BONDiT™ B-755

BONDiT B-755 exhibits superior thermal resistance compared to most epoxy systems, particularly those offering ambient curing temperature. DMA testing
demonstrate stability to 600°F. Excellent for fuel cell applications. Apply B-755 by static mixer, brush or roller. B-755 is very easy to use with low  HAZMAT impact as a 100% solids epoxy system–no solvents or VOC problems.

Ambient cure (10 gram mix): 60 minute pot life; 90 minute gel time, 2 hours set time, 7 hours to 85% cure, dust free and may be roughly handled. Thin film  ambient set time of 90 minutes and cure of 5 hours. Thermal cure at 135degF  is approximately 10 minute. In 100gr quantity B-755 is exothermic which will  shorten pot life. Mix part A with part B, 4:1 ratio by volume or 100/23.1 by  weight. Thoroughly hand mix at least 4 minutes, or use static mixer. Degass is recommended. Optional surface prep will improve adhesion by abrading or grit  blasting substrates with #100 AlOx followed by degrease and/or alcohol wipe.
The usable shelf life of unopened containers of BONDiTTM B-755 resin is one year, and should be stored in cool, dry place. When not in use, containers should be kept tightly closed. Not UV sensitive; keep away from excess heat.

A unique fast set, low viscosity, ambient cure, water- white, scratch resistant UV resistant epoxy for clear-coatings of many surfaces, conformal coat of electronics, electrical component encapsulation and potting with excellent ambient cure properties.

High temperature to 600 °F, excellent chemical resistance, high strength even with ambient cure. rugged semi-rigid system. The product is also available in the filled (thixotropic). Bonds to many substrates such as GRE circuit boards and FKM elastomer

Two-part, primerless, ambient cure system with low HAZMAT impact for work environment. Available in handheld and pneumatic gun actuated cartridges, quarts, gallons and drums.

Marine,Civil Engineering, Industrial, Downhole oil, Underwater, Mining, Industrial,, Automotive.