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Packaging & Assembly
Products in Packaging & Assembly: Binder & Resin
165 Products found in Packaging & Assembly
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Your ChemCo
MultiTech DiFunctional D
Polymer Name:
Polyisoprene (IR)
Functions:
Rheology Modifier, Binder & Resin
Chemical Family:
Polyisoprenes
Compatible Substrates & Surfaces:
Elastomers & Rubbers
MultiTech DiFunctional D is a low molecular weight liquid polymer derived from synthetic polyisoprene rubber. It offers the performance and processing characteristics of natural rubber with the added benefit of lighter color and none of the natural impurities inherent in natural rubber products. MultiTech DiFunctional D is a high viscosity liquid at room temprature. It is a translucent, honey-colored liquid in bulk form and virtually clear in a thin film.
Your ChemCo
BaseCase Multifunctional A
Chemical Family:
Acrylics & Acrylates, Methacrylates, Epoxy & Epoxy Derivatives
Labeling Claims:
Solvent-free, Bisphenol A-free, Low Carbon Footprint (PCF), VOC-free
BaseCase Multifunctional A is an acrylate - methacrylate monomer blend, containing 50% of trimethylolpropane triacrylate (TMPTA) and 50% hydroxyethylmethacrylate (HEMA). It polymerizes when exposed to sources of free radicals. BaseCase Multifunctional A is particularly useful in coatings where a good thermal and/or chemical resistance are important. It is recommended for use in: coatings where chemical and/or thermal resistance is required, and solder and etch resists.
Your ChemCo
MultiTech Resin
Polymer Name:
Epoxy Resins & Compounds
Chemical Family:
Epoxy & Epoxy Derivatives
MultiTech Resin is an alicyclic epoxide for epoxy resin composition, with the following features :- Excellent fluidity. Possible to maintain low viscosity at high temperature by partial addition of DE-102- High light resistance- Low water absorption
Your ChemCo
MultiTech MultiFunctional L
Polymer Name:
Epoxy Resins & Compounds
Chemical Family:
Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins, Bisphenol A Type Epoxy
Functions:
Adhesion Promoter, Resins, Binders & Matrix Materials, Resin, Binder & Resin, Coupling Agent, Adhesion Promoter
Compatible Substrates & Surfaces:
Metal, Fibers & Fabrics, Aluminum, Plastics, Ceramic, Glass, Concrete, Steel
MultiTech MultiFunctional L is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparency LED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs MultiTech MultiFunctional L is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group
Wacker Chemie AG
DEHESIVE® 929
Functions:
Binder & Resin
Chemical Family:
Vinyls, Vinylics & Vinyl Derivatives
Compatible Substrates & Surfaces:
Paper, Film
Features:
Fast Cure, Good Release Properties, Excellent Flow
DEHESIVE® 929 is a solvent-free, addition-curing silicone fluid designed for release applications. This product has good curing properties, very good flow properties and coverage, an extremely stable release, excellent bath life, and excellent long-term anchorage to a wide variety of substrates.
Wacker Chemie AG
DEHESIVE® 944
Functions:
Binder & Resin
Chemical Family:
Vinyls, Vinylics & Vinyl Derivatives
Compatible Substrates & Surfaces:
Paper, Film
Features:
Fast Cure, Good Release Properties
DEHESIVE® 944 is a solvent-based, addition-crosslinkable silicone recommended for use as a release coating. It offers excellent release stability, medium release at low peel speeds, excellent bath life, and excellent anchorage to a wide variety of substrates. It can be used for coating polyester films (PET), papers, and PE-laminated papers.
Wacker Chemie AG
DEHESIVE® 902 AMA®
Functions:
Binder & Resin
Chemical Family:
Vinyls, Vinylics & Vinyl Derivatives
Compatible Substrates & Surfaces:
Paper, Film
Physical Form:
Liquid
Features:
Fast Cure, Good Release Properties
DEHESIVE® 902 AMA® is a solvent-free, addition-curing silicone fluid formulated for release applications on paper and filmic substrates. It is an integral component of a multicomponent release coating used in the production of paper and filmic release liners. These liners are widely utilized in the manufacturing of single- and double-sided industrial laminates.
