Products in Electrical & Electronics: Resins, Binders & Matrix Mate...

MultiTech Resin is an alicyclic epoxide for epoxy resin composition, with the following features :- Excellent fluidity. Possible to maintain low viscosity at high temperature by partial addition of DE-102- High light resistance- Low water absorption

MultiTech MultiFunctional L is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparency LED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs MultiTech MultiFunctional L is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

SILRES® K is a solution of a condensation-curing methyl silicone resin in toluene. The product can be used as a binder or as an impregnation agent for porous materials. Besides, SILRES® K is the ideal product for making tack-free prepregs with excellent storage stability. Fully cured SILRES® K has a very low carbon content and thus yields a high ash content when pyrolized. Composites made of SILRES® K show long-term stability against weathering, moisture, and UV light. They can therefore be continuously exposed to constantly changing climatic conditions, UV radiation, and temperatures significantly higher than 300 °C (572 °F). SILRES® K also provides water repellency and excellent electrical insulation properties to the respective composite materials.

SILRES® H62 C is a liquid, solvent-free, one-part heat-curing phenyl silicone resin formulation. The product is ideal for impregnating the electrical coils of motors and generators. Besides, SILRES® H62 C can be used to provide hydrophobic properties to porous materials and as a binder for composites made of fibrous fillers, cloths, and woven or non-woven reinforcing materials. The formulation is ready-to-use and crosslinks under heat. While curing, SILRES® H62 C does not release chemical byproducts, so curing shrinkage is barely noticeable. The product also thermosets in thick layers, even when in contact with air. Fully cured SILRES® H62 C has excellent electrical insulation properties and outstanding long-term heat resistance. Additionally, it shows high stability against weathering, moisture, and UV light and can therefore be continuously exposed to constantly changing climatic conditions or UV radiation.

VESTAMID® NRG 5901 BK is a high-molecular-weight PA-12 material developed by Evonik. This exceptional material offers superior performance characteristics, making it an ideal choice for expanding the use of thermoplastic piping systems. With its ability to handle higher operating pressures and larger diameters, VESTAMID® NRG 5901 BK provides a safe and cost-effective alternative to metallic piping systems. In addition to extending the operating pressure limits of thermoplastic piping systems, it offers numerous benefits and, in many cases, outperforms conventional PE piping systems. Experience the reliability, durability, and enhanced performance of VESTAMID® NRG 5901 BK in your piping applications. Choose VESTAMID® NRG 5901 BK for its superior properties and cost-effective solution, ensuring the safe and efficient operation of your thermoplastic piping systems.

VESTAMID® NRG 3001 NC is a polyamide 12 compound specifically developed for the manufacturing of hydrocarbon transport piping systems and liners. This material offers easy processing and excellent dimensional control during pipe extrusion, particularly for large diameter pipes. VESTAMID® NRG 3001 demonstrates exceptional compatibility with hydrocarbons such as crude oil, as well as oilfield chemicals like paraffin inhibitors. As a result, it delivers high dimensional stability and maintains unaffected properties for parts in contact with these substances. Experience the reliability and performance of VESTAMID® NRG 3001 in your hydrocarbon transport applications. Choose VESTAMID® NRG 3001 for its superior properties, easy processing, and excellent dimensional control, ensuring optimal performance and durability in your piping systems and liners.

VESTAMID® NRG 2101 YE is a high-molecular-grade PA-12 material developed by Evonik. It is designed for use in thermoplastic piping systems at higher operating pressures and larger diameters, replacing metallic piping systems in a safe and cost-effective manner. It offers superior performance characteristics.

VESTAKEEP® 4000 P is an unreinforced, high-viscosity polyether ether ketone powder. It can be used for manufacturing compounds or as a scatter powder for composites. The semicrystalline polymer offers superior thermal and chemical resistance. VESTAKEEP® 4000 P has low flammability.

VESTAMID® NRG 2901 BK is a high-viscosity, heat-stabilized compound with exceptional mold release properties. It is nucleated to reduce cycle time and shrinkage of molded parts. It is commonly used for gas pipes and fittings, with a proven record of safe and reliable performance in demanding applications, including fuel lines in passenger cars, air brake tubing in trucks, and offshore applications.

VESTAMID® NRG 1001 is a high-viscosity, plasticized, and impact-modified PA 12 compound with heat and light stabilizers for the extrusion of flexible tubing and hoses, particularly for oil and petrochemical applications. It offers easy processing and good dimensional control during pipe extrusion, especially for large pipe diameters.

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 4250 is a hybrid bisphenol A/bisphenol F-type epoxy resin that is more flexible than conventional polymer-type epoxy resins. It can be used as an additive to add toughness, insulating and vapor barrier properties and resistance to heat, water and chemicals to a variety of applications. FeaturesPolymer-type epoxy resin with epoxy functional groups at the both endsHigh molecular weightHigh softening points Good adhesionApplicationsPCM, CAN and other coatingsPaintThermoplastics Printed electronics Plastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jER™ YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SILRES® H 44 is a powdered, condensation-curing phenyl silicone resin with excellent solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Due to its compatibility with organic resins, SILRES® H 44 can also be used to modify or partly replace phenolic resins in the respective compounds. Compared to other silicone resins, SILRES® H 44 cures relatively quickly at elevated temperatures. It is therefore particularly suitable for fully automated production lines.

SILRES® MK Flakes is a condensation-curing methyl silicone resin with good solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Besides, SILRES® MK Flakes is the ideal product for making tack-free prepregs with excellent storage stability. Fully cured SILRES® MK Flakes has the lowest carbon content of all WACKER silicone resins and thus yields a very high ash content when pyrolized. Composites made of SILRES® MK Flakes show long-term stability against weathering, moisture, and UV light. They can therefore be continuously exposed to constantly changing climatic conditions, UV radiation, and temperatures significantly higher than 300 °C (572 °F). SILRES® MK Flakes also provides water repellency and excellent electrical insulation properties to the respective composite materials.

