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1,067 Products found in Semiconductor Manufacturing
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Mitsubishi Chemical Group Corporation
METABLEN™ S 2100
Functions:
Impact Modifier
Compatible Polymers & Resins:
Polyamides, Acrylonitrile Butadiene Styrene (ABS), Polyvinyl Chloride (PVC), Polybutylene Terephthalate (PBT), Polylactic Acid (PLA), Polycarbonates (PC), Poly(Methyl Methacrylate) (PMMA), Polyesters
Processing Methods:
Injection Molding
End Uses:
Semiconductor Applications, Battery Cases, Appliances
METABLEN™ S 2100 is a silicone-acrylic-based rubber impact modifier with good colorability and impact strength. It is used for polycarbonates (PC) and polycarbonate blends, polyvinyl chloride, engineering plastics and polyolefins in a variety of automotive, aerospace, consumer goods, and electric and electronic applications. METABLEN™ S-2100 provides ductility on facial impact tests, even after immersion of coating chemicals. The effect is maintained at higher molding temperatures. BenefitsEasy to processFlame retardancy for engineering plastics and polyolefins elastomersFeaturesGood colorabilityWeather stabilityHydrolysis resistanceImpact resistance even at low temperatures*METABLEN™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ 1750
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resin, Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol F Type Epoxy
Labeling Claims:
High Purity
jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
Sultron® PSU
Polymer Name:
Polysulfone (PSU)
Physical Form:
Plates
Features:
Good Electrical Properties, Chemical Resistant, High Tolerance, Acid Resistant, Detergent Resistant, Hot Water Resistant, High Temperature Resistance, Translucent, Salt Water/Spray Resistant, Good Mechanical Properties, Steam Resistant, Good Thermal Stability, Odorless, Radiation Resistant
Density::
1240.0 - 1240.0 kg/m³
Tensile Modulus:
2850.0 - 2850.0 MPa
Color (Properties):
Yellow
Sultron® Polysulfone PSU is a versatile and reliable thermoplastic material that offers a combination of excellent mechanical, thermal, and electrical properties. With its ability to withstand high temperatures and resist a wide range of chemicals, Sultron® PSU is the ideal solution for applications that demand the highest level of performance and durability. Features: Translucent material with excellent mechanical, thermal, and electrical properties Often replaces polycarbonate in applications requiring higher temperature resistance and improved chemical resistance Outstanding radiation stability and resistance to acidic and salt solutions, detergents, hot water, and steam Benefits: Broad temperature range capability makes Sultron® PSU suitable for a wide range of applications Good thermal and electrical insulation characteristics ensure consistent performance in demanding environments Hydrolysis resistant and radiation stable, making it a reliable choice for analytical instrumentation, medical devices, and semiconductor process equipment components Applications: Analytical instrumentation Medical devices Semiconductor process equipment components Any application that demands high temperature resistance and chemical resistance.
Mitsubishi Chemical Group Corporation
Duratron® U2100 PEI
Polymer Name:
Polyether Imide (PEI)
Physical Form:
Plates, Rods
Features:
High Tolerance, Food Contact Acceptable, High Rigidity, High Strength to Weight Ratio, Low Odor, Low Thermal Expansion, Dimensional Stability, Amorphous, High Tensile Strength
Density::
1340.0 - 1340.0 kg/m³
Tensile Modulus:
4135.2 - 4135.2 MPa
Color (Properties):
Brown
Duratron® U2100 PEI Polyetherimide shapes, a high-performance plastic that offers exceptional rigidity, dimensional stability, and a low Coefficient of Linear Thermal Expansion. With 10% glass-reinforcement, Duratron® U2100 PEI is a versatile and durable material that is suitable for a wide range of applications.Features:10% glass-reinforced for great rigidity and dimensional stabilityLow Coefficient of Linear Thermal ExpansionExcellent strength-to-weight ratio and tensile strengthBenefits:Versatile and durable material that can withstand harsh conditionsIdeal for semiconductor and electronics applications where dimensional stability and low thermal expansion is importantSuitable for a wide range of applicationsApplications:Semiconductor and electronics applicationsApplications that require dimensional stability and low thermal expansionDuratron® U2100 PEI is the perfect choice for those looking for a high-performance plastic that can withstand harsh conditions. Whether you are looking to improve the performance of your semiconductor and electronics applications or need a material that can withstand high temperatures and harsh environments, Duratron® U2100 PEI is the ideal solution. Try it today and experience the difference for yourself!