Wacker Chemie AG
DEHESIVE® SF 201 AMA®
Chemical Family:
Vinyl Polymers
End Uses:
Pressure Sensitive Adhesive, Release Coating
Compatible Substrates & Surfaces:
Composites, Paper
Features:
Good Release Properties, Fast Cure
DEHESIVE® SF 201 AMA® is a solvent-free, addition-curing silicone fluid. It is designed for release applications and is applied with additional components on paper and filmic substrates. The fast cure properties of DEHESIVE® SF 201 AMA® allow for use with temperature-sensitive substrates or comparatively low platinum levels at standard conditions.
Wacker Chemie AG
GENIOSIL® XL 70
Chemical Family:
Silanes
Functions:
Binder & Resin, Moisture Scavenger
Synonyms:
(Trimethoxysilyl)benzene, Phenyltrimethoxysilane, PhTMO, PhTMS, PTMS
GENIOSIL® XL 70 is a clear, colorless liquid known as an alkoxyarylsilane. When exposed to moisture, it undergoes hydrolysis, leading to the formation of silanols and the release of methanol. These silanols can further react to form siloxanes. GENIOSIL® XL 70 finds applications in building & construction adhesives and flooring installation.
Wacker Chemie AG
GENIOSIL® STP-E 10
Features:
Water Resistance, Improved Ageing Resistance, Multi-Substrate Adhesion, Fast Cure, Low Glass Transition Temperature
GENIOSIL® STP-E 10 is a polyether-based silane-terminated polymer suitable as a binder in moisture-curing formulations. It differs from conventional silylated polymers due to its high reactivity, which results from the structural proximity of the nitrogen atom to the silicon atom in the dimethoxy(methyl)silyl-methylcarbamate group (alpha-effect). It hydrolyzes in the presence of moisture to form a stable siloxane network initiated by mild catalysis, rather than heavy metal ions.
Evonik
ALBIFLEX® 297
Polymer Name:
Bisphenol-A Epoxy-Silicone Block Copolymer
Chemical Family:
Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins
Processing Methods:
Casting
ALBIFLEX® 297 is a bisphenol-A-epoxy-silicone block copolymer resin that excels in crafting high-performance elastomers. This versatile liquid, responsive to epoxy, seamlessly cures when combined with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 297 accommodates various conventional casting and molding techniques for your manufacturing needs.
Evonik
ALBIFLEX® 246
Features:
Good Thermal Stability, Excellent Adhesion, Good Mechanical Properties
ALBIFLEX® 246 is an innovative Bisphenol-A-epoxy silicone block copolymer resin designed for crafting high-performance elastomers. This liquid resin, active with epoxy, seamlessly cures when paired with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 246 offers versatility, supporting various casting and molding methods for your manufacturing needs.
Mitsubishi Chemical Group Corporation
jER™ YX7400N
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Coupling Agent, Impact Modifier, Binder & Resin, Adhesion Promoter, Resin
Chemical Family:
Epoxy & Epoxy Derivatives
End Uses:
Conformal Coating, Semiconductor Applications
Features:
Good Elasticity, Reduced Wear, Excellent Elasticity, High Impact Resistance, Improved Flexibility, Excellent Resilience, Abrasion Resistance, Improved Dimensional Stability, Impact Resistance, Good Mechanical Properties
jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YL980
Polymer Name:
Epoxy Resins & Compounds
Functions:
Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials, Coupling Agent, Resin
Chemical Family:
Bisphenol Epoxy Resins, Bisphenol A Type Epoxy, Epoxy & Epoxy Derivatives
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Steel, Concrete, Aluminum, Fibers & Fabrics, Plastics, Ceramic, Metal, Glass
Features:
Chemical Resistance, Improved Flexibility, Excellent Electrical Insulation, Electrically Insulating, Low Chlorine Content, Abrasion Resistance, Chemical Resistant, Good Electrical Properties, Water Resistant, Reduced Wear, Heat Resistance, Flame Retardant, Improved Dimensional Stability, Good Mechanical Properties, Water Resistance
jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
DIACRON™ FC-3294
Chemical Family:
Polyesters
End Uses:
Lithographic Ink, Letterpress Ink, Offset Ink, Solventless & High Solids Coating, Flexography Ink, Digital Ink, Powder Coating, Varnishes, Solventborne Adhesive, Inkjet Ink, Lacquers, Coil Coating, Primer, Reactive Adhesive, Electrostatic Ink, Gravure Ink, Electrophotography Ink, Screen Printing Ink
