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Products in Semiconductor Manufacturing
1,067 Products found in Semiconductor Manufacturing
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SABIC's Specialties Business
VALOX™ FR Resin VC108
Polymer Name:
Polybutylene Terephthalate (PBT)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Fiber, PTFE
Additives Included:
Flame Retardant, Impact Modifier, Heat Stabilizer, Metal Deactivator
Flexural Modulus:
5980.0 - 5980.0 MPa
VALOX VC108 compound is based on Polybutylene Terephthalate (PBT) resin containing 8% carbon fiber. Added features of this grade include: Electrically Conductive, Flame Retardant.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound MFD03
Polymer Name:
Polypropylene (unspecified)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Powder, Glass Fiber, Carbon Black
SABIC's Specialties Business LNP STAT-KON MFD03 compound is based on Polypropylene (PP) resin containing conductive carbon powder and 15% glass fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound JK800
Polymer Name:
PC/ABS Alloy
Processing Methods:
Injection Molding
Density:
1250.0 - 1250.0 kg/m³
Flexural Modulus:
6380.0 - 6380.0 MPa
SABIC's Specialties Business LNP™ STAT-KON™ JK800 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing 8% carbon fiber. Added features of this grade include: Electrically Conductive, Good Hydrolytic Stability, Non-Brominated, Non-Chlorinated Flame Retardant.
SABIC's Specialties Business
NORYL™ Resin HMC3008V
Polymer Name:
PPO/PS Alloy
Processing Methods:
Injection Molding
Density:
1259.0 - 1259.0 kg/m³
SABIC's Specialties Business NORYL™ HMC3008V compound is based on Polyphenylene Ether (PPE) resin containing carbon fiber, glass fiber and minerals (total 26%). Added features of this grade include: Electrically Conductive, Non-Halogenated Flame Retardant, Dimensional Stability.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound ZE0039
Polymer Name:
PPO/PS Alloy
Processing Methods:
Injection Molding
Density:
1210.0 - 1210.0 kg/m³
SABIC's Specialties Business LNP™ STAT-KON™ ZE0039 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 15% carbon fiber. Added features of this grade include: Electrically Conductive , Flame Retardant.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound DEL329XF
Polymer Name:
Polycarbonate (PC)
Additives Included:
Heat Stabilizer, Flame Retardant
Fillers Included:
Carbon Fiber, PTFE
Processing Methods:
Injection Molding
Flexural Modulus:
6480.0 - 6480.0 MPa
SABIC's Specialties Business LNP™ STAT-KON™ DEL329XF compound is based on Polycarbonate (PC) resin containing 10% carbon fiber, 15% PTFE. Added features of this grade include: Electrically Conductive. Wear Resistant, Flame Retardant.
