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Products in Other Parts & Components: Filler
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HENZE BORON NITRIDE PRODUCTS
HeBoFill® CL-SP 035
Chemical Family:
Boron-based Compounds
Functions:
Filler
Compatible Polymers & Resins:
Silicones
Features:
Excellent Lubricity, Low Hardness, Excellent Filling Properties, Electrically Insulating, Non Abrasive, Good Thermal Conductivity, High Loading Absorption Capability, High Purity, Low Wear, Low Density, Low Viscosity
Synonyms:
Elbor
HeBoFill® CL-SP 035* is a high-purity boron nitride powder with a very distinct crystal structure and single crystallites in the range of 35 pm. It is further characterized by its low density and intrinsic high thermal conductivity. Since large crystallites conduct heat much faster, it is predestined for use as a filler and additive in plastics. Thereby, their thermal conductivity is significantly increased, while simultaneously maintaining good electrical insulation.
HENZE BORON NITRIDE PRODUCTS
HeBoFill® CL-SP 009
Chemical Family:
Boron-based Compounds
Functions:
Filler
Compatible Polymers & Resins:
Silicones
Features:
Electrically Insulating, Good Thermal Conductivity, Low Wear, Low Viscosity, High Degree of Crystallinity
Synonyms:
Elbor
HeBoFill® CL-SP 009 is a pure boron nitride powder with high crystallinity and an average particle size of 9 μm. Due to the pronounced platelet structure and the low specific surface area, this powder is very well suited as a filler and additive for plastics, as well as for a wide range of other applications.
HENZE BORON NITRIDE PRODUCTS
HeBoFill® CL-ADM 020
Chemical Family:
Boron-based Compounds
Functions:
Filler
Compatible Polymers & Resins:
Silicones
Features:
Excellent Lubricity, Free Flowing, Oxidation Resistant, High Temperature Resistance, High Degree of Crystallinity, Electrically Insulating, Good Thermal Conductivity, High Purity, Excellent Flowability, Low Wear, Low Density, Low Viscosity
Synonyms:
Elbor
HeBoFill® CL-ADM 020 is a Boron Nitride powder with a high level of purity, high crystallinity and excellent free flowing characteristics. It is particularly suitable for use as filler and additive in polymer materials to improve their thermal conductivity.
HENZE BORON NITRIDE PRODUCTS
HeBoFill® CL-SP 045
Chemical Family:
Boron-based Compounds
Functions:
Filler
Compatible Polymers & Resins:
Silicones
Features:
Electrically Insulating, Good Thermal Conductivity, High Loading Absorption Capability, High Purity, Low Wear, Low Density, Low Viscosity
Synonyms:
Elbor
HeBoFill® CL-SP 045 is a pure Boron Nitride powder with a coarse grain size distribution. Its average particle size is 45 μm. The extremely low specific surface area allows high filler loadings with a minimum viscosity increase. It is particularly suitable as a filler in polymers, allowing the thermal conductivity to be increased without affecting the electrically insulating properties.
HENZE BORON NITRIDE PRODUCTS
HeBoFill® CL-SP 015
Chemical Family:
Boron-based Compounds
Functions:
Filler
Compatible Polymers & Resins:
Silicones
Features:
Electrically Insulating, Good Thermal Conductivity, Low Wear, Low Viscosity, Flame Retardant, High Degree of Crystallinity
Synonyms:
Elbor
HeBoFill® CL-SP 015 is a very pure boron nitride powder with an average particle size of 15 μm. This boron nitride grade has a low specific surface area combined with high crystallinity. This quality is particularly suitable as a filler and additive in polymers to increase the thermal conductivity without affecting the electrically insulating properties.
Graphite Engineered Solutions
Graphite Engineered Solutions WonderFill
Functions:
Filler
Features:
Electrically Conductive, Prevents Thermo-Oxidative Degradation, Good Thermal Conductivity, Hydrophobic, Wear Resistant, Excellent Chalk Resistance, Chemical Resistant
End Uses:
Bearings, Pipes, Batteries, Tanks
Graphite Engineered Solutions WonderFill is a highly graphitized (>99.999% Carbon) powder form of irregularly shaped particulates. The particles are composed of discontinuous segments of resin infused carbon fiber bundles. Each particle is composed of approximately half fiber and the other half carbonized resin. The aspect ratio of these particles varies from 1:1 to over 500:1. The range of WonderFill grades provide powders that vary from fairly coarse grades (high aspect ratio) to ultrafine grades (low aspect ratio).
Marktek
Eeonomer™ Conductive Fillers
Chemical Family:
Carbon Blacks
Functions:
Filler
End Uses:
Microwave Antennas, Cables
doped polypyrrole- or polyaniline-coated carbon blacks
MicroMB
MicroMB Micro-FL-1014 T60
Functions:
Filler
Processing Methods:
Blown Film Extrusion
Carrier:
Resin-based, Linear Low Density Polyethylene (LLDPE)
Synonyms:
Agalite, Talc (Mg3H2(SiO3)4), Talcum
Micro-FL-1014 T60 is an economical masterbatch based on Talc with LDPE carrier which contributes to extrusion process stability and improved output. It improves MD tear resistance and dart impact properties , retains light transmission levels and improves MD/TD shrinkage levels.