Compatible Substrates & Surfaces:
Copper, Aluminum, Plastics, Iron, Metal, Glass
Features:
Excellent Weatherability, Multi-Substrate Adhesion, Improved Hardness, Water Resistance, Improved Flexibility, Weather Resistance, Corrosion Resistance, High Durability, Heat Resistance, Excellent Adhesion, Improved Glass Transition Temperature, Excellent Solubility, Good Pigment Dispersion, Solvent Resistance, Good Toughness
DIACRON™ FC-3294 is a polyester resin with excellent solvent solubility and is optimal as a binder for paints and inks. It exhibits excellent adhesion to plastic films, moldings and metals such as aluminum, copper, and iron. It improves hardness, heat resistance, toughness, and solvent resistance by using curing agents such as isocyanates and epoxy resins. Features: Excellent pigment dispersion. Can be used with cross-linking agents. Excellent chemical and weather resistance Benefits: Solvent solubility High solid differentiation Durability Applications: For various types of inks (Screen printing and inkjet, etc. ) PCM coatings Solventless & High Solids Coating *DIACRON™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX7105
Polymer Name:
Epoxy Resins & Compounds
Functions:
Impact Modifier, Coupling Agent, Binder & Resin, Adhesion Promoter, Resin, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces:
Ceramic, Fibers & Fabrics, Glass, Aluminum, Concrete, Steel, Plastics, Metal
jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
SHIKOH™ UV-3520TH
Chemical Family:
Urethane Acrylates
CASE Ingredients Features:
Good Elongation, Good Elasticity, Weather Resistance, Improved Tear Strength, Excellent Adhesion, Crack Resistance, Tack-free, Good Toughness, High Tensile Strength, Radiation Curable, Improved Flexibility
SHIKOH™ UV-3520TH is an aliphatic urethane acrylate oligomer with soft elasticity, good toughness and high elongation. It shows unique mechanical properties with various reactive diluents. Features Soft-Elastic type, Good toughness, High elongation Diluted in Tetrahydrofurfuryl Acrylate (THFA) (oligomer/ THFA = 70/30 wt%) Non-solvent (100% hardening ingredient) Unique mechanical properties with various reactive diluents Applications UV/ EB/ Thermal-curable adhesive UV adhesive for electric device use 3D printer, and Inkjet *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
DIACRON™ FC-3399
Chemical Family:
Polyesters
End Uses:
Letterpress Ink, Reactive Adhesive, Offset Ink, Varnishes, Powder Coating, Solventborne Adhesive, Lithographic Ink, Lacquers, Flexography Ink, Inkjet Ink, Solventless & High Solids Coating, Electrostatic Ink, Coil Coating, Gravure Ink, Electrophotography Ink, Primer, Screen Printing Ink, Digital Ink
Compatible Substrates & Surfaces:
Copper, Aluminum, Iron, Metal, Plastics
Features:
Weather Resistance, Excellent Weatherability, Low Temperature-Curing, Good Mechanical Properties, Multi-Substrate Adhesion, High Impact Resistance, Low VOC, Chemical Resistance, Excellent Solubility, Improved Flexibility, Good Toughness
DIACRON™ FC-3399 is a polyester resin under development can be used for powder coating. It works well to keep color for a long time and has excellent mechanical strength by using curing agents such as TGIC and Primid (HAA) and Epoxy resins. Features: Excellent chemical and weather resistance Excellent pigment dispersion Good mechanical strength Can be used with cross-linking agents Benefits: Good heat resistance Durability High solid differentiation Applications: Powder Coating For various types of inks Solventborne adhesive *DIACRON™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
DIACRON™ FC-3278
Chemical Family:
Polyesters
End Uses:
Letterpress Ink, Reactive Adhesive, Offset Ink, Varnishes, Powder Coating, Solventborne Adhesive, Lithographic Ink, Lacquers, Flexography Ink, Inkjet Ink, Solventless & High Solids Coating, Electrostatic Ink, Coil Coating, Gravure Ink, Electrophotography Ink, Primer, Screen Printing Ink, Digital Ink
Compatible Substrates & Surfaces:
Copper, Aluminum, Iron, Metal, Plastics, Paper
Features:
Solvent Resistance, Heat Resistance, Improved Hardness, Good Toughness