SABIC's Specialties Business
NORYL™ Resin 100ES
Polymer Name:
PPO/PS Alloy
Processing Methods:
Injection Molding
Density:
1120.0 - 1120.0 kg/m³
Flexural Modulus:
3140.0 - 3140.0 MPa
NORYL 100ES compound is based on Polyphenylene Ether (PPE) resin containing conductive carbon powder and minerals. Added features of this grade include: Electrically Conductive.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound DX09315C
Polymer Name:
Polycarbonate (PC)
Additives Included:
Mold Release Agent
Fillers Included:
Carbon Fiber
Processing Methods:
Injection Molding
Flexural Modulus:
8130.0 - 8130.0 MPa
SABIC's Specialties Business LNP™ STAT-KON™ DX09315C compound is based on Polycarbonate (PC) resin containing 15% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Low LPC, Low Ionics, Low Outgassing, Low C18-C40 Hydrocarbons, Electrically Conductive.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound KX02764
Polymer Name:
Polyacetal Copolymer (POM)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Black, Carbon Powder
Additives Included:
Mold Release Agent
Flexural Modulus:
3010.0 - 3010.0 MPa
LNP STAT-KON KX02764 compound is based on POM (Acetal) copolymer resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound DE0029E
Polymer Name:
Polycarbonate (PC)
Additives Included:
Heat Stabilizer, Flame Retardant, Mold Release Agent
Fillers Included:
Carbon Fiber
Processing Methods:
Injection Molding
Flexural Modulus:
7580.0 - 7580.0 MPa
SABIC's Specialties Business LNP STAT-KON DE0029E compound is based on Polycarbonate (PC) resin containing 10% carbon fiber. Added features of this grade include: Flame Retardant, Electrically Conductive, Easy Molding. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ LUBRICOMP™ Compound UX06427
Polymer Name:
Polyphthalamide (PPA)
Processing Methods:
Injection Molding
Fillers Included:
PTFE, Carbon Fiber
Additives Included:
Heat Stabilizer, Lubricant (PTFE), Mold Release Agent
Flexural Modulus:
19640.0 - 19640.0 MPa
SABIC's Specialties Business LNP LUBRICOMP UX06427 compound is based on Polyphthalamide (PPA) resin containing 30% carbon fiber, 15% PTFE. Added features of this grade include: Heat Stabilized, Hot Water Moldable, Wear Resistant, Electrically Conductive.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound AE002
Polymer Name:
Acrylonitrile Butadiene Styrene (ABS)
Fillers Included:
Carbon Fiber
Processing Methods:
Injection Molding
SABIC's Specialties Business LNP STAT-KON AE002 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 10% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
NORYL™ Resin 115EM4A
Polymer Name:
PPO/PS Alloy
Processing Methods:
Injection Molding
Density:
1160.0 - 1160.0 kg/m³
Flexural Modulus:
3340.0 - 3340.0 MPa
NORYL 115EM4A compound is based on Polyphenylene Ether (PPE) resin containing conductive carbon powder and minerals. Added features of this grade include: Electrically Conductive.
Mitsubishi Chemical Group Corporation
Semitron® ESd 420V PEI
Polymer Name:
Polyether Imide (PEI)
Physical Form:
Plates, Tube, Rods
Features:
Static-Dissipative, High Stiffness, High Strength, High Tolerance, ESD Protection, Odorless, Dimensional Stability
Density:
1480.0 - 1480.0 kg/m³
Tensile Modulus:
5450.0 - 5450.0 MPa
Color (Properties):
Black
Semitron® ESd 420V PEI Polyetherimide electro static dissipative shapes, a high-performance material designed for use in the semiconductor and electronics industries. With its unique combination of properties, this grade offers a range of benefits for device handling and test applications.Features:High strength and stiffness, making it suitable for extreme structural applicationsExcellent resistivity in the 10E5 to 10E8 ohms per square range, ensuring reliable electrostatic dissipationHeat deflection temperature of 419° F / 215° C, making it suitable for high temperature environmentsNot subject to dimensional change as a result of exposure to moistureBenefits:Suitable for use in a range of applications within the semiconductor and electronics industriesOffers reliable performance in extreme conditionsCost-effective alternative for applications that do not require the thermal performance of ultra-high performance materialsApplications:Device handling and test applications within the semiconductor and electronics industriesSuitable for use in high temperature environments, including extreme structural applications.
