Products in Packaging & Assembly: Epoxy & Epoxy Derivatives

Fielco Adhesives Odyssey 13915 is a fast-setting, ambient curing epoxy potting compound for the encapsulation of small circuit assemblies.

Caplinq DK15-02 Brown is an epoxy-based coating powder developed as an epoxy resin binder when making powdered iron core or pot-core type reactors or induction devices.

Bondline 2485 is a silver filled, electrically conductive epoxy adhesive. This premixed, frozen and solvent free adhesive is designed for microelectronic chip bonding.

BB Resins BB-EPA 1100 is a medium viscosity unmodified epoxy resin obtained by blend of Bisphenol A/Bisphenol F based resins.

Applied Technologies 5922 Silver Epoxy is a highly flexible, two component, silver filled epoxy designed for easy noncritical 1:1 mixing and cure responses at either room temperature (20-25°C) or low heat (100°C). This material may also be used on surfaces which may be exposed to damp or wet environments. Applications include making and/or repairing flexible circuitry on a variety of plastic substrates, including both raw and Indium Tin Oxide coated polyester films. Other uses include chip bonding, die attachment, solderless wire connections, and repair of automotive rear window defogger and antenna circuits. This material, when properly cured, is highly conductive, exhibits outstanding adhesion, and is extremely crack resistant, even when creased at 180°. It also has excellent shock resistant properties when applied to rigid substrates like glass, metals, and hard plastics.

Resin Technology Group CT-523LV Cationic UV Cure Epoxy Adhesive is an epoxy-based, low viscosity, cationic-curable adhesive and/or sealant. This product is activated by exposure to medium intensity UV radiationresulting in a high strength, chemical resistant, low outgassing polymer system capable of surviving exposure up to 200°C.

Nuceq PZ A/HD-3404 system has been formulated for the technique of fiberglass laminating, potting and casting, this is a solvent-free system based on epichlorohydrin-bisphenol A epoxy resin.

Polytec TC 422 is a pasty, two component adhesive for thermal management in electronics, hybrid technology, sensor technology and power engineering. Polytec TC 422 has a great thermal conductivity and an excellent adhesion, especially to metals such as aluminum and stainless steel. It is also characterized by its high mechanical strength and thermal resistance. The application can be performed directly from the side-by-side cartridge with a static mixing tube, using a dispensing gun.

Magna-Tac™ E645 is a two-part, thermosetting, formulated epoxy adhesive for bonding stack laminations used in stators, rotors, gyros, servomechanisms, synchros, transformers and magnetic amplifiers. It can also be used as an insulating varnish for impregnated coils and small electrical equipment. Bonding is achieved by heat. Only sufficient pressure to assure complete contact is needed.

DELO KATIOBOND® 4552 is a modified epoxy resin , 1C , preactivated free of solvents , unfilled , electrically insulating, self-leveling, preactivated.

Anchor Seal SY5300VS Amber-Clear is anchor-seal epoxy for potting compounds and encapsulants coils and transformers. It bonds to PVC and vinyl and is moisture resistant, low viscosity, extended gel time, PVC cable/wire, switch connectors, signal generating transducers.

Atom Adhesives Metal-Bond (Rigid Staking Compound Epoxy Adhesive) is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength. Metal-Bond contains a thixotropic agent which impedes thinning out of the material during heat cure when properly mixed and cured.

Fielco Adhesives Odyssey 174 is a tough, two-part, epoxy encapsulate and transducer mounting adhesive.

DELO KATIOBOND® 45952 is a modified epoxy resin , 1C , preactivated free of solvents , unfilled, thixotropic , preactivated, electrically insulating, tension-equalizing.

XHD1019 is a two component, room temperature cure semi-flexible, flame retardant, epoxy system. The system was developed for potting/casting of electrical and electronic components. its use of non-abrasive fillers and convenient 1 to 1 ratio by volume, make it ideal for use in machine dispensing equipment. This product meets ul94-v0 in house flammability testing.

CLH6020 is a thermally conductive, two part epoxy system. the system was secifically designed for applications where heat dissipation on thermally sensitive devices is required.

BONDiT™ B-755 is a unique low viscosity, two-part, high strength, 100% solids, room-temperature curing semi-rigid cyclo-aliphatic epoxy resin system with good scratch and impact resistance. Suitable for clear coat, conformal coating and electrical potting applications. The B-755 handles harsh environments easily and is effective against moisture, salt water, acids, alkalies, oils, fuels, solvents and detergents. B-755 produces very low extract products in soak tests and provides corrosion resistance.

CLH5515 is a two component, unfilled, heat cure epoxy system. It was specifically developed for impregnating coils. The cured material exhibits excellent thermal stability and thermal cycling characteristics.

Aptek® 6512-Pmf is a one component, 100% solids, silver-filled, electrically conductive epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards. Aptek® 6512-Pmf displays excellent adhesion to various metal, ceramic, and PC board substrates. Aptek® 6512-Pmf Electronic-grade, conductive adhesive.

Duralco™ 4525 offers high bond strength, high temp stability, low moisture absorption, low shrinkage and excellent chemical, electrical and radiation resistance.

DELO KATIOBOND® 4578 is a modified epoxy resin , 1C , preactivated free of solvents , unfilled, thixotropic , preactivated, electrically insulating.

DELO KATIOBOND® 4594 is a modified epoxy resin , 1C , preactivated free of solvents , unfilled, thixotropic , preactivated, electrically insulating.