DIACRON™ FC-3278 is a high Tg grade polyester resin with excellent environmental friendliness using 50wt% or more of recycled material. It improves hardness, heat resistance, toughness, and solvent resistance by using curing agents such as isocyanates and epoxy resins. Features: Excellent chemical and weather resistance Excellent pigment dispersion. Heat-resistant Contains 50% recycled material Benefits: Good heat resistance Durability Applications: Powder Coating PCM coatings For various types of inks *DIACRON™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX8040
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resin, Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
Labeling Claims:
High Purity
jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
DIACRON™ FC-1565
Chemical Family:
Polyesters
End Uses:
Letterpress Ink, Reactive Adhesive, Offset Ink, Varnishes, Powder Coating, Solventborne Adhesive, Lithographic Ink, Lacquers, Flexography Ink, Inkjet Ink, Solventless & High Solids Coating, Solventborne Coating, Electrostatic Ink, Coil Coating, Gravure Ink, Electrophotography Ink, Primer, Screen Printing Ink, Digital Ink
Compatible Substrates & Surfaces:
Copper, Aluminum, Iron, Metal, Plastics
Features:
Solvent Resistance, Excellent Adhesion, High Durability, Heat Resistance, Improved Hardness, Excellent Solubility, Good Pigment Dispersion, Good Toughness
DIACRON™ FC-1565 is a polyester resin with excellent solvent solubility. It is a low molecular weight (Mw)-grade of FC-1494 and is optimal as a binder for paints and inks due to its excellent pigment dispersibility. It improves hardness, heat resistance, toughness, and solvent resistance by using curing agents such as isocyanates and epoxy resins. Features: Excellent chemical resistance Excellent pigment dispersion Can be used with cross-linking agents Benefits: Solvent solubility Durability High solid differentiation Use of biomass raw materials Applications: Solventborne Coating For various types of inks Solventless & High Solids Coating *DIACRON™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
SHIKOH™ UV-3300B
Compatible Substrates & Surfaces:
Metal
SHIKOH™ UV-3300B is UV curable urethane acrylate oligomer with excellent soft-elasticity, and very high elongation. It also shows good mechanical properties even at low temperature. EB and Thermal cure systems are also applicable. Features Soft-elastic, High elongation Suitable for adhesion bond and metalizing undercoat with monomers Good mechanical properties at low temperature Non-yellowing Applications Adhesive : UV/ EB/ Thermal-curable adhesive for electronics device, optical use, and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
DIACRON™ FC-3352
Chemical Family:
Polyesters
End Uses:
Letterpress Ink, Reactive Adhesive, Offset Ink, Varnishes, Powder Coating, Solventborne Adhesive, Lithographic Ink, Lacquers, Flexography Ink, Inkjet Ink, Solventless & High Solids Coating, Electrostatic Ink, Coil Coating, Gravure Ink, Electrophotography Ink, Primer, Screen Printing Ink, Digital Ink
Compatible Substrates & Surfaces:
Copper, Aluminum, Iron, Metal, Plastics
Features:
Solvent Resistance, Low Viscosity, Heat Resistance, Improved Hardness, High Glass Transition Temperature, Excellent Solubility, Good Toughness
DIACRON™ FC-3352 is a polyester resin with excellent environmental friendliness using 5wt% of biomass material. It is a high Tg and a low molecular weight (Mw)-grade and is optimal as a binder for paints and inks. Especially, the use of organic solvents can be reduced because low viscosity high-solid solutions are possible. It improves hardness, heat resistance, toughness, and solvent resistance by using curing agents such as isocyanates and epoxy resins. Features: Excellent chemical resistance Heat-resistant Excellent pigment dispersion. Can be used with cross-linking agents Benefits: Solvent solubility High solid differentiation Use of biomass raw materials Applications: PCM coatings For various types of inks Solventless & High Solids Coating *DIACRON™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ Epoxy YX7110
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resin, Impact Modifier, Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jER™ YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
SHIKOH™ UT-7792
Compatible Substrates & Surfaces:
Metal