Mitsubishi Chemical Group Corporation
METABLEN™ S 2130
Functions:
Impact Modifier
Compatible Polymers & Resins:
Acrylonitrile Butadiene Styrene (ABS), Poly(Methyl Methacrylate) (PMMA), Polyamides, Polycarbonates (PC), Polyesters, Polylactic Acid (PLA)
Processing Methods:
Injection Molding
End Uses:
Semiconductor Applications, Battery Cases
METABLEN™ S 2130 is a silicone-acrylic-based rubber impact modifier optimized for flame retardant polycarbonate (PC) resins. It adds colorability, heat-aging resistance and impact strength to PC and polycarbonate blends in automotive, aerospace, consumer goods, and electric and electronic applications.FeaturesWeather stabilityHydrolysis resistanceImpact resistance even at low temperatures*METABLEN™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX7400N
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Coupling Agent, Impact Modifier, Binder & Resin, Adhesion Promoter, Resin
Chemical Family:
Epoxy & Epoxy Derivatives
End Uses:
Conformal Coating, Semiconductor Applications
Features:
Good Elasticity, Reduced Wear, Excellent Elasticity, High Impact Resistance, Improved Flexibility, Excellent Resilience, Abrasion Resistance, Improved Dimensional Stability, Impact Resistance, Good Mechanical Properties
jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
Altron™ PC
Polymer Name:
Polycarbonate (PC)
Physical Form:
Plates
Features:
Amorphous, High Strength, Low Moisture Absorption, High Modulus of Elasticity, Good Electrical Properties, High Tolerance, High Impact Resistance, Excellent Dielectric Properties, Acid Resistant, UV Stabilized, Good Impact Strength
Density:
1200.0 - 1200.0 kg/m³
Tensile Modulus:
2400.0 - 2400.0 MPa
Color (Properties):
Transparent
Altron™ 1000 PC machine grade polycarbonate is a transparent, amorphous thermoplastic that offers exceptional impact strength and elasticity, minimal moisture absorption, and outstanding resistance to acidic solutions. This grade is produced from select batches of non-UV stabilized polycarbonate resin that complies with EU and FDA regulations for plastics intended to come into contact with food products.Features:Transparent, amorphous thermoplasticSuperior impact strengthSuperior flexural modulus of elasticityMinimal moisture absorptionOutstanding resistance to acidsGreat electrical characteristicsBenefits:Durable and able to withstand high impactsResistant to deformation under loadLow moisture absorption means no swelling or warpingResistant to acidic solutions, making it suitable for a variety of applicationsExcellent electrical characteristics, making it suitable for semiconductor and electronics applicationsApplications:Semiconductor and electronics applicationsTransparent structural applicationsFood contact applications that comply with EU and FDA regulations
Mitsubishi Chemical Group Corporation
Semitron® HPV ESd PEEK
Polymer Name:
Polyetheretherketone (PEEK)
Physical Form:
Rods
Features:
High Tolerance, Good Machinability, ESD Protection, Low Friction, Dimensional Stability, Anti-Static, Static-Dissipative, Anti-Wear Properties
Color (Properties):
Black
Semitron® HPV ESd PEEK shapes are specially formulated with specific additives that make them an excellent performer in wear and friction applications where antistatic properties are essential. These shapes are specifically designed for electronic fixture applications that require a high degree of dimensional stability over an extended thermal range, as well as precise machinability.Features:Contains specific additives that provide excellent performance in wear and friction applicationsAntistatic properties for electronic fixture applicationsHigh dimensional stability over an extended thermal rangePrecise machinabilityBenefits:Improved performance in wear and friction applicationsReduced risk of static discharge damage to electronic componentsLong-lasting dimensional stability in high-temperature environmentsEasy to machine for precise applicationsApplications:Electronic fixture applications such as test sockets, contactors, and nestsWear and friction applications where antistatic properties are essentialHigh-temperature applications that require dimensional stability and precise machiningVacuum chamber components and other semiconductor equipment.
