Products in Packaging & Assembly: Anhydrides

Dianhydrides & Imides BISDA (4,4-bisphenol A dianhydride, dianhydrides of BPA) are flakes that can serve as a comonomer in polyimide synthesis or as an anhydride curing agent in epoxy applications. When utilized as an epoxy curative, it can enhance thermal performance compared to monoanhydrides and aromatic amine curing agents. Its application areas include electronics encapsulation, composites, and adhesives. Dianhydrides & Imides BISDA-derived polyimide varnishes, coatings, adhesives, films, and wire enamels offer desired solubility and stability in organic solvents even after complete imidization, heat resistance, flexibility/softness, dimensional stability, and adhesion properties for the ever-increasing design complexity of electronic devices. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Farboset® 1180 is a granular, glass-filled, general-purpose anhydride epoxy molding compound. It is formulated for encapsulation applications where excellent thermal shock resistance and physical strength are required. This compound helps protect electronic and electrical components by providing thermal shock resistance and maintaining their integrity under challenging conditions.

Farboset® 1707-2 is a mineral and glass-filled, anhydride epoxy molding compound that is engineered for the encapsulation of various electrical and electronic components. It is specifically formulated to provide high thermal shock resistance, making it ideal for protecting components that may be subjected to rapid temperature changes or other harsh environmental conditions. This compound helps ensure the reliability and durability of encapsulated components.

Farboset® 1160 is a granular, mineral-filled, anhydride epoxy molding compound designed for the encapsulation of various electrical and electronic components. It offers fast cure rates, long flow, and excellent thermal shock resistance. This compound is suitable for applications involving the encapsulation of coils, transformers, capacitors, diodes, relays, and other components that require good hot rigidity during the molding process.

Farboset® 1115 is a granular, mineral-filled, anhydride epoxy molding compound with fast cure rates and excellent hot strength. It is specially designed for encapsulating various electrical and electronic components, including coils, transformers, bushings, switches, and more. The material offers good hot rigidity during the molding process and is commonly used in injection and transfer molding applications.

Farboset® 1190 is a fast-curing epoxy molding compound that is mineral and glass-filled, and it contains improved strength properties. It is specially designed for encapsulating a variety of electrical and electronic components, such as coils, transformers, switches, and more. Farboset® 1190 is known for its excellent thermal shock resistance and superior resistance to cracking, making it a reliable choice for these applications.

Farboset® 1708 is a specialized epoxy molding compound that combines mineral and short glass fillers, making it well-suited for the encapsulation of coils and other electrical and electronic components. It offers excellent moldability, which is important for achieving precise shapes during the encapsulation process. One of its standout features is its extreme resistance to thermal shock, meaning it can withstand rapid changes in temperature without cracking or degrading.

Velsicol CHLORENDIC ANHYDRIDE is a solid, reactive flame retardant. An acid anhydride with a chlorine content of 54.5%, it imparts permanent flame retardance, high heat distortion, and excellent corrosion and abrasion resistance to resins such as unsaturated polyesters and alkyds. Chlorendic Anhydride is also used as a cross-linking agent in epoxy resins as a low-smoke component in polyols for rigid polyurethane foams and in UV curable inks and coatings for its adhesion to metal. Resin systems containing Chlorendic Anhydride can be formulated to meet ASTM E84 (Underwriter’s Tunnel Test) UL-94 and ASTM E 162-78 (Surface Flammability Test) as well as to meet U.S. military specifications for flame retardant, corrosion- resistant coatings.Unsaturated polyesters resins made from Chlorendic Anhydride are used in flame-retardant, glass- reinforced polyester composites for boats, construction panels, electrical applications and machine housings. In polyester corrosion-resistant applications, Chlorendic Anhydride is used in piping and in tanks and scrubbers for the chemical, fertilizer and pulp industries.Epoxy resins from Chlorendic Anhydride can be used as laminates for electrical uses, potting and encapsulation, adhesives requiring flame resistance, and high-heat distortion and protective coatings where permanent flame retardance, heat resistance, corrosion resistance and abrasion resistance are required.Alkyd coatings from Chlorendic Anhydride-based alkyds are used extensively for industrial and marine coatings applications. They are used in approved coating formulas, meeting military specifications Mil-R- 21417 for Navy ships and in industrial environments requiring chemical resistance combined with flame retardance.UV curable ink and coatings from Chlorendic Anhydride are used in polyester-based coatings and inks to provide good adhesion to metal, fast curing and hardness. In heat-fusible polyester and alkyd inks, it provides good adhesion to plastics, flexibility and high gloss.

Fielco Adhesives Odyssey 6835 is a semi-flexible, heat-curing anhydride-based potting compound for Class B electrical applications with excellent thermal shock and moisture resistance.

Fielco Adhesives Odyssey 6840 is a tough, heat-curing anhydride-based potting compound with excellent electrical properties and adhesion to metal coils and enclosures.

Dixie dodecenylsuccinic anhydride (DDSA) is a slightly viscous liquid anhydride. DDSA can be used as an epoxy curing agent for electrical potting compounds, coatings, conductive adhesives, and syntactic foams and also as an intermediate in the preparation of corrosion inhibitors for oils and greases. It cane be used as a leather tanning agent. When used as an epoxy-curing agent, it has a long pot life at room temperature and gives excellent electrical properties and flexibility to castings. DDSA can be used in blends with other anhydrides to modify physical properties of the mixture and to lend flexibility and reduce brittleness of cured polymers.

Fielco Adhesives Odyssey 14146 is a semi-flexible, heat curing anhydride-based electronic potting compound for Class B electrical applications with excellent thermal shock and impact resistance.

NADIC methyl anhydride (NMA) is a liquid alicyclic anhydride commonly used to cure epoxy resins in many challenging applications, including fiber reinforced composites used in high performance aerospace and military applications, as well as mechanically demanding applications like filament wound bearings. The excellent electrical properties and high temperature performance make NMAcured epoxies outstanding materials for encapsulating electronic components and circuits. NMA demonstrates many excellent characteristics when used as a curing agent for epoxy resins

Hycat™ AC-4 is the newest anhydride catalyst. Its performance is similar to Hycat™ 3100S but on average has slightly faster gel times.

Hycat™ 3000S is a anhydride catalyst used to accelerate the reaction of epoxy resins with various anhydrides including MTHPA, MHHPA, NMA, PA and more.

NADIC Methyl Anhydride 407 (NMA 407) curing agent formulated with an efficient latent proprietary catalyst that imparts high reactivity at process temperatures, while maintaining excellent pot life. NMA 407 is commonly used to cure epoxy resins in many challenging applications, including fiber reinforced composites used in high performance aerospace and military applications, as well as mechanically demanding applications. NMA 407 is ideal in processes such as pultrusion, filament winding and infusion of parts requiring excellent high temperature performance. The excellent electrical properties and high temperature performance make NMAcured epoxies outstanding materials for encapsulating electronic components and circuits.

ECA 100 is a light colored, low viscosity liquid epoxy curing agent designed for use in converting epoxy resins to highly crosslinked polymers with excellent physical and electrical properties. ECA 100 performs well when used in demanding applications, such as filament winding, pultrusion, and other forms of lamination, as well as electrical encapsulating, insulating, casting, and potting. ECA 100 imparts ease of handling due to low viscosity, low toxicity and low volatility. It is a mixture, which is a liquid at normal room temperature. If the product crystallizes, it should return to liquid by heating 38-55°C (100- 130°F) for 2-8 hours.