Dianhydrides & Imides BISDA

Bisphenol-A Dianhydride, BisDA

BISDA (BPA based dianhydride) has excellent thermal properties that may be used as a co-monomer in Polyimide synthesis or as a curing agent in epoxy thermoset systems. BISDA is provided as a flake and is soluble in the typical organic solvents used in polyimide varnishes, coatings, adhesives, films and wire enamels. Incorporating BISDA into polyimide formulations may provide enhanced performance in: heat resistance, flexibility/softness, dimensional stability and metal adhesion properties. In epoxy systems, BISDA as a curing agent may offer improved thermal performance, increased pot life, easier handling, improved chemical resistance, better toughness, lower dielectric properties, lower shrinkage and lower moisture absorption.

1. Add BISDA into MTHPA

Scale  120 - 130 gms

• BISDA content: 6 - 20 wt%
• Mixing temperature: 22°C
• Time: 3 minutes

Observations: Turbid solutions.

      2. Heat mixture at 120°C

BISDA content Vs heating time

• 6.7 wt% >>> 15 min
• 13.1 wt% >>> 20 min
• 19.2 wt% >>> 30 min

Observation: Clear Solutions

     3. Cool down 80°C and add D.E.R 332

Scale: 275-285 gms

• Anhydride to epoxy ratio: 0.8
• Mixing temperature: 80°C
• Time: 3 min

Observations: Clear Solution

      4.  Add catalyst 2E-4MI at 80°C

Scale:  275-285 gms

• 2E-4MI content: wt%
• Mixing temperature: 80°C
• Time: 2 min

Observation: Clear Solutions

     5. Pour into a pre heated mold

Scale:  275-285 gms

• Mold Temperature: 130°C
• Pouring Time: 2 - 3 min

     6. Thermal Curing 

Curing Profile

• 80°C >> 30 min
• 120°C >> 30 min
• 150°C >> 30 min
• 180°C >> 60 min