Products in Functional Additives

Conductive Silver Spheres (CHS) are highly conductive, low density, spherical powders and particles with a dry bulk resistivity of .001 ohms/cm. Offering seamless electrical continuity of pure silver at a fraction of the cost and weight. The CHS additives are noticeably lighter than solid silver in paints, Composites and adhesive, while providing excellent conductivity, the low particle density of the CSGS and large surface area facilitates slow phase separation in paints and adhesives compared to heavy metallic and organic fillers. The CHS also works well when used as catalysts, laser fusion targets, and electrically conducting bond line spacers in advanced electronics and other applications. The CHS additives are engineered for high conductivity and shielding electromagnetic interference while improving the applications impact strength. The spheres can be customized from size to silver % to fit the application.

AMSil™-F H22 is a hydrophobic silica, fumed and precipitated silicas are used in a wide range of applications

These PTFE powders are Natural Prime PTFE micronized to various particle sizes and are FDA compliant for applications requiring food contact. MicroFLON 1437FG is designed for food contact applications. These applications include: food processing, machine parts, and medical devices.

IsoCoat 401 is an aqueous aromatic polyamide- imide solution which can be utilized for producing coatings where excellent chemical and thermal resistance is required.

Sunspheres™ 200 Nm are optically clear, solid fused amorphous microspheres designed for use in a wide variety of coatings, inks, adhesives, powder coatings, and thermoplastics, including UV curable compositions. These sub-micron sized spheres can be used to improve physical and mechanical properties including reduced shrinkage, improved adhesion, impact resistance, and enhanced surface qualities such as hardness, mar and scratch resistance. The average particle size is 200 nanometers and range in size from about 50 nm to 500 nm.

Ureido silane used as a coupling agent in a wide range of applications for adhesives, sealants, coatings, foundry and fiber glass, etc. Silanes are used in a variety of industrial applications. Organofunctional Silanes have an organic functional end group and an alkoxy functional end group which allow the silane to act as a bridge between organic materials and inorganic substrates. The organic functional group is matched to the resin system while the alkoxy group provides the reactive site for crosslinking. These materials are useful as adhesion promoters, crosslinking agents, surface modifiers and hydrophobizing agents.

MicroFLON S-Series powders are Natural Prime PTFE micronized to various particle sizes. In thermoplastics and elastomers, MicroFLON® S facilitates lubrication and wear resistance. The tight process and particle size control typical of the MicroFLON® product line allows for easy dispersion, and distribution of the product.

The Sunspheres™ 200 Nm ST- 3 are surface treated*, optically clear, solid fused amorphous microspheres designed for optimum dispersion in coatings, inks, adhesives, and thermoplastics, including UV curable compositions. Cured films show enhanced physical and mechanical properties including increased corrosion resistance, reduced shrinkage, improved adhesion, and enhanced surface qualities such as mar and scratch resistance. This product is particularly useful in improving impact resistance. The average particle size is 200 nanometers and range in size from 50 to 500 nm.

USI Chemical Silane USi-402, as a co-monomer in polymers, can improve wet scrub resistance and abrasion resistance thanks to crosslinking and better adhesion to the substrate.

MicroFLON S-Series powders are Natural Prime PTFE micronized to various particle sizes. In thermoplastics and elastomers, MicroFLON® S facilitates lubrication and wear resistance. The tight process and particle size control typical of the MicroFLON® product line allows for easy dispersion, and distribution of the product.

BindEX E-186 is a maleic anhydride modified metallocene based linear low density polyethylene. With advanced anhydride grafting technology, this grade creates superb adhesion to EVOH, PA and PE, while maintaining excellent process ability.

OPTIM® E-156 is a maleic anhydride modified high density polyethylene. It is used for a variety of applications where adhesion improvements or compatibilsation is required.

BindEX E-160 is a maleic anhydride modified linear low density polyethylene adhesive resin. It can be processed within different extrusion and co-extrusion technologies designed to process polyolefins. It is especially designed to combine aluminum sheets with polymer core in Aluminum composite panels, using extrusion coating process.

AL170 is used as an adhesion promoter at organic/inorganic interfaces, as a surface modifier (e.g. imparting water repellency, hydrophilic surface adjustment or for crosslinking of polymers).

Aminopropyltrimethoxysilane. Superior adhesion promoter in RTV silicones and other hybrid sealants. Silanes are used in a variety of industrial applications. Organofunctional Silanes have an organic functional end group and an alkoxy functional end group which allow the silane to act as a bridge between organic materials and inorganic substrates. The organic functional group is matched to the resin system while the alkoxy group provides the reactive site for crosslinking. These materials are useful as adhesion promoters, crosslinking agents, surface modifiers and hydrophobizing agents.

Progressive Fillers International offers a solution to the industrial standard dark color of conductive and anti-state applications by offering a radiant shine to conductive additives, the CSL lines are conductive synthetic flakes with an adjustable specific gravity and density to fit the project. Having full control designing the weight, dimensions and over all parameters of the flake gives the customer full control over their original design and cost.

USI Chemical Silane USi-412 acts as an adhesion promoter for various mineral-filled polymers improving their mechanical and electrical properties, especially after exposure to moisture.

