Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Chemical Family
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- Materials Features
- Ready-to-Use Product Features
- Product Features
Industry Recognition
- UL File Number: E41625
- Qualified to UL’s MCIL Program
- RoHS Compliant
Performance Attributes
- CAF resistant
Processing Advantages
- FR-4 process compatible
- UV blocking and AOI fluorescence
- No post bake after pressing
Product Attributes
- High Density Interconnect
- High Speed Digital
- High Thermal Reliability
Applications & Uses
- Markets
- Applications
- Composites End Use
- Typical Market Applications
- Computing, Storage and Peripherels
Properties
- Typical Properties
Value Units Test Method / Conditions Arc Resistance 120.0 Seconds IPC-TM-650 Comparative Tracking Index (CTI) 1 (400-600) Volts UL 746A ASTM D3638 Decomposition Temperature (Td) by TGA (5% weight loss) 370.0 °C IPC-TM-650 Dielectric Breakdown min. 50 kV IPC-TM-650 Dk, Loss Tangent(1 GHz) 0.0131 - IPC-TM-650 Dk, Loss Tangent(10 GHz) 0.0125 - IPC-TM-650 Dk, Loss Tangent(100 MHz) 0.0107 - IPC-TM-650 Dk, Loss Tangent(2 GHz) 0.012 - IPC-TM-650 Dk, Loss Tangent(5 GHz) 0.0127 - IPC-TM-650 Dk, Permittivity(1 GHz) 3.71 - IPC-TM-650 Dk, Permittivity(10 GHz) 3.71 - IPC-TM-650 Dk, Permittivity(100 MHz) 3.75 - IPC-TM-650 Dk, Permittivity(2 GHz) 3.72 - IPC-TM-650 Dk, Permittivity(5 GHz) 3.71 - IPC-TM-650 Electric Strength (Laminate & laminated prepreg) 40 (1100) kV/mm (V/mil) IPC-TM-650 Flammability (Laminate & laminated prepreg) V-0 Rating UL 94 Flexural Strength Cross direction 51.6 ksi IPC-TM-650 Flexural Strength Length direction 74.2 ksi IPC-TM-650 Glass Transition Temperature (Tg) by DSC 200.0 °C IPC-TM-650 Moisture Absorption 0.15 % IPC-TM-650 Peel Strength (Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]) 1.14 (6.5) N/mm (lb/inch) IPC-TM-650 Peel Strength [125ºC (257ºF) (Standard profile copper)] 1.14 (6.5) N/mm (lb/inch) IPC-TM-650 Peel Strength After process solutions (Standard profile copper) 0.90 (5.1) N/mm (lb/inch) IPC-TM-650 Peel Strength After thermal stress (Standard profile copper) 1.225 (7.0) N/mm (lb/inch) IPC-TM-650 Poisson's Ratio Cross direction 0.138 - ASTM D3039 Poisson's Ratio Length direction 0.158 - ASTM D3039 Relative Thermal Index (RTI) 130.0 °C UL 796 Surface Resistivity (After moisture resistance) 2.81 x 10^6 MΩ IPC-TM-650 Surface Resistivity (At elevated temperature) 2.64 x 10^8 MΩ IPC-TM-650 Tensile Strength Cross direction 31.5 ksi ASTM D3039 Tensile Strength Length direction 43.8 ksi ASTM D3039 Thermal Conductivity 0.4 W/m·K ASTM E1952 Thermal Stress Etched [10 sec, 288ºC (550.4ºF)] Pass - IPC-TM-650 Thermal Stress Unetched [10 sec, 288ºC (550.4ºF)] Pass - IPC-TM-650 Time to Delaminate by T260 (Copper removed) 60.0 Minutes IPC-TM-650 Time to Delaminate by T288 (Copper removed) min. 20 Minutes IPC-TM-650 Volume Resistivity (After moisture resistance) 3.81 x 10^8 MΩ-cm IPC-TM-650 Volume Resistivity (At elevated temperature) 3.90 x 10^8 MΩ-cm IPC-TM-650 X/Y-Axis CTE Pre-Tg 13.0 ppm/°C IPC-TM-650 Young's Modulus Cross direction 3200.0 ksi ASTM D790-15e2 Young's Modulus Length direction 3530.0 ksi ASTM D790-15e2 Z-Axis CTE 50 to 260°C, (Total Expansion) 2.8 % IPC-TM-650 Z-Axis CTE Post-Tg 240.0 ppm/°C IPC-TM-650 Z-Axis CTE Pre-Tg 45.0 ppm/°C IPC-TM-650
Regulatory & Compliance
- Certifications & Compliance
Packaging & Availability
- Product Availability
Standard Material Offering: Laminate
- 2 to 125 mil (0.05 to 3.2 mm)
- Available in full size sheet or panel form
Copper Foil Type
- HTE Grade 3
- RTF (Reverse Treat Foil)
Copper Weight
- ½ to 2 oz (18 to 70 µm) available
- Heavier copper available
- Thinner copper foil available
Standard Material Offering: Prepreg
- Roll or panel form
- Tooling of prepreg panels
Glass Fabric Availability
- E-glass
- Square weave glass
- Mechanically spread glass