SILRES® MK Powder is a condensation-curing methyl silicone resin with good solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Additionally, SILRES® MK Powder is the ideal product for making tack-free prepregs with excellent storage stability. When fully cured, SILRES MK POWDER has the lowest carbon content among all WACKER silicone resins, resulting in a high ash content when pyrolized. Composites made of SILRES® MK Powder exhibit long-term stability against weathering, moisture, and UV light. They can be continuously exposed to changing climatic conditions, UV radiation, and temperatures exceeding 300 °C (572 °F). Furthermore, SILRES® MK Powder provides water repellency and excellent electrical insulation properties to the composite materials.

ForTii® Ace WX53-FC is a high-temperature polyamide with halogen-free and halogen-containing flame retardant grades. It is designed for demanding applications in the electronics, lighting, automotive, white goods, industrial, and aerospace industries. It exhibits best-in-class high-temperature and wet mechanical performance, weldline strength, and weldline strength retention in hot water and steam. ForTii® Ace WX53-FC is a PPA with a high glass transition temperature and extreme chemical resistance, making it suitable for applications requiring high mechanical strength at elevated temperatures. It is processed using injection molding technology and features a USP class VI classification, making it suitable for drinking water contact.

Akulon® Ultraflow K-FKG8 is a high-performance polyamide 6 and polyamide 66 material trusted globally for applications spanning automotive, electronics, electrical, furniture, and packaging. In molded parts, it delivers an impressive combination of design simplicity and processing ease, alongside outstanding mechanical properties across a broad temperature range and diverse conditions. For extrusion, it establishes industry benchmarks, featuring remarkable strength, resilience, and ease of processing. Injection molding is the preferred method, and key attributes encompass 40% glass reinforcement, heat stabilization, and high flow characteristics.

Akulon® K224-HG7 is a polyamide 6 (PA 6) resin that is both heat-stable and lightweight, making it ideal for use in the automotive and transportation industries as well as in electrical and electronics applications. It has end uses in air intake manifolds and automotive fuel structural components.

Akulon® Ultraflow XG-FKGS6 is a high-performance polyamide 6 and polyamide 66 material trusted worldwide for applications in automotive, electronics, electrical, furniture, and packaging. In molded parts, it delivers an impressive blend of design simplicity and processing ease, along with exceptional mechanical properties across a wide temperature range and diverse conditions. For extrusion, it sets industry benchmarks, featuring remarkable strength, resilience, and ease of processing. This product boasts special features including 30% glass reinforcement, flame retardancy (halogen-free), and being best suited for injection molding.

Akulon® K222-KGV6 is a polyamide 6 (PA 6) resin labeled as halogen-free and phosphorus-free, making them environmentally friendly. They are also flame-retardant, heat-stabilized, lightweight, and have achieved UL flame ratings. They find applications in industries like automotive and transportation as well as electrical and electronics.

Akulon® Ultraflow K-FHG6/B is a high-performance polyamide 6 and polyamide 66 material widely used in automotive, electronics, electrical, furniture, and packaging applications globally. In molded parts, it delivers an exceptional blend of design simplicity and processing ease, along with impressive mechanical properties across a broad temperature range and diverse conditions. For extrusion, it sets industry benchmarks, offering outstanding strength, resilience, and easy processing. Injection molding is the preferred method, and notable features encompass 30% glass reinforcement, heat stabilization, high flow, and enhanced processing capabilities.

Akulon® SG-KGS5/HV is a high-performance material that combines the properties of polyamide 6 and polyamide 66. This versatile material finds applications across various industries, including automotive, electronics, electrical, furniture, and packaging. Whether used in molded parts or extrusion, Akulon® SG-KGS5/HV offers an excellent balance between ease of design and processing while delivering exceptional mechanical properties across a wide temperature range and in diverse conditions.

Akulon® K20HG60 is a polyamide 6 (PA 6) that serves as a resin, binder, and matrix material with the additional benefit of a low carbon footprint. Its features include cost-effectiveness, design flexibility, good strength, heat stabilization, high-temperature resistance, and light weight, making it suitable for various markets including automotive, electrical, electronics, and industrial applications.

Akulon® Ultraflow K-FHGR24 is a high-performance polyamide 6 and polyamide 66 material trusted worldwide for a multitude of applications, including automotive, electronics, electrical, furniture, and packaging. In molded parts, it delivers an exceptional equilibrium between design simplicity and processing ease, accompanied by outstanding mechanical properties over a broad temperature range and in diverse conditions. For extrusion, it sets industry benchmarks, featuring impressive strength, resilience, and ease of processing. Injection molding is the preferred method, and key attributes include 10% glass reinforcement, 20% glass beads reinforcement, heat stabilization, and high flow characteristics.

Akulon® CO-KGV4/A JN.00.86 is a polyamide 6 (PA 6) composite material that is 20% glass-reinforced, heat stabilized, and flame retardant without the use of halogen or phosphorous. It is characterized by its lightweight nature and UL flame rating. This material is applied in the automotive and transportation industries for both exterior and interior components, as well as in the electrical and electronics sectors for parts and components, including circuit breakers.

ForTii® Ace MX53 is a polyphthalamide (PPA) with unique fatigue performance and chemical resistance. Its high aromatic content and high Tg lead to excellent part stiffness and low creep, even at temperatures up to 150 °C. Moisture uptake occurs slowly, with minimal impact on dimensions. ForTii® Ace MX53 is processed using injection molding technology and is heat stabilized. It is 50% glass-reinforced and suitable for automotive applications.