SHIKOH™ UT-7792 is a bio-based urethane acrylate oligomer. (Development product) Its biomass degree is 71% while its mechanical properties are the same as a non-biomass grade UV-3300B, with higher elongation and very soft rubbery elasticity suitable for using UV-curable adhesives for electronics devices. Features Bio-based Soft-elastic, High elongation Suitable for adhesion bond and metalizing undercoat with monomers Non-yellowing Applications Adhesive : UV/ EB/ Thermal-curable adhesive for electronics device, optical use, and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ 4250
Polymer Name:
Epoxy Resins & Compounds
Functions:
Impact Modifier, Plasticizer, Coupling Agent, Binder & Resin, Adhesion Promoter, Resin, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces:
Ceramic, Fibers & Fabrics, Glass, Aluminum, Concrete, Steel, Plastics, Metal
jER™ 4250 is a hybrid bisphenol A/bisphenol F-type epoxy resin that is more flexible than conventional polymer-type epoxy resins. It can be used as an additive to add toughness, insulating and vapor barrier properties and resistance to heat, water and chemicals to a variety of applications. FeaturesPolymer-type epoxy resin with epoxy functional groups at the both endsHigh molecular weightHigh softening points Good adhesionApplicationsPCM, CAN and other coatingsPaintThermoplastics Printed electronics Plastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ 1750
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resin, Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol F Type Epoxy
Labeling Claims:
High Purity
jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ 1256
Polymer Name:
Epoxy Resins & Compounds
Functions:
Impact Modifier, Plasticizer, Coupling Agent, Binder & Resin, Adhesion Promoter, Resin, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
Compatible Substrates & Surfaces:
Ceramic, Fibers & Fabrics, Glass, Aluminum, Concrete, Steel, Plastics, Metal
jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YL983U
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials, Resin
Chemical Family:
Epoxy & Epoxy Derivatives, Bisphenol F Type Epoxy, Bisphenol Epoxy Resins
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Steel, Concrete, Aluminum, Fibers & Fabrics, Metal, Plastics, Glass, Ceramic
Features:
Good Elastic Recovery, Excellent Electrical Insulation, Low Chlorine Content, Abrasion Resistance, Improved Dimensional Stability, Electrically Insulating, Good Electrical Properties, Good Elastic Recovery, Improved Flexibility, Water Resistant, Reduced Wear, Heat Resistance, Good Mechanical Properties, Chemical Resistant, Low Viscosity, Water Resistance, Chemical Resistance
jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
DIACRON™ FC-3288
Chemical Family:
Polyesters
End Uses:
Letterpress Ink, Reactive Adhesive, Offset Ink, Varnishes, Powder Coating, Solventborne Adhesive, Lithographic Ink, Lacquers, Flexography Ink, Inkjet Ink, Solventless & High Solids Coating, Solventborne Coating, Electrostatic Ink, Coil Coating, Gravure Ink, Electrophotography Ink, Primer, Screen Printing Ink, Digital Ink
Compatible Substrates & Surfaces:
Glass, Copper, Aluminum, Iron, Metal, Plastics
Features:
Low Glass Transition Temperature, Excellent Adhesion, Water Resistance, Multi-Substrate Adhesion, Heat Resistance, Improved Hardness, Excellent Solubility, Improved Flexibility, Good Pigment Dispersion, Good Toughness
DIACRON™ FC-3288 is a polyester resin with excellent pigment dispersibility. It is a low Tg grade and is optimal as a binder for paints and adhesives. By blending with a high Tg grade DIACRON, it exhibits excellent adhesion and bendability to plastic films, moldings and metals such as aluminum, copper and iron. It improves hardness, heat resistance and toughness by using additive such as isocyanates. Features: Low Tg and excellent substrate adhesion Excellent chemical and weather resistance Excellent pigment dispersion Benefits: Use of biomass raw materials Flexibility Durability Applications: PCM coatings Adhesives for films Binder for screen inks Heat seal *DIACRON™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX4000
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Binder & Resin, Adhesion Promoter, Resin, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces:
Ceramic, Fibers & Fabrics, Glass, Aluminum, Concrete, Steel, Plastics, Metal
jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
DIACRON™ FC-1588
Chemical Family:
Polyesters
End Uses:
