Isola

FR406 No-Flo and FR406 Lo-Flo® products bring the fabricator specific thermal characteristics appropriate for use in heat sink bonding, die cavity board (direct chip attachment) and multilayer rigid-flex applications.

IS420 laminate and prepreg products are manufactured with a unique high performance multifunctional epoxy resin, reinforced with electrical grade (E-glass) glass fabric. This system provides improved thermal performance and low expansion rates in comparison to traditional FR-4 while retaining FR-4 processability. In addition to this superior thermal performance, the mechanical, chemical and moisture resistance properties all equal or exceed the performance of traditional FR-4 materials. The IS420 system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo imageable solder mask imaging.

P25N consist of a polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

IS415 is engineered to meet the demands of Lead (Pb) free multilayer printed circuit assembly, deliver CAF resistance with strong IST results and maintain FR-4 processing. IS415 offers good electrical performance, superior chemical and thermal performance and product consistency.

TerraGreen® is engineered for such high-performance applications as power amplifier boards for LTE base stations, internet infrastructure and cloud computing. TerraGreen ® features a Dielectric Constant (Dk) that is stable between -55°C and 125°C, up to 20 GHz. TerraGreen® is a lead-free assembly material and is easy to process. This high-performance material utilizes a short-lamination cycle; the product is easy to drill, does not require plasma desmear, and the prepreg shelf life is similar to FR-4 materials. TerraGreen® is suitable for high-layer count, high-speed digital backplanes and is compatible with Isola’s FR-4 materials for hybrid designs. TerraGreen® meets UL 94 V-0 and is halogen free.

P95/P25 consist of an HB flammability rated polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

IS550H was developed in conjunction with a consortium of industry experts for high power & high voltage applications and PEV & HEV automotive electrification. The resulting solution addresses critical application needs for use in a harsh environment where very demanding, long term thermal reliability performance, extreme thermal cycling and very high voltage CAF & electro-migration resistance is required.

FR408 low dielectric constant (Dk) and low dissipation factor (Df) make it an ideal candidate for broadband circuit designs requiring faster signal speeds or improved signal integrity. FR408 is compatible with most FR-4 processes. This feature allows the use of FR408 without adding complexity to current fabrication techniques.

I-Speed® laminate and prepreg products are manufactured with Isolas' patentable high performance multi-functional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 15% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective. The I-Speed® resin system is laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo imageable solder mask imaging.