Mitsubishi Chemical Group Corporation
Duratron® PEI U2300
Polymer Name:
Polyether Imide (PEI)
Physical Form:
Rods, Plates
Features:
High Tolerance, High Strength to Weight Ratio, Heat Resistance, Low Odor, High Rigidity, Food Contact Acceptable, Flame Retardant, Dimensional Stability, Amorphous, High Tensile Strength, Low Thermal Expansion, High Strength
Density:
1510.0 - 1510.0 kg/m³
Tensile Modulus:
5513.6 - 5513.6 MPa
Color (Properties):
Brown
Duratron® U2300 PEI, a flame resistant Polyetherimide that offers exceptional rigidity, strength, dimensional stability, and heat resistance. With 30% glass-reinforcement, Duratron® U2300 PEI is the most durable and high-performance plastic offered in the Duratron® PEI line.Features:30% glass-reinforced for highest rigidity, strength, dimensional stability, and heat resistanceFlame resistantLowest Coefficient of Linear Thermal ExpansionSuperior strength-to-weight ratio and tensile strengthBenefits:Ideal for reusable medical devices, analytical instruments, electrical insulators and semiconductor process components, and structural components that require high strength and rigidity at elevated temperaturesCan withstand harsh conditions and high temperaturesSuitable for a wide range of applicationsApplications:Reusable medical devicesAnalytical instrumentsElectrical insulatorsSemiconductor process componentsStructural components that require high strength and rigidity at elevated temperaturesDuratron® U2300 PEI is the perfect choice for those looking for a high-performance plastic that can withstand harsh conditions and high temperatures. Whether you are looking to improve the performance of your reusable medical devices, analytical instruments, electrical insulators and semiconductor process components, or need a material that can withstand high temperatures and harsh environments, Duratron® U2300 PEI is the ideal solution. Try it today and experience the difference for yourself!
Mitsubishi Chemical Group Corporation
jER™ YL980
Polymer Name:
Epoxy Resins & Compounds
Functions:
Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials, Coupling Agent, Resin
Chemical Family:
Bisphenol Epoxy Resins, Bisphenol A Type Epoxy, Epoxy & Epoxy Derivatives
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Steel, Concrete, Aluminum, Fibers & Fabrics, Plastics, Ceramic, Metal, Glass
Features:
Chemical Resistance, Improved Flexibility, Excellent Electrical Insulation, Electrically Insulating, Low Chlorine Content, Abrasion Resistance, Chemical Resistant, Good Electrical Properties, Water Resistant, Reduced Wear, Heat Resistance, Flame Retardant, Improved Dimensional Stability, Good Mechanical Properties, Water Resistance
jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
Duratron® U2200 PEI
Polymer Name:
Polyether Imide (PEI)
Physical Form:
Rods, Plates
Features:
High Tolerance, High Strength to Weight Ratio, Low Odor, High Rigidity, Food Contact Acceptable, High Temperature Resistance, Dimensional Stability, Amorphous, High Tensile Strength, Low Thermal Expansion
Density:
1410.0 - 1410.0 kg/m³
Color (Properties):
Brown
Duratron® U2200 PEI Polyetherimide shapes, a high-performance plastic that offers exceptional rigidity, dimensional stability, high temperature resistance, and a low Coefficient of Linear Thermal Expansion. With 20% glass-reinforcement, Duratron® U2200 PEI is a versatile and durable material that is suitable for a wide range of applications.Features:20% glass-reinforced for exceptional rigidity and dimensional stabilityHigh temperature resistanceLow Coefficient of Linear Thermal ExpansionExceptional strength-to-weight ratio and increased tensile strengthGreat electrical insulatorBenefits:Versatile and durable material that can withstand harsh conditionsIdeal for semiconductor and electronics applications where dimensional stability, low thermal expansion and electrical insulation is importantSuitable for a wide range of applicationsApplications:Semiconductor and electronics applicationsElectrical insulationApplications that require dimensional stability, high temperature resistance and low thermal expansionDuratron® U2200 PEI is the perfect choice for those looking for a high-performance plastic that can withstand harsh conditions. Whether you are looking to improve the performance of your semiconductor and electronics applications or need a material that can withstand high temperatures and harsh environments while providing electrical insulation, Duratron® U2200 PEI is the ideal solution.
