA - IBOMA Bead Copolymers are a range of copolymers that combine methyl methacrylate (MMA) with isobornyl methacrylate (IBOMA).These bead copolymers offer exceptional strength and performance for a wide range of industries. With their high glass transition temperature, melting point, and tensile strength, they provide incredibly strong polymers that meet demanding application requirements.By controlling the molecular weight, Esschem ensures that the copolymer beads exhibit enhanced strength and rigidity. Furthermore, the performance characteristics, including adhesion, can be tailored by optimizing the particle size.

Esschem EMA Bead Copolymers are a range of bead polymers synthesized from ethyl methacrylate (EMA) that offers the strength of polymethyl methacrylate (PMMA) with slightly different properties.The copolymers exhibit a slightly lower glass transition temperature, resulting in a softer and more flexible final product compared to PMMA.By controlling the molecular weight, Esschem can customize the heat resistance and strength of the polymer, making it suitable for various applications across multiple industries.The smaller particle size of the beads enhances surface properties like adhesion, while larger particles contribute to a more robust and rigid material.