Products in Composite Materials: Laminate

Tufnol Grade 10G/50 is a laminated plastics material made from woven glass fabric, bonded with silicone resin. It is a rigid sheet material with good resistance to high temperatures and very good electrical insulation properties, especially in applications involving very high frequencies. Note, however, that silicone bonded laminates have mechanical strength properties somewhat lower than some other glass fabric laminates.

Acculam™ Phenolfab G3 comprised of a high temperature phenolic resin binder and a woven fiberglass substrate. It qualifies to NEMA G-3 and MIL-I-24768/18.This material has good heat resistance, high mechanical strength and low thermal expansion. It finds applications in motor slot insulation, valve plates, and other applications requiring good thermal insulation characteristics.

Tufnol Grade 2F/14 is a cotton fabric laminate with enhanced electrical properties, specially developed to meet the requirements of the relevant British Standard specification.

VOLTIS® Hgw RO 42 (PF CC 42) is a Round molded phenolic cotton fabric laminate rod with high toughness for mechanical applications.

35NQ is a pure polyimide laminate and prepreg system. Reinforced with woven Quartz fabric, combining the advantages of a reduced cure cycle, high temperature polyimide system (Tg >/=250°C), with low dielectric constant and loss tangent (DK = 3.5, loss 0.009 at 1 MHz) for applications requiring operation at RF/Microwave frequencies. Polyimide Quartz materials also exhibit reduced in-plane CTE for expansion matched SMT applications.

The FloLam® PR+ is the ultimate enhancement for thermoplastic composites for both surface protection and esthetics. It is specially engineered to produce a close to Class “A” finish – no surface voids.

INBORD® E is a phenol / melamine laminate with a creepage-resistant, decorative surface and good mechanical and dielectric properties as well as sufficient arc resistance. The core is similar to PF CP 203 according to IEC 60893 or Hp 2061.6 according to DIN 7735. The thickness of the melamine layer is approx. 0.25 mm. The insulation class is E (120 ° C).

DiClad laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. Using precise control of the fiberglass/PTFE ratio, DiClad laminates offer a range of choices from the lowest dielectric constant and dissipation factor to a more highly reinforced laminate with better dimensional stability

Toray Toray CFRT® TW-2000 is a reinforced thermoplastic composite laminate. It blends the benefits of a thermoplastic polymer matrix with woven carbon fibers in a twill weave for enhanced performance. The TW-2000 1L & 2L style laminate is available in a single or multilayer product; carbon fiber reinforcement at 0° and 90° orientations that is ultra-thin, lightweight, and resilient for improved energy return.

TC350™ Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/ mK, this next generation PTFE-based laminate is ideally suited for higher power microwave and industrial heating applications requiring higher maximum operating temperatures, low circuit losses, and excellent thermal dissipation within the circuit board. Additionally, the advanced filler system used enables the composite to have much improved mechanical drilling performance when compared with other competitive laminates. This will result in lower manufacturing costs during circuit board fabrication.

Toray Toray CFRT® TWAG is a reinforced thermoplastic composite laminate. It blends the benefits of a thermoplastic polymer matrix with woven glass fibers in a twill weave for enhanced shapes and performance. The TWAG style laminate is available in a single-layer product. The TWAG laminate is ultra-thin, lightweight, and resilient for improved energy return.

RO4835T™ laminates are 3.3 Dk low loss, spread glass reinforced, ceramic thermoset materials that were designed as inner-layers for use in multilayer board designs, and to complement RO4835™ laminates when thinner cores are needed.