Mitsubishi Chemical Group Corporation
Duratron® U1000 PEI
Polymer Name:
Polyether Imide (PEI)
Physical Form:
Rods
Features:
High Strength, Chemical Resistant, High Tolerance, Food Contact Acceptable, Excellent Dielectric Properties, Heat Resistance, Flame Retardant, Odorless, Dimensional Stability, Excellent Hydrolysis Resistance, Amorphous
Density::
1300.0 - 1300.0 kg/m³
Tensile Modulus:
6000.0 - 6000.0 MPa
Color (Properties):
Amber, Transparent
Duratron® U1000 PEI Polyetherimide shapes, a high-performance plastic that offers exceptional strength, dimensional stability, and flame and heat resistance. With the ability to perform continuously to 340°F / 170°C, Duratron® U1000 PEI is the ideal solution for applications that require consistent dielectric properties over a wide frequency range.Features:High strengthDimensional stabilitySuperior flame and heat resistancePerform continuously to 340°F / 170°CHydrolysis and chemical resistanceBenefits:Suitable for a variety of applications requiring high strength and rigidity at elevated temperaturesCan withstand repeated autoclaving cycles making it ideal for medical, pharmaceutical, and biotechnology marketsHydrolysis and chemical resistance make it suitable for electrical / electronic insulators and semiconductor process componentsApplications:Medical and pharmaceutical industryBiotechnology marketElectrical / electronic insulatorsSemiconductor process componentsStructural components requiring high strength and rigidity at elevated temperaturesDuratron® U1000 PEI is the perfect choice for those looking for a high-performance plastic that can withstand harsh conditions. Whether you are looking to improve the performance of your medical, pharmaceutical, or biotechnology applications or need a material suitable for electrical/electronic insulators and semiconductor process components, Duratron® U1000 PEI is the ideal solution.
Mitsubishi Chemical Group Corporation
Semitron® ESd 410C PEI
Polymer Name:
Polyether Imide (PEI)
Physical Form:
Plates, Rods
Features:
Static-Dissipative, Low Thermal Expansion, Low Water Absorption, High Tolerance, ESD Protection, Odorless, Dimensional Stability
Density::
1410.0 - 1410.0 kg/m³
Tensile Modulus:
5850.0 - 5850.0 MPa
Color (Properties):
Black
Semitron® ESd 410C PEI Polyetherimide electro static dissipative shapes are the perfect solution for semiconductor and electronics handling environments. These shapes offer exceptional dimensional stability and can withstand temperatures up to 410º F without degradation. The unique properties of Semitron® ESd 410C PEI make it ideal for a wide range of applications, including handling tray, circuit board, hard disk drive, and sensitive processing equipment applications.Features:Surface resistivity of 104 - 106 ohms/sq.Thermal performance to 210 °C (410 °F)Low stress for tight tolerance machiningHigh strength and stiffnessBenefits:Excellent dimensional stabilityResistant to high temperaturesLow stress for tighter tolerances during machiningReduced coefficient of linear thermal expansionMinimal water absorptionApplications:Handling Trays: Trays manufactured from Semitron® ESd 410C dissipate static charges reliably and are dimensionally stable. (Prior materials: PPS, PEEK, Vespel® PI)Circuit Boards: Semitron ESd 410C is ideal for use in circuit boards as it offers excellent dimensional stability and can withstand high temperatures without degradation.Hard Disk Drives: Semitron ESd 410C is an ideal material for use in hard disk drives due to its high strength, low stress properties and exceptional dimensional stability.Sensitive Processing Equipment: Semitron ESd 410C offers low stress properties, minimal water absorption and high strength making it an ideal choice for use in sensitive processing equipment.
