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TERRAGREEN®

TerraGreen® is engineered for such high-performance applications as power amplifier boards for LTE base stations, internet infrastructure and cloud computing. TerraGreen ® features a Dielectric Constant (Dk) that is stable between -55°C and 125°C, up to 20 GHz. TerraGreen® is a lead-free assembly material and is easy to process. This high-performance material utilizes a short-lamination cycle; the product is easy to drill, does not require plasma desmear, and the prepreg shelf life is similar to FR-4 materials. TerraGreen® is suitable for high-layer count, high-speed digital backplanes and is compatible with Isola’s FR-4 materials for hybrid designs. TerraGreen® meets UL 94 V-0 and is halogen free.

Brand: TERRAGREEN (1 products)

Functions: Laminate, Prepreg

End Uses: PCB Materials

Technical Data Sheet

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Composite Materials Functions
Laminate,
Prepreg
Technologies
Composite Materials
Product Families
Composite Materials — Prepregs & Molding Compounds
Laminates

Features & Benefits

Labeling Claims
Halogen-free,
Lead-free
Materials Features
Exceptional UV Resistance,
Good Electrical Properties,
Good Processability,
Shorter Cycle Time
Ready-to-Use Product Features
Slow Setting
Product Features

Industry Recognition

  • RoHS Compliant

Performance Attributes

  • Lead-free assembly compatible

Processing Advantages

  • FR-4 process compatible
  • UV blocking and AOI fluorescence

Product Attributes

  • Halogen Free
  • High Speed Digital
  • High Thermal Reliability

Applications & Uses

Markets
Consumer Goods,
Electrical & Electronics
Applications
Consumer Goods — Appliances & Electronics
Electrical & Electronics — Devices & Assemblies
Consumer Electronics
Electrical & Electronics — Parts & Components
Printed Circuit Boards (PCBs)
Electrical & Electronics — Wire & Cable
Data Communication Cables
Composites End Use
PCB Materials
Typical Market Applications
  • Networking and Communications
  • Computing, Storage and Peripherels

Properties

Flame Rating
UL 94 V0
Typical Properties
ValueUnitsTest Method / Conditions
Arc Resistance139.0SecondsIPC-TM-650
Comparative Tracking Index (CTI)2.0VoltsUL 746A ASTM D3638
Decomposition Temperature (Td) by TGA (5% weight loss)390.0°CIPC-TM-650
Dielectric Breakdown45.4kVIPC-TM-650
Dk, Loss Tangent(10 GHz)0.0039-IPC-TM-650
Dk, Loss Tangent(2 GHz)0.0039-IPC-TM-650
Dk, Loss Tangent(5 GHz)0.0039-IPC-TM-650
Dk, Permittivity(10 GHz)3.44-IPC-TM-650
Dk, Permittivity(2 GHz)3.44-IPC-TM-650
Dk, Permittivity(5 GHz)3.44-IPC-TM-650
Electric Strength (Laminate & laminated prepreg)45 (1133)kV/mm (V/mil)IPC-TM-650
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Flexural Strength Cross direction60.0ksiIPC-TM-650
Flexural Strength Length direction75.5ksiIPC-TM-650
Glass Transition Temperature (Tg) by DSC200.0°CIPC-TM-650
Moisture Absorption0.05%IPC-TM-650
Peel Strength (0.5 oz. EDC foil)0.88 (5.0)N/mm (lb/inch)IPC-TM-650
Peel Strength (1 oz. EDC foil)0.88 (5.0)N/mm (lb/inch)IPC-TM-650
Poisson's Ratio Cross direction0.231-ASTM D3039
Poisson's Ratio Length direction0.238-ASTM D3039
Relative Thermal Index (RTI)130.0°CUL 796
Surface Resistivity (C-96/35/90)1.33 x 10^5MΩIPC-TM-650
Tensile Strength Cross direction39.0ksiASTM D3039
Tensile Strength Length direction40.0ksiASTM D3039
Thermal Conductivity0.32W/m·KASTM E1952
Thermal Stress Etched [10 sec, 288ºC (550.4ºF)]Pass-IPC-TM-650
Thermal Stress Unetched [10 sec, 288ºC (550.4ºF)]Pass-IPC-TM-650
Time to Delaminate by T260 (Copper removed)60.0MinutesIPC-TM-650
Time to Delaminate by T288 (Copper removed)60.0MinutesIPC-TM-650
Volume Resistivity (C-96/35/90)1.33 x 10^7MΩ-cmIPC-TM-650
X/Y-Axis CTE Pre-Tg16.0ppm/°CIPC-TM-650
Young's Modulus Cross direction2745.0ksiASTM D790-15e2
Young's Modulus Length direction3125.0ksiASTM D790-15e2
Z-Axis CTE 50 to 260°C, (Total Expansion)2.9%IPC-TM-650

Regulatory & Compliance

Certifications & Compliance
RoHS Compliant,
UL 94

Packaging & Availability

Product Availability

Standard Material Offering: Laminate

  • Available in full size sheet or panel form

Copper Foil Type

  • HTE Grade 3
  • HVLP (VLP2) ≤2.5 micron Rz JIS, 1 oz and below is standard

Copper Weight

  • ½ to 2 oz (18 to 70 µm) available
  • Thinner copper foil available

Standard Material Offering: Prepreg

  • Roll or panel form
  • Tooling of prepreg panels

Glass Fabric Availability

  • E-glass
  • Square weave glass
  • Mechanically spread glass