Letterpress Ink, Reactive Adhesive, Offset Ink, Varnishes, Powder Coating, Solventborne Adhesive, Lithographic Ink, Lacquers, Flexography Ink, Inkjet Ink, Solventless & High Solids Coating, Electrostatic Ink, Coil Coating, Gravure Ink, Electrophotography Ink, Primer, Screen Printing Ink, Digital Ink
Compatible Substrates & Surfaces:
Copper, Aluminum, Iron, Metal, Plastics
Features:
Solvent Resistance, Excellent Adhesion, Low Viscosity, High Durability, Heat Resistance, Improved Hardness, Excellent Solubility, Good Pigment Dispersion, Good Toughness
DIACRON™ FC-1588 is a polyester resin with excellent solvent solubility. It is a low molecular weight (Mw)-grade of ER-535 and is optimal as a binder for paints and inks. Especially, the use of organic solvents can be reduced because low viscosity high-solid solutions are possible. It improves hardness, heat resistance, toughness, and solvent resistance by using curing agents such as isocyanates and epoxy resins. Features: Low temperature fusion Excellent metal adhesion Excellent pigment dispersion. Can be used with cross-linking agents Benefits: Solvent solubility High solid differentiation Use of biomass raw materials Applications: Solventborne Coating For various types of inks Solventless & High Solids Coating *DIACRON™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
SHIKOH™ UV-3700B
Applications:
Electronics Adhesives, 3D Printing, Consumer Electronics
Product Families:
Photoactive Resins, Oligomers, Other Resins & Binders
Chemical Family:
Urethane Acrylates
End Uses:
3D Printing Applications, Undercoat, Solventless & High Solids Coating
SHIKOH™ UV-3700B is UV curable urethane acrylate oligomer with high elongation and soft rubbery elasticity. It is relatively low viscosity despite its high molecular weight. EB and Thermal cure systems are also applicable. Features Soft elastic type, High elongation High molecular weight but relatively low viscosity Non-solvent (100% hardening ingredient) For UV adhesion with monomers Non-yellowing Applications Adhesive: UV/ EB/ Thermal-curable adhesive for electronics device, optical use and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
DIACRON™ ER-502
Chemical Family:
Polyesters
End Uses:
Letterpress Ink, Reactive Adhesive, Offset Ink, Varnishes, Powder Coating, Solventborne Adhesive, Lithographic Ink, Lacquers, Flexography Ink, Inkjet Ink, Solventless & High Solids Coating, Electrostatic Ink, Coil Coating, Gravure Ink, Electrophotography Ink, Primer, Screen Printing Ink, Digital Ink
Compatible Substrates & Surfaces:
Copper, Aluminum, Iron, Metal, Plastics
Features:
Solvent Resistance, Excellent Adhesion, High Durability, Heat Resistance, Improved Hardness, Excellent Solubility, Good Pigment Dispersion, Good Toughness
DIACRON™ ER-502 is a polyester resin with excellent solvent solubility. It is a high acid value and high molecular weight (Mw)-grade and is optimal as a binder for paints and inks due to its excellent pigment dispersibility. It improves hardness, heat resistance, toughness, and solvent resistance by using curing agents such as isocyanates and epoxy resins. Features: Low temperature fusion Excellent metal adhesion Excellent pigment dispersion Can be used with cross-linking agents Benefits: Solvent solubility High solid differentiation Use of biomass raw materials Applications: PCM coatings For various types of inks Solventless & High Solids Coating *DIACRON™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX8000D
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Coupling Agent, Binder & Resin, Adhesion Promoter, Resin
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
End Uses:
Radiation Curable Coating, Semiconductor Applications
Compatible Substrates & Surfaces:
Steel, Fibers & Fabrics, Concrete, Aluminum, Metal, Plastics, Glass, Ceramic
Features:
Transparency, Fast Cure, Radiation Curable, UV Curable, Low Chlorine Content, Faster Cure Time, LED-curable, Excellent Adhesion
jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Wacker Chemie AG
GENIOSIL® XM 25
Functions:
Plasticizer, Binder & Resin
GENIOSIL® XM 25 represents a new line of silane terminated polymers that serve as reactive diluents in moisture-curing formulations. This technology encompasses the renowned Wacker portfolio. GENIOSIL® XM 25 falls under the category of gamma chemistry. It finds application in building and construction adhesives.
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