Mitsubishi Chemical Group Corporation
jER™ YL983U
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials, Resin
Chemical Family:
Epoxy & Epoxy Derivatives, Bisphenol F Type Epoxy, Bisphenol Epoxy Resins
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Steel, Concrete, Aluminum, Fibers & Fabrics, Metal, Plastics, Glass, Ceramic
Features:
Good Elastic Recovery, Excellent Electrical Insulation, Low Chlorine Content, Abrasion Resistance, Improved Dimensional Stability, Electrically Insulating, Good Electrical Properties, Good Elastic Recovery, Improved Flexibility, Water Resistant, Reduced Wear, Heat Resistance, Good Mechanical Properties, Chemical Resistant, Low Viscosity, Water Resistance, Chemical Resistance
jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
Duratron® T5530 PAI
Polymer Name:
Polyamide-imide (PAI)
Physical Form:
Tube, Plates, Rods
Features:
Good Electrical Properties, High Tolerance, High Rigidity, Creep Resistant, Low Thermal Expansion, Temperature Resistance, Odorless, High Loading Absorption Capability, Dimensional Stability, Good Stiffness
Density::
1600.0 - 1600.0 kg/m³
Tensile Modulus:
6892.0 - 6892.0 MPa
Duratron® T5530 PAI is a high-performance, glass-reinforced polyamide-imide material that offers exceptional rigidity, retention of stiffness, low thermal expansion, and outstanding load-carrying capabilities. This 30% glass-reinforced grade is ideal for structural applications in the semiconductor, electronics, and aerospace industries, where high strength, stiffness, and dimensional stability are required.Features:High rigidity and retention of stiffnessLow thermal expansionOutstanding load-carrying capabilities30% glass reinforced for added strength and stiffnessBenefits:Suitable for structural applications in harsh environmentsOffers exceptional dimensional stability up to 260°CIdeal for precision parts in the electronic and semiconductor industriesApplications:Aerospace and defenseSemiconductor and electronicsIndustrial machinery and equipmentMedical devicesPrecision parts in high-temperature environmentsNote: The suitability of Duratron T5530 PAI for sliding parts should be carefully evaluated as the glass fibers may cause abrasion to the mating surface.
Mitsubishi Chemical Group Corporation
jER™ YX8000D
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Coupling Agent, Binder & Resin, Adhesion Promoter, Resin
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
End Uses:
Radiation Curable Coating, Semiconductor Applications
Compatible Substrates & Surfaces:
Steel, Fibers & Fabrics, Concrete, Aluminum, Metal, Plastics, Glass, Ceramic
Features:
Transparency, Fast Cure, Radiation Curable, UV Curable, Low Chlorine Content, Faster Cure Time, LED-curable, Excellent Adhesion
jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
Semitron® ESd 490HR PEEK
Polymer Name:
Polyetheretherketone (PEEK)
Physical Form:
Tube, Plates, Rods
Features:
Static-Dissipative, High Strength, Non Sloughing, High Stiffness, High Tolerance, ESD Protection, Good Thermal Stability, Odorless, Dimensional Stability
Color (Properties):
Black
Semitron® ESd 490HR Polyetheretherketone PEEK electro static dissipative shapes offer similar physical properties as Semitron® ESd 480 PEEK, but exhibit a higher resistivity value in the 10E8 to 10E10 ohms per square range. Semitron® ESd 490HR PEEK components are thermally stable to temperatures of 490° F / 270° C without degradation, and also possess high structural strength and stiffness combined with excellent dimensional stability. Furthermore, this particular grade is non-sloughing, which is why it is an ideal solution for socket, nest, and contactor manufacturing for test equipment, and other electronic device handling applications.Features:High resistivity value in the 10E8 to 10E10 ohms per square rangeThermally stable to temperatures of 490° F / 270° C without degradationHigh structural strength and stiffnessExcellent dimensional stabilityNon-sloughingBenefits:Ideal for socket, nest, and contactor manufacturing for test equipmentSuitable for electronic device handling applicationsNon-sloughing feature makes it a good option for applications where debris generation is a concernHigh thermal stability and dimensional stability make it suitable for high-temperature and critical applicationsApplications:Socket, nest, and contactor manufacturing for test equipmentElectronic device handling applicationsOther high-temperature and critical applications requiring high resistivity, thermal stability, and dimensional stability.