Mitsubishi Chemical Group Corporation
Semitron® ESd 500 HR PTFE
Polymer Name:
Polytetrafluoroethylene (PTFE)
Physical Form:
Plates, Rods
Features:
High Tolerance, ESD Protection, Good Thermal Stability, Odorless, Thermally Insulating, Low Friction, Dimensional Stability, Low Coefficient of Friction, Static-Dissipative, Chemical Resistant
Color (Properties):
White
Semitron® ESd 500HR Polytetrafluoroethylene PTFE electro static dissipative shapes offer an excellent combination of low frictional properties, outstanding dimensional stability, and a high resistivity range of 10E9 to 10E11 ohms per square. Reinforced with a proprietary synthetic mica, Semitron® ESd 500HR PTFE is thermally stable up to temperatures of 500° F / 260° C without degradation, and possesses high thermal insulation and a low coefficient of friction. Due to these characteristics, this grade is ideal for applications where controlled bleed off of static charges is critical.Features:Reinforced with a proprietary synthetic mica for improved performanceLow frictional properties and outstanding dimensional stabilityHigh resistivity range of 10E9 to 10E11 ohms per squareThermally stable up to temperatures of 500° F / 260° C without degradationHigh thermal insulation and low coefficient of frictionBenefits:Ideal for applications where controlled bleed off of static charges is criticalCan withstand high temperatures without degradationLow coefficient of friction and high thermal insulation provide improved performance in various applicationsApplications:Inserts for sensitive devices to reduce damage from static dischargeOther applications where controlled bleed off of static charges is critical and PTFE is typically used.Suitable for use in various industries including semiconductor and electronics, aerospace, and industrial machinery.
Mitsubishi Chemical Group Corporation
Semitron® MPR-1000
Polymer Name:
Polyamide-imide (PAI)
Physical Form:
Plates, Rods
Features:
High Tolerance, Good Machinability, Low Outgassing, Chipping Resistance, High Durability, Very Good Heat Resistance
Density::
1470.0 - 1470.0 kg/m³
Tensile Modulus:
6050.0 - 6050.0 MPa
Color (Properties):
Brown, Yellow
Semitron® MPR 1000 - an advanced engineering material that is specially developed for use in the semiconductor and electronics industry. This material boasts excellent heat resistance and low erosion rates in plasma chambers, making it a top choice for vacuum chamber applications such as etch, CVD, and ion implant.Features:Longevity: Increased life in plasma chambers (up to 25X over polyimide in ozone)Clean: Low ionic metal content and low out-gassingValue: Lower overall cost in use compared to traditional materials used in vacuum chamber applications such as quartz, ceramics, and engineering plasticsBenefits:Long-lasting performance in plasma-based vacuum chambersLow maintenance and cost-effective solutionClean and efficient, suitable for semiconductor and electronics industryApplications:Clamp ringsTrench ringsScrewsPinsShower headsCentering pinsFocus ringsInsulatorsVacuum padsWafer guidesSemitron® MPR 1000 is a versatile material that is ideal for use in vacuum chamber applications within the semiconductor and electronics industry. With its outstanding heat resistance and low erosion rates, this material is a cost-effective and efficient solution that ensures longevity and clean performance in plasma-based vacuum chambers.
Mitsubishi Chemical Group Corporation
jER™ YX7105
Polymer Name:
Epoxy Resins & Compounds
Functions:
Impact Modifier, Coupling Agent, Binder & Resin, Adhesion Promoter, Resin, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces:
Ceramic, Fibers & Fabrics, Glass, Aluminum, Concrete, Steel, Plastics, Metal
jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
Semitron® MP-370
Polymer Name:
Polyetheretherketone (PEEK)
Physical Form:
Plates
Features:
High Strength, Good Stability, Low Moisture Absorption, High Tolerance, Good Machinability, Excellent Toughness, High Performance, Good Thermal Stability, Odorless, Dimensional Stability
Density::
1650.0 - 1650.0 kg/m³
Tensile Modulus:
4450.0 - 4450.0 MPa
Color (Properties):
Grey
Semitron® MP 370 shapes exhibit excellent moisture absorption and thermal resistance, while also maintaining outstanding strength and dimensional stability. As a result, this grade is often selected for test socket applications where precision machining is critical, and complex geometries are prevalent.Features:Excellent moisture absorptionHigh thermal resistanceOutstanding strength and dimensional stabilityExcellent machinabilityBenefits:Allows for precision machining and complex geometries in test socket applicationsProvides greater strength and dimensional stability compared to unfilled PEEK materialsLow internal stresses and no "soft center" issues associated with injection molded blanksApplications:Test sockets for the semiconductor manufacturing industryPrecision machining and complex geometries in various industries where high thermal resistance and moisture absorption are required.