OPTIM® R-658 is a maleic anhydride modified elastomeric resin in granular form. It can be processed using plastics molding and extrusion techniques designed for polyolefins. The grafted polar groups on otherwise poyolefinic chains make it compatible with other polar and non-polar polymers. This affords many possibilities of extending base polymer properties like wettablity and toughening.

Pure high density polyethylene homopolymer polymer in finely sized rounded powder form. Avg. = 38 micron, D100 = 70 micron.

Sunspacers™ 04.X are finely divided, optically clear, solid fused amorphous silica micronized powders. This product is specially engineered for paints, liquid and powder coatings, inks, adhesives, and thermoplastics, including UV curable compositions. These micronized powders increase corrosion resistance, reduce shrinkage, improve adhesion, and enhance surface qualities including abrasion, mar and scratch resistance. Sunspacers™ 04.X have a median particle size of approximately 3-4 microns, with a particle size range of 0.5 microns to 13 microns.

OPTIM® P-408 is a maleic anhydride modified homopolymer polypropylene. The grafting operation of the polypropylene backbone is achieved using a new technology that allows high grafting efficiency and low polymer scission.

Conductive Silver Spheres (CSGS) are highly conductive, low density, spherical powder and particle with a dry bulk resistivity of .001 ohms/cm. Offering seamless electrical continuity of pure silver at a fraction of the cost and weight.The CSGS additives are noticeably lighter than solid silver in paints, composites and adhesive, while providing excellent conductivity, the low particle density of the CSGS and large surface area facilitates slow phase separation in paints and adhesives compared to heavy metallic and inorganic fillers. The CSGS also works well when used as catalysts, laser fusion targets, and electrically conducting bond line spacers in advanced electronics and other applications. The CSGS additives are engineered for high conductivity and shielding electromagnetic interference while improving the applications impact strength.

These PTFE powders are Natural Prime PTFE micronized to various particle sizes and are FDA compliant for applications requiring food contact. MicroFLON 1433FG is designed for food contact applications. These applications include: food processing, machine parts, and medical devices.

MicroFLON S-Series powders are Natural Prime PTFE micronized to various particle sizes. In thermoplastics and elastomers, MicroFLON® S facilitates lubrication and wear resistance. The tight process and particle size control typical of the MicroFLON® product line allows for easy dispersion, and distribution of the product.

SR3602-28 is an aqueous version of the 3602 series (NMP solvent) of aromatic polyamide-imide resins, enabling further dilutions with water.

AL T-99 TEOS is high purity tetraethyl orthosilicate (TEOS) monomer.

Progressive Fillers International offers a solution to the industrial standard dark color of conductive and anti-state applications by offering a radiant shine to conductive additives, the CSL lines are conductive synthetic flakes with an adjustable specific gravity and density to fit the project. Having full control designing the weight, dimensions and over all parameters of the flake gives the customer full control over their original design and cost.

SR3603-30 is an aromatic polyamide-imide solution which can be utilized for producing coatings where excellent chemical and thermal resistance is required.

Micaclad Conductive Silver Flakes (CSM100) is a highly conductive silver mica with a dry bulk resistivity of .002 ohms/cm. These pure silver platelets have the shielding and conductive roperties of solid metal silver with a fraction of the cost. The blanketing effect of silver and the reinforcement advantages of the mineral help provide strength and a stable conductive surface.

AL151 is a clear, colorless, strongly alkaline liquid with smell and being very sensitive to hydrolysis. The chloride content ranges in the lower ppm-level. AL151 is used as adhesion promoter at organic/inorganic interfaces, for modification of surfaces (corrosion prevention, component of primers) or as a moisture crosslinker of silicone polymers. The application as “coupling agent” leads in general to an improvement of mechanical and electrical product properties above all under exposure to heat and/or moisture.

MB-80 is an adhesive resin based on modified polyethylene. It can be used to produce a three-layer low temperature adhesive film, for manufacture of Aluminum Composite Panels (ACP). The chemical modification provides excellent adhesion to both polyethylene and aluminum substrates. It is preferably used as outer layer in 3- layer coextruded blown film structure. It is this layer with MB-80, which faces aluminum sheet during ACP manufacturing process. It can be processed on normal extruders used for making 3-layer polyethylene films.

USI Chemical Silane USi-1302 functions as a surface modifier in fillers and pigments, where it improves the dispersibility of the filler and the mechanical properties such as flexural strength, tensile strength and modulus of the composites. The silane also has its application as an adhesion promoter in formulations and primers & reduces the filler's sedimentation tendency in the uncured polymer. Silane USi-1302 also greatly increases water (vapor) and corrosion resistance.

These PTFE powders are Natural Prime PTFE micronized to various particle sizes and are FDA compliant for applications requiring food contact.

Andisil® 6021 Silane is a bifunctional silane possessing a reactive amino groups and hydrolysable methoxysilyl groups. The dual nature of its reactivity allows it to bind chemically to both inorganic materials (e.g. Glass, metals, fillers) and organic polymers (e.g. Thermoplastics, thermosets or elastomers).