Mitsubishi Chemical Group Corporation
jER™ YX4000
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Binder & Resin, Adhesion Promoter, Resin, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces:
Ceramic, Fibers & Fabrics, Glass, Aluminum, Concrete, Steel, Plastics, Metal
jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
METABLEN™ S 2200
Functions:
Impact Modifier
Compatible Polymers & Resins:
Polyamides, Acrylonitrile Butadiene Styrene (ABS), Polyvinyl Chloride (PVC), Polybutylene Terephthalate (PBT), Polylactic Acid (PLA), Polycarbonates (PC), Poly(Methyl Methacrylate) (PMMA), Polyesters
Processing Methods:
Injection Molding
End Uses:
Semiconductor Applications, Battery Cases, Appliances
METABLEN™ S 2200 is a silicone-acrylic-based rubber impact modifier with an epoxy-modified shell.Compatible with Polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyamide (PA) and alloy, it provides hydrolysis resistance, heat-aging resistance and impact strength for a wide range of automotive, aerospace and electric and electronic applications.FeaturesWeather stabilityHydrolysis resistanceImpact resistance even at low temperatures *METABLEN™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group
Mitsubishi Chemical Group Corporation
Duratron® CU60 PBI
Polymer Name:
Polybenzimidazole (PBI)
Physical Form:
Tube, Plates, Rods
Features:
Heat Resistance, Thermally Insulating, High Tolerance, Good Mechanical Properties, Wear Resistant, Odorless, High Loading Absorption Capability
Density::
1300.0 - 1300.0 kg/m³
Tensile Modulus:
6000.0 - 6000.0 MPa
Color (Properties):
Black
Duratron® CU60 PBI, the ultimate engineering plastic for high-performance applications. This advanced material is made from Polybenzimidazole (PBI) and is the highest performing engineering plastic offered by Mitsubishi Chemical Advanced Materials. With superior mechanical properties, heat resistance, and mechanical property retention over 400°F / 205°C, Duratron® CU60 PBI is the ideal choice for applications where extreme temperatures and high loads are present.Features:Superior mechanical properties, heat resistance, and mechanical property retention over 400°F / 205°CBetter wear resistance and load carrying capabilities at extreme temperatures than any other reinforced or unreinforced advanced engineering plastic"Clean" in terms of ionic impurity and does not outgas (except water)Excellent ultrasonic transparency, making it an ideal choice for probe tip lenses in ultrasonic measuring equipmentExcellent thermal insulation, other plastics in melt do not stick to Duratron CU60 PBIBenefits:Duratron® CU60 PBI offers unmatched performance in high-heat applications, making it ideal for high heat bushings, connectors, valve seats, and probe tip lenses in semiconductor manufacturingIts superior wear resistance and load carrying capabilities make it a great choice for aerospace and other high-performance industriesIts "clean" characteristics make it ideal for use in vacuum chamber applications in semiconductor manufacturingIts excellent thermal insulation and non-stick properties make it ideal for contact seals and insulator bushings in plastic production and molding equipmentDuratron CU60 PBI is an ideal replacement for metals and ceramics in pump components, valve seats, bearings, rollers, and high-temperature insulatorsApplications:High-performance vacuum chamber applications in semiconductor manufacturingAerospace and other high-performance industriesHigh heat bushings, connectors, valve seats, and probe tip lensesContact seals and insulator bushings in plastic production and molding equipmentPump components, valve seats, bearings, rollers, and high-temperature insulatorsCritical components to decrease maintenance costs and to gain valuable production "uptime".
SABIC's Specialties Business
LNP™ STAT-KON™ Compound PX93058
Polymer Name:
Polyamide 6 (PA 6)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Powder, Carbon Black, Glass Fiber
Additives Included:
Mold Release Agent, Impact Modifier, Heat Stabilizer
Flexural Modulus:
5900.0 - 5900.0 MPa
SABIC's Specialties Business LNP™ STAT-KON™ PX93058 compound is based on Nylon 6 resin containing conductive carbon powder and 20% glass fiber. Added features of this grade include: Electrically Conductive, Easy Molding, Impact Modified.