Mitsubishi Chemical Group Corporation
Ketron® 1000 PEEK
Polymer Name:
Polyetheretherketone (PEEK)
Physical Form:
Tube, Plates, Rods
Features:
Chemical Resistant, High Tolerance, General Purpose, Excellent Aesthetics, Excellent Toughness, High Elongation, High Performance, Steam Resistant, Wear Resistant, Ductile
Density::
1310.0 - 1310.0 kg/m³
Tensile Modulus:
4300.0 - 4300.0 MPa
Color (Properties):
Black, Tan
Ketron® 1000 PEEK is a high-performance polymer that offers excellent mechanical properties and chemical resistance. It is widely used in a variety of applications where high strength and stiffness, low friction, and excellent dimensional stability are required. This material is ideal for instrument and seal components, where its high elongation and toughness make it an excellent choice. Its non-toxic and biocompatible properties make it suitable for use in medical and food processing applications. Key features: High strength and stiffness Low friction Excellent dimensional stability High elongation and toughness EU 10/2011 and FDA compliant Benefits: Improved performance and durability of components Increased resistance to chemicals and high temperatures Enhanced biocompatibility and safety in medical and food processing applications Greater design flexibility and compatibility with a wide range of applications and industries Application: Structural parts: Ketron® PEEK is often used for structural components that are subject to high temperatures and chemical exposure. For example, it is commonly used for vacuum wand handles in semiconductor manufacturing. Bushings, bearings, seals, and back-up rings: Ketron® PEEK is an excellent choice for components that are subject to wear and tear. Its low coefficient of friction and high strength make it suitable for use in a wide range of applications, from aircraft to oil field drilling. Ketron® 1000 PEEK is available in a range of shapes and sizes, making it easy to incorporate into your designs. It is a versatile and reliable material that can help improve the performance and longevity of your products.
Mitsubishi Chemical Group Corporation
Duratron® PI D7000
Polymer Name:
Polyimide (PI)
Physical Form:
Sheets, Tube, Rods
Features:
High Strength, Service Life Extension, Chemical Resistant, High Tolerance, Light Weight, Excellent Toughness, High Temperature Resistance, Good Mechanical Properties, Cost Effective, Dimensional Stability, Electrically Insulating, Thermally Insulating
Density::
1380.0 - 1380.0 kg/m³
Tensile Modulus:
3700.0 - 3700.0 MPa
Color (Properties):
Brown
Duratron® D7000 PI Polyimide shapes - a high-performance material ideal for demanding applications that require exceptional thermal resistance, low wear and friction, strength, and impact resistance. With superior electrical and thermal insulation properties, outstanding mechanical performance, great chemical resistance, and outstanding dimensional stability, Duratron® D7000 PI is an ideal solution for designs that reduce weight, extend service life, and reduce overall costs.Features:Superior electrical and thermal insulation propertiesOutstanding mechanical performanceGreat chemical resistanceHigh strength and toughnessOutstanding dimensional stabilityBenefits:Ideal for designs that reduce weightExtends service life before maintenance or replacementReduces overall costs by increasing process uptimeApplications:AerospaceTransportationIndustrialDuratron® D7000 PI is available in stock shapes and direct formed parts, perfect for smaller series and designs where tolerances and geometry of the end part require machining. The material is also available in Hot Compression Molded (HCM) shapes, providing designers with the greatest economy and flexibility.
