Products in Packaging & Assembly: Binder & Resin

An alcohol soluble resin. Used in flexographic printing inks for plastic substrates. Provides the fastest solvent release in our alcohol soluble polyamide resin series and is compatible with modifiers commonly used in alcohol inks.

BONDiT™ B-755 is a unique low viscosity, two-part, high strength, 100% solids, room-temperature curing semi-rigid cyclo-aliphatic epoxy resin system with good scratch and impact resistance. Suitable for clear coat, conformal coating and electrical potting applications. The B-755 handles harsh environments easily and is effective against moisture, salt water, acids, alkalies, oils, fuels, solvents and detergents. B-755 produces very low extract products in soak tests and provides corrosion resistance.

UNI-REZ 2635 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2635 hot melt polyamide adhesive has good low temperature flexibility and adhesion to various plastic substrates.

UNI-REZ 2651 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2651 hot melt polyamide adhesive has excellent low temperature impact resistance and good adhesion to polyolefin.

UNI-REZ 110 polyamide resin is an alcohol soluble / co-solvent type resin with excellent solvent release and blocking properties. UNI-REZ 110 polyamide resin was developed for release lacquers but can also be used as a modifying resin to improve hardness.

UNI-REZ 2721 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2721 hot melt polyamide adhesive has excellent heat and chemical resistance and exhibits high green strength allowing for fast line speeds.

UNI-REZ 2638 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2638 hot melt polyamide adhesive has good low temperature flexibility and adhesion to various plastic substrates.

UNI-REZ 2720 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2720 hot melt polyamide adhesive offers good chemical resistance, low softening point and low viscosity which allows for a lower application temperature and fast set.

UNI-REZ 2224 polyamide resin is an alcohol soluble type resin for flexographic printing. It has high compatibility with nitrocellulose and very low viscosity, allowing for high heat resistance and high color strength.

UNI-REZ 2678 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2678 hot melt polyamide adhesive has good low temperature flexibility and adhesion to various plastic substrates.

UNI-REZ 2641 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2641 hot melt polyamide adhesive has excellent green strength, chemical resistance and adhesion to PVC.

UNI-REZ 2626 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2626 hot melt polyamide adhesive has excellent heat and chemical resistance and exhibits high green strength allowing for fast line speeds.

UNI-REZ 2934 polyamide resin is a co-solvent type resin offering excellent low temperature gel resistance and good compatibility with modifying resins. UNI-REZ 2934 offers better blocking and gloss properties in comparison with other modified co-solvent types.

The performance of UNI-REZ™ thixotropic polyamide is far superior to other competitive technologies and is used to control the rheology of non-drip structured varnishes and varnishes. Kraton thixotropic products are non-reactive polyamide resins for thixotropic alkyd resins.

UNI-REZ 2656 hot melt polyamide adhesive is a resin-based on dimer acid. UNI-REZ 2656 hot melt polyamide adhesive has excellent low-temperature impact resistance and good adhesion to polyolefin.

UNI-REZ 2722 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2722 hot melt polyamide adhesive has excellent heat and chemical resistance and exhibits high green strength allowing for fast line speeds.

UNI-REZ™ thixotropic polyamides provide performance well beyond the capabilities of other competing technologies for controlling the rheology of structured non-drip gloss paints and varnishes. Kraton thixotropic grades are non-reactive polyamide resin for use in thixotropic alkyds.

UNI-REZ 119 polyamide resin is an alcohol soluble / co-solvent type resin with excellent solvent release and blocking properties. UNI-REZ 119 polyamide resin was developed for release lacquers and has the lowest solution viscosity but fast solvent release.

SPUR+™ 3040 prepolymer is an excellent candidate to consider as a binder for high strength adhesives requiring adhesion to a variety of substrates. The low viscosity o SPUR+™ 3040 prepolymer has shown it to be easy to formulate and use for the manufacture of adhesives. Many applications have benefited from the excellent heat resistance of SPUR+™ 3040 prepolymer in circumstances where thermal stability is required.

UNI-REZ 2620 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2620 offers good chemical resistance, low softening point and low viscosity which allows for a lower application temperature and fast set.

UNI-REZ 2239 polyamide resin is an alcohol soluble type resin that is used for flexographic printing. It has balanced properties making it a good choice for general purpose flexographic surface printing.