SABIC's Specialties Business
LNP™ STAT-LOY™ Compound 63000CT
Polymer Name:
PC/Polyester Alloy
Processing Methods:
Injection Molding
Density:
1160.0 - 1160.0 kg/m³
Flexural Modulus:
1140.0 - 1140.0 MPa
SABIC's Specialties Business LNP STAT-LOY 63000CT compound is based on Polycarbonate / Polyester alloy containing proprietary additives suitable for advanced semiconductor packaging applications. Added features of this grade include: LNP Clean Compounding Technology, Permanently Anti-Static, Translucent. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound DD000
Polymer Name:
Polycarbonate (PC)
Additives Included:
Impact Modifier
Fillers Included:
Carbon Powder, Carbon Black
Processing Methods:
Injection Molding
Flexural Modulus:
2890.0 - 2890.0 MPa
SABIC's Specialties Business LNP STAT-KON DD000 compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound REF42I
Polymer Name:
Polyamide 66 (PA 66)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Fiber, Glass Fiber
Additives Included:
Impact Modifier
SABIC's Specialties Business LNP STAT-KON REF42I compound is based on Nylon 6/6 resin containing 10% carbon fiber and 20% glass fiber. Added features of this grade include: Electrically Conductive, Impact Modified. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound PX09011
Polymer Name:
Polyamide 6 (PA 6)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Powder, Carbon Black, Glass Fiber
Additives Included:
Mold Release Agent, Impact Modifier, Heat Stabilizer
Flexural Modulus:
6000.0 - 6000.0 MPa
SABIC's Specialties Business LNP™ STAT-KON™ PX09011 compound is based on Nylon 6 resin containing conductive carbon powder, glass fiber. Added features of this grade include: Electrically Conductive, Easy Molding, Heat Stabilized.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound ZEL34XXC
Polymer Name:
PPO/PS Alloy
Processing Methods:
Injection Molding
Density:
1230.0 - 1230.0 kg/m³
Flexural Modulus:
8100.0 - 8100.0 MPa
SABIC's Specialties Business LNP™ STAT-KON™ ZEL34XXC compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 20% carbon fiber, 15% PTFE. Added features of this grade include: : Electrically Conductive , Internally Lubricated, Wear Resistant.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound DX04489C
Polymer Name:
Polycarbonate (PC)
Fillers Included:
Carbon Fiber
Processing Methods:
Injection Molding
Flexural Modulus:
15530.0 - 15530.0 MPa
SABIC's Specialties Business LNP™ STAT-KON™ DX04489C compound is based on Polycarbonate (PC) resin containing 30% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, High Modulus, Electrically Conductive.
SABIC's Specialties Business
LNP™ LUBRICOMP™ Compound 5CL24
Polymer Name:
Polyvinylidene Fluoride (PVDF)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Fiber, PTFE
Additives Included:
Lubricant (PTFE)
Flexural Modulus:
14820.0 - 14820.0 MPa
SABIC's Specialties Business LNP LUBRICOMP 5CL24 compound is based on Polyvinylidene Fluoride (PVDF) resin containing 10% PTFE and 20% carbon fiber. Added features of this grade include: Wear Resistant, Electrically Conductive.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound REF42XXP
Polymer Name:
Polyamide 66 (PA 66)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Fiber, Glass Fiber
Flexural Modulus:
8700.0 - 8700.0 MPa
SABIC's Specialties Business LNP STAT-KON REF42XXP compound is based on Nylon 6/6 resin containing 20% glass fiber and 10% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound JX89626
Polymer Name:
Polyethersulfone (PES)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Fiber
Additives Included:
Flame Retardant
Flexural Modulus:
9670.0 - 9670.0 MPa
SABIC's Specialties Business LNP STAT-KON JX89626 compound is based on Polyethersulfone (PES) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ LUBRICOMP™ Compound 2X00858
Polymer Name:
Perfluoroethylene Propylene Copolymer (FEP)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber, Proprietary, PTFE
Additives Included:
Mold Release Agent
Flexural Modulus:
870.0 - 870.0 MPa
LNP LUBRICOMP 2X00858 compound is based on Fluorinated ethylene propylene (FEP) resin containing proprietary fillers. Added features of this grade include: Wear Resistant.