Mitsubishi Chemical Group Corporation
jER™ YX8040
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resin, Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
Labeling Claims:
High Purity
jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
METABLEN™ S 2001
Functions:
Impact Modifier
Compatible Polymers & Resins:
Recycled Plastics, Polyamides, Acrylonitrile Butadiene Styrene (ABS), Polyvinyl Chloride (PVC), Polybutylene Terephthalate (PBT), Polylactic Acid (PLA), Polycarbonates (PC), Poly(Methyl Methacrylate) (PMMA), Polyesters
Processing Methods:
Injection Molding
End Uses:
Semiconductor Applications, Battery Cases, Appliances
METABLEN™ S 2001 is a silicone-acrylic rubber-type impact modifier with high impact strength in all temperatures and excellent weatherability. It can be used with ABS, PC, PLA, and other matrix resins in a variety of automotive, aerospace and electric and electronic applications. Features Can be used with recycled plastics Good weather stability Low temperature impact resistance *METABLEN™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
Semitron® MDS 100
Polymer Name:
Polyetheretherketone (PEEK)
Physical Form:
Plates, Rods
Features:
High Strength, Good Stability, Low Moisture Absorption, High Stiffness, High Tolerance, Good Machinability, High Rigidity, High Performance, Moisture Resistant, Odorless, Dimensional Stability
Density::
1510.0 - 1510.0 kg/m³
Tensile Modulus:
11000.0 - 11000.0 MPa
Color (Properties):
Grey
Semitron® MDS 100 modified Polyetheretherketone PEEK shapes offer a remarkable combination of strength, stiffness, and stability. This grade in particular was developed for use in uncontrolled application environments where a high level of precision is required. Due to this, Semitron® MDS 100 components are often used as test sockets, nests, and fixtures in test and package equipment throughout the semiconductor and electronics industry.Features:Remarkable combination of strength, stiffness, and stabilityDeveloped for use in uncontrolled application environments where a high level of precision is requiredMoisture absorption of 0.10% at 24 hrs. (per ASTM D570)Thermal performance to 210 °C (410 °F)Flexural modulus > 1,400,000 psiBenefits:Ideal for test sockets, nests and fixtures in test and package equipmentSuitable for use in semiconductor and electronics industryCan withstand harsh, uncontrolled environmentsLow moisture absorption ensures dimensional stabilityHigh thermal performance and flexural modulus ensures durability and precisionApplications:Test sockets, nests and fixtures in test and package equipmentOther applications in the semiconductor and electronics industry that require a high level of precision and stability in uncontrolled environments.
Mitsubishi Chemical Group Corporation
Semitron® CMP XL20
Polymer Name:
Polyamide-imide (PAI)
Physical Form:
Tube, Plates, Rods
Features:
High Strength, High Stiffness, High Tolerance, Cost Effective, Wear Resistant, Odorless
Density::
1400.0 - 1400.0 kg/m³
Tensile Modulus:
3962.9 - 3962.9 MPa
Color (Properties):
Green
Semitron® CMP XL20 Polyamideimide PAI shapes were specifically developed for CMP ring applications in the semiconductor and electronics industry, due to their excellent long wear life in CMP slurries. In addition to these characteristics, Semitron® CMP XL20 PAI components display high strength and stiffness, and outstanding wear resistance over a broad range of temperatures, making this grade the ideal solution for dynamic applications in process environments.Features:Specifically developed for CMP ring applications in the semiconductor and electronics industryExcellent long wear life in CMP slurriesHigh strength and stiffnessOutstanding wear resistance over a broad range of temperaturesBenefits:Ideal solution for dynamic applications in process environmentsSignificantly lower cost per waferOutperforms PPS up to 20x in most processesPromotes fewer edge defects and better uniformityApplications:CMP ring applications in the semiconductor and electronics industryCan be used in clamp rings, trench rings, screws, pins, and shower headsSuitable for use in centering pins, focus rings, insulators, vacuum pads, and wafer guides.
