Search
the marketplace
through 230,000 Chemicals and Raw Ingredients
through 8,000+ Supplier owned storefronts

Isola FR406N

Isola FR406N products bring the fabricator specific thermal characteristics appropriate for use in heat sink bonding, die cavity board (direct chip attachment) and multilayer rigid-flex applications.

Functions: Laminate

Reinforcement Material: Glass Fibers

Technical Data Sheet

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Reinforcement Material
Glass Fibers
Composite Materials Functions
Laminate
Technologies
Composite Materials
Product Families
Composite Materials — Prepregs & Molding Compounds
Laminates

Features & Benefits

Materials Features
Good Adhesion,
Low Flow,
Low Temperature Curing
Ready-to-Use Product Features
Consistent Performance,
Slow Setting
Product Features

Industry Recognition

  • UL File Number: E41625
  • RoHS Compliant

Processing Advantages

  • Machinable by steel rule die or punch
  • Consistent dielectric spacing
  • Complete encapsulation of nonplanar surfaces
  • Cure and form bond at low temperatures
  • Allows for lamination at nonuniform pressures

No-flow Prepreg

  • Adhesion to wide range of materials
  • Flex films – (Mylar®, Kapton®, etc.)
  • Treated or untreated copper
  • Plated metals (tin, solder, nickel, etc.)
  • Conventional laminate surfaces

Product Attributes

  • No/Low flow prepreg
  • Legacy

Applications & Uses

Markets
Automotive & Transportation,
Industrial
Applications
Industrial — Military & Defense
Advanced Materials
Automotive & Transportation — Transportation
Aerospace & Aviation
Typical Market Applications
  • Aerospace and Defense

Properties

Flame Rating
UL 94 V0
Typical Properties
ValueUnitsTest Method / Conditions
Cure Temperature Recommended for Full Cure185.0°C-
Electric Strength (Laminate & laminated prepreg) 70 (1750)kV/mm (V/mil)IPC-TM-650
Flammability (Laminate & laminated prepreg) V-0RatingUL 94
Glass Transition Temperature (Tg) by DSC170.0°CIPC-TM-650
Min. for Functional Bonding165.0°C-
Modified Circle Flow 1060.050 - 0.120--
Modified Circle Flow 10800.050 - 0.120--
Peel Strength Standard profile copper After thermal stress1.75 (10.0)N/mm (lb/inch)IPC-TM-650
Pressed Thickness 1060.0422 - 0.0438mm-
Pressed Thickness 10800.0682 - 0.0698mm-
Resin Content 10663.5 - 66.5%IPC-TM-650
Resin Content 108063.5 - 66.5%IPC-TM-650
Resin Flow Testing 106R&R-IPC-TM-650
Resin Flow Testing 1080R&R-IPC-TM-650
Thermal Conductivity 0.3W/m·KASTM E1952
Thermal Stress Etched [10 sec, 288ºC (550.4ºF)] Pass-IPC-TM-650
Thermal Stress Unetched [10 sec, 288ºC (550.4ºF)] Pass-IPC-TM-650
X/Y-Axis CTE Pre-Tg17/20ppm/°CIPC-TM-650
Z-Axis CTE Post-Tg75.0ppm/°CIPC-TM-650

Regulatory & Compliance

Certifications & Compliance
RoHS Compliant,
UL 94

Packaging & Availability

Product Availability

Standard Material Offering: Laminate
Copper Foil Type
Copper Weight
Standard Material Offering: Prepreg

  • Roll or panel form
  • Tooling of prepreg panels

Glass Fabric Availability

  • E-glass