RTduroid® 6202PR Laminates

RT/duroid® 6202PR high frequency circuit material is a low loss and low dielectric constant laminate offering superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable and used for planar resistor applications. Excellent dimensional stability (0.05 to 0.07 mils/inch) is achieved by the addition of limited woven glass reinforcement. This enables the manufacture of tight tolerance planar resistors. ¼ oz. to 2 oz./ft.2 electrodeposited copper foil , ½ oz., 1 oz. and 2 oz. rolled copper foil, ½ oz., 1oz. and 2 oz. reverse treated foil and ½ oz. and 1 oz. electrodeposited copper foil with a resistive layer, may be specifi ed as cladding on 0.005” (0.127mm), 0.010” (0.254mm), 0.015” (0.381mm), & 0.020” (0.508mm) standard dielectric thicknesses. RT/duroid 6002PR (non-reinforced) available in 0.020 and 0.030 dielectric thicknesses. Applications particularly suited to the unique properties of RT/duroid 6202PR material include fl at and non-planar structures such as antennas and complex multi-layer circuits with inter-layer connections

Low Loss

• Excellent high frequency performance

Excellent mechanical and electrical properties

• Reliable multi-layer board constructions

Tight dielectric constant and thickness controls

• Extremely low thermal coeffi cient of dielectric constant
• Excellent dimensional stability

In-plane expansion coeffi cient matched to copper

• Allows for more reliable surface mounted assemblies
• Ideal for applications sensitive to temperature change
• Excellent dimensional stability

• Phased Array Antennas
• Ground Based and Airborne Radar Systems
• Global Positioning System Antennas
• Power Backplanes
• High Reliability Complex Multi-layer Circuits
• Commercial Airline Collision Avoidance
• Beam Forming Networks