Mitsubishi Chemical Group Corporation
Semitron® ESd 480 PEEK
Polymer Name:
Polyetheretherketone (PEEK)
Physical Form:
Tube, Plates, Rods
Features:
Static-Dissipative, Chemical Resistant, High Tolerance, ESD Protection, Odorless, Dimensional Stability
Density::
1460.0 - 1460.0 kg/m³
Tensile Modulus:
5900.0 - 5900.0 MPa
Color (Properties):
Black
Semitron® ESd 480 Polyetheretherketone PEEK electro static dissipative shapes are a top choice for critical test fixture and wafer handling applications in wet process tools, where static dissipation is critical. These shapes are specifically designed to provide excellent chemical resistance properties and high dimensional stability under varying environmental conditions.Features:Excellent chemical resistance propertiesHigh dimensional stability under varying environmental conditionsSurface resistivity: 106 - 109 ohms/sqBenefits:Ideal for critical test fixture and wafer handling applications in wet process toolsProvides a dissipative range of 106 - 109 ohms/sq, ensuring static dissipation is criticalDimensionally stable, making it ideal for critical test fixture applicationsApplications:Test fixture and wafer handling applications in wet process toolsStructural applications in wet process tools where static dissipation is importantWell-suited for use in wafer handling and other structural applications in wet process tools where static dissipation is important.
Mitsubishi Chemical Group Corporation
METABLEN™ S X-005
Functions:
Impact Modifier
Compatible Polymers & Resins:
Polyolefins, Polylactic Acid (PLA), Poly(Methyl Methacrylate) (PMMA), Polyesters, Polyethylenes (PE), Polypropylenes (PP), Polyamides, Acrylonitrile Butadiene Styrene (ABS), Polyvinyl Chloride (PVC), Polybutylene Terephthalate (PBT), Polycarbonates (PC)
Processing Methods:
Injection Molding
End Uses:
Semiconductor Applications, Battery Cases, Appliances
METABLEN™ S X-005 is a silicone-acrylic rubber-type impact modifier that provides flame retardance, hydrolysis resistance and impact strength. It is used for polycarbonates (PC) and polycarbonate blends in automotive, aerospace, consumer goods, and electric and electronic applications.FeaturesFlame retardantWeather stabilityHydrolysis resistanceImpact resistance even at low temperaturesLow friction*METABLEN™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ Epoxy YX7110
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resin, Impact Modifier, Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jER™ YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
METABLEN™ S 2100
Functions:
Impact Modifier
Compatible Polymers & Resins:
Polyamides, Acrylonitrile Butadiene Styrene (ABS), Polyvinyl Chloride (PVC), Polybutylene Terephthalate (PBT), Polylactic Acid (PLA), Polycarbonates (PC), Poly(Methyl Methacrylate) (PMMA), Polyesters
Processing Methods:
Injection Molding
End Uses:
Semiconductor Applications, Battery Cases, Appliances
METABLEN™ S 2100 is a silicone-acrylic-based rubber impact modifier with good colorability and impact strength. It is used for polycarbonates (PC) and polycarbonate blends, polyvinyl chloride, engineering plastics and polyolefins in a variety of automotive, aerospace, consumer goods, and electric and electronic applications. METABLEN™ S-2100 provides ductility on facial impact tests, even after immersion of coating chemicals. The effect is maintained at higher molding temperatures. BenefitsEasy to processFlame retardancy for engineering plastics and polyolefins elastomersFeaturesGood colorabilityWeather stabilityHydrolysis resistanceImpact resistance even at low temperatures*METABLEN™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ 1750
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resin, Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol F Type Epoxy
Labeling Claims:
High Purity
jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
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