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HENZE BORON NITRIDE PRODUCTS Company Logo

HeBoFill® CL-SP 045

HeBoFill® CL-SP 045 is a pure Boron Nitride powder with a coarse grain size distribution. Its average particle size is 45 μm. The extremely low specific surface area allows high filler loadings with a minimum viscosity increase. It is particularly suitable as a filler in polymers, allowing the thermal conductivity to be increased without affecting the electrically insulating properties.

Brand: HeBoFill (14 products)

Chemical Family: Boron-based Compounds

Functions: Filler

Compatible Polymers & Resins: Silicones

Features: Electrically Insulating, Good Thermal Conductivity, High Loading Absorption Capability, High Purity, Low Density, Low Viscosity, Low Wear

Synonyms: Elbor

Technical Data Sheet

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Chemical Family
Boron-based Compounds
Chemical Name
Boron Nitride
Plastics & Elastomers Functions
Filler
CAS No.
10043-11-5
EC No.
233-136-6
Technologies
Elastomers,
Plastics
Product Families
Elastomers — Elastomer Additives
Fillers & Extenders
Plastics — Polymer Additives
Fillers & Extenders,
Performance Additives

Features & Benefits

Materials Features
Electrically Insulating,
Good Thermal Conductivity,
High Loading Absorption Capability,
High Purity,
Low Density,
Low Viscosity,
Low Wear
Advantages

► Very high thermal conductivity – also at low filler loadings
► Electrically insulating
► High purity
► Very low specific surface area
► Provides high filler loadings
► Large single crystals
► Minimum tool wear in comparison to other filler materials
► Physiologically safe

Applications & Uses

Markets
Automotive & Transportation,
Consumer Goods,
Electrical & Electronics,
Industrial
Applications
Consumer Goods — Appliances & Electronics
Automotive & Transportation — Automotive
Electrical & Electronic Systems,
Powertrain & UTH
Industrial — Chemical & Industrial Manufacturing
Equipment & Parts,
Other Industrial Applications
Electrical & Electronics — Devices & Assemblies
Other Devices & Assemblies
Electrical & Electronics — Parts & Components
Other Parts & Components
Compatible Polymers & Resins
Silicones
Plastics & Elastomers End Uses
Bearings
Typical Applications

► Filler in thermal management applications
► Filler in thermal conductivity pastes and potting compounds
► Filler for silicone resins, thermoplastics and thermosets

Properties

Physical Form
Powder,
Solid
Typical Properties
ValueUnitsTest Method / Conditions
Boron Nitridemin. 98,5--
Total Oxygenmax. 0.5%-
Boron Oxidemax. 0.1%-
Carbonmax. 0.1%-
Specific Surface Area (BET)~ 1m2/g-
Median Particle Size (D50)45μm-

Technical Details & Test Data

Technical Values

HeBoFill® CL-SP 045 - Technical Values

Packaging & Availability

Packaging Type
Bags,
Drums
Packing Units

► 1 kg and 5 kg in plastic bags
► 25 kg in hard paper drums

Storage & Handling

Storage and Safety

Keep dry. Original containers can be stored for at least 12 months from date of delivery.