Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Reinforcement Material
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Product Features
Industry Recognition
- UL File Number: E41625
- RoHS Compliant
Processing Advantages
- Complete encapsulation of non-planar surfaces
- Cure and form bond at low temperatures
- Allows for lamination at non-uniform pressures
- Adhesion to wide range of materials
- Flex films – (Mylar®, Kapton®, etc.)
- Treated or untreated copper
- Plated metals (tin, solder, nickel, etc.)
- Conventional laminate surfaces
Product Attributes
- No/Flow Prepreg
Properties
- Flame Rating
- Typical Properties
Value Units Test Method / Conditions Cure Temperature Recommended for Full Cure 171.0 °C - Decomposition Temperature (Td) by TGA (5% weight loss) 300.0 °C IPC-TM-650 Dielectric Breakdown 80.0 kV IPC-TM-650 Dk, Loss Tangent(1 GHz) 0.033 - IPC-TM-650 Dk, Permittivity(1 GHz) 4.5 - IPC-TM-650 Flammability (Laminate & laminated prepreg) HB Rating UL 94 Glass Transition Temperature (Tg) by DSC 100.0 °C IPC-TM-650 Min. for Functional Bonding 149.0 °C - Modified Circle Flow 104 0.010 - 0.100 - - Modified Circle Flow 108 0.010 - 0.100 - - Peel Strength (1 oz. EDC foil) 9.0 N/mm (lb/inch) IPC-TM-650 Pressed Thickness 104 2.0 mm - Pressed Thickness 108 3.7 mm - Resin Content 104 75.0 % IPC-TM-650 Resin Content 108 65.0 % IPC-TM-650 Resin Flow Testing 104 2.0 - IPC-TM-650 Resin Flow Testing 108 2.0 - IPC-TM-650 Thermal Conductivity 0.25 W/m·K ASTM E1952 X/Y-Axis CTE 18/16 ppm/°C IPC-TM-650 Z-Axis CTE 80.0 ppm/°C IPC-TM-650
Regulatory & Compliance
- Certifications & Compliance
Packaging & Availability
- Product Availability
Standard Material Offering: Prepreg
- Roll or panel form
- Tooling of prepreg panels
Glass Fabric Availability
- E-glass