SABIC's Specialties Business
LNP™ STAT-LOY™ Compound P3000U
Polymer Name:
Polyamide 6 (PA 6)
Processing Methods:
Injection Molding
Fillers Included:
Talc, Proprietary
Additives Included:
UV Stabilizer, Mold Release Agent, Anti-Static Agent, Light Stabilizer
Flexural Modulus:
1800.0 - 1800.0 MPa
SABIC's Specialties Business LNP STAT-LOY P3000U compound is based on Nylon 6 resin containing proprietary fillers. Added features of this grade include: Permanently Anti-Static, UV - Stabilized. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound AE006
Polymer Name:
Acrylonitrile Butadiene Styrene (ABS)
Fillers Included:
Carbon Fiber
Processing Methods:
Injection Molding
LNP STAT-KON AE006 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
SABIC's Specialties Business
EXTEM™ Resin VH1003P
Polymer Name:
Thermoplastic Polyimide (TPI)
Processing Methods:
Injection Molding
Additives Included:
Flame Retardant
Flexural Modulus:
3080.0 - 3080.0 MPa
SABIC's Specialties Business Transparent, Thermoplastic Polyimide (TPI) resin with a glass transition temperature (Tg) of 247C. Powder version of VH1003. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound DX98477
Polymer Name:
Polycarbonate (PC)
Additives Included:
Impact Modifier
Fillers Included:
Carbon Powder, Carbon Black
Processing Methods:
Injection Molding
Flexural Modulus:
2720.0 - 2720.0 MPa
SABIC's Specialties Business LNP STAT-KON DX98477 compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ COLORCOMP™ Compound EX12304C
Polymer Name:
Polyether Imide (PEI)
Processing Methods:
Injection Molding
Flexural Modulus:
3300.0 - 3300.0 MPa
LNP COLORCOMP EX12304C compound is based on unfilled Polyetherimide (PEI) resin. Added features of this grade include: LNP Clean Compounding Technology.
SABIC's Specialties Business
LNP™ LUBRICOMP™ Compound UCL16AS
Polymer Name:
Polyphthalamide (PPA)
Processing Methods:
Injection Molding
Fillers Included:
PTFE, Carbon Fiber
Additives Included:
Mold Release Agent, Lubricant (PTFE), Heat Stabilizer
Flexural Modulus:
19000.0 - 19000.0 MPa
SABIC's Specialties Business LNP LUBRICOMP UCL16AS compound is based on Polyphthalamide (PPA) resin containing 5% PTFE and 30% carbon fiber. Added features of this grade include: Heat Stabilized, Wear Resistant, Electrically Conductive.
SABIC's Specialties Business
LNP™ FARADEX™ Compound ES003E
Polymer Name:
Polyether Imide (PEI)
Processing Methods:
Injection Molding
Fillers Included:
Stainless Steel Fiber
Flexural Modulus:
4310.0 - 4310.0 MPa
SABIC's Specialties Business LNP FARADEX ES003E compound is based on Polyetherimide (PEI) resin containing 15% stainless steel fiber. Added features of this grade include: Electrically Conductive, EMI/RFI shielding, Easy Molding. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound DEI13F
Polymer Name:
Polycarbonate (PC)
Additives Included:
Lubricant (Silicone)
Fillers Included:
Carbon Fiber, Silicone
Processing Methods:
Injection Molding
SABIC's Specialties Business LNP STAT-KON DEI13F compound is based on Polycarbonate (PC) resin containing 15% carbon fiber, 2% silicone. Added features of this grade include: Electrically Conductive, Superior Molding, Wear Resistant. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound OE002
Polymer Name:
Polyphenylene Sulfide (PPS)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Fiber
Flexural Modulus:
6520.0 - 6520.0 MPa
LNP STAT-KON OE002 compound is based on Polyphenylene Sulfide (PPS) linear resin containing 10% carbon fiber. Added features of this grade include: Electrically Conductive.
SABIC's Specialties Business
LNP™ LUBRICOMP™ Compound 5CL23
Polymer Name:
Polyvinylidene Fluoride (PVDF)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Fiber, PTFE
Additives Included:
Lubricant (PTFE)
Flexural Modulus:
11870.0 - 11870.0 MPa
SABIC's Specialties Business LNP LUBRICOMP 5CL23 compound is based on Polyvinylidene Fluoride (PVDF) resin containing 15% carbon fiber, 10% PTFE. Added features of this grade include: Wear Resistant, Electrically Conductive.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound DX91077
Polymer Name:
Polycarbonate (PC)
Additives Included:
Impact Modifier
Fillers Included:
Carbon Powder, Carbon Black
Processing Methods:
Injection Molding
Flexural Modulus:
2580.0 - 2580.0 MPa
SABIC's Specialties Business LNP STAT-KON DX91077 compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound PFD04S
Polymer Name:
Polyamide 6 (PA 6)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Powder, Carbon Black, Glass Fiber
Additives Included:
Mold Release Agent, Impact Modifier, Heat Stabilizer
Flexural Modulus:
5900.0 - 5900.0 MPa
SABIC's Specialties Business LNP STAT-KON PFD04S compound is based on Nylon 6 resin containing conductive carbon powder and 20%, glass fiber. Added features of this grade include: Electrically Conductive, Heat Stabilized. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
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