Products in Devices & Assemblies: Resins, Binders & Matrix Materials

MultiTech Resin is an alicyclic epoxide for epoxy resin composition, with the following features :- Excellent fluidity. Possible to maintain low viscosity at high temperature by partial addition of DE-102- High light resistance- Low water absorption

MultiTech MultiFunctional L is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparency LED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs MultiTech MultiFunctional L is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

SILRES® K is a solution of a condensation-curing methyl silicone resin in toluene. The product can be used as a binder or as an impregnation agent for porous materials. Besides, SILRES® K is the ideal product for making tack-free prepregs with excellent storage stability. Fully cured SILRES® K has a very low carbon content and thus yields a high ash content when pyrolized. Composites made of SILRES® K show long-term stability against weathering, moisture, and UV light. They can therefore be continuously exposed to constantly changing climatic conditions, UV radiation, and temperatures significantly higher than 300 °C (572 °F). SILRES® K also provides water repellency and excellent electrical insulation properties to the respective composite materials.

SILRES® H62 C is a liquid, solvent-free, one-part heat-curing phenyl silicone resin formulation. The product is ideal for impregnating the electrical coils of motors and generators. Besides, SILRES® H62 C can be used to provide hydrophobic properties to porous materials and as a binder for composites made of fibrous fillers, cloths, and woven or non-woven reinforcing materials. The formulation is ready-to-use and crosslinks under heat. While curing, SILRES® H62 C does not release chemical byproducts, so curing shrinkage is barely noticeable. The product also thermosets in thick layers, even when in contact with air. Fully cured SILRES® H62 C has excellent electrical insulation properties and outstanding long-term heat resistance. Additionally, it shows high stability against weathering, moisture, and UV light and can therefore be continuously exposed to constantly changing climatic conditions or UV radiation.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SILRES® H 44 is a powdered, condensation-curing phenyl silicone resin with excellent solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Due to its compatibility with organic resins, SILRES® H 44 can also be used to modify or partly replace phenolic resins in the respective compounds. Compared to other silicone resins, SILRES® H 44 cures relatively quickly at elevated temperatures. It is therefore particularly suitable for fully automated production lines.

SILRES® MK Flakes is a condensation-curing methyl silicone resin with good solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Besides, SILRES® MK Flakes is the ideal product for making tack-free prepregs with excellent storage stability. Fully cured SILRES® MK Flakes has the lowest carbon content of all WACKER silicone resins and thus yields a very high ash content when pyrolized. Composites made of SILRES® MK Flakes show long-term stability against weathering, moisture, and UV light. They can therefore be continuously exposed to constantly changing climatic conditions, UV radiation, and temperatures significantly higher than 300 °C (572 °F). SILRES® MK Flakes also provides water repellency and excellent electrical insulation properties to the respective composite materials.

SILRES® MK Powder is a condensation-curing methyl silicone resin with good solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Additionally, SILRES® MK Powder is the ideal product for making tack-free prepregs with excellent storage stability. When fully cured, SILRES MK POWDER has the lowest carbon content among all WACKER silicone resins, resulting in a high ash content when pyrolized. Composites made of SILRES® MK Powder exhibit long-term stability against weathering, moisture, and UV light. They can be continuously exposed to changing climatic conditions, UV radiation, and temperatures exceeding 300 °C (572 °F). Furthermore, SILRES® MK Powder provides water repellency and excellent electrical insulation properties to the composite materials.

Akulon® Ultraflow K-FKG8 is a high-performance polyamide 6 and polyamide 66 material trusted globally for applications spanning automotive, electronics, electrical, furniture, and packaging. In molded parts, it delivers an impressive combination of design simplicity and processing ease, alongside outstanding mechanical properties across a broad temperature range and diverse conditions. For extrusion, it establishes industry benchmarks, featuring remarkable strength, resilience, and ease of processing. Injection molding is the preferred method, and key attributes encompass 40% glass reinforcement, heat stabilization, and high flow characteristics.

Akulon® Ultraflow XG-FKGS6 is a high-performance polyamide 6 and polyamide 66 material trusted worldwide for applications in automotive, electronics, electrical, furniture, and packaging. In molded parts, it delivers an impressive blend of design simplicity and processing ease, along with exceptional mechanical properties across a wide temperature range and diverse conditions. For extrusion, it sets industry benchmarks, featuring remarkable strength, resilience, and ease of processing. This product boasts special features including 30% glass reinforcement, flame retardancy (halogen-free), and being best suited for injection molding.

Akulon® K222-KGV6 is a polyamide 6 (PA 6) resin labeled as halogen-free and phosphorus-free, making them environmentally friendly. They are also flame-retardant, heat-stabilized, lightweight, and have achieved UL flame ratings. They find applications in industries like automotive and transportation as well as electrical and electronics.

Akulon® Ultraflow K-FHG6/B is a high-performance polyamide 6 and polyamide 66 material widely used in automotive, electronics, electrical, furniture, and packaging applications globally. In molded parts, it delivers an exceptional blend of design simplicity and processing ease, along with impressive mechanical properties across a broad temperature range and diverse conditions. For extrusion, it sets industry benchmarks, offering outstanding strength, resilience, and easy processing. Injection molding is the preferred method, and notable features encompass 30% glass reinforcement, heat stabilization, high flow, and enhanced processing capabilities.

Akulon® SG-KGS5/HV is a high-performance material that combines the properties of polyamide 6 and polyamide 66. This versatile material finds applications across various industries, including automotive, electronics, electrical, furniture, and packaging. Whether used in molded parts or extrusion, Akulon® SG-KGS5/HV offers an excellent balance between ease of design and processing while delivering exceptional mechanical properties across a wide temperature range and in diverse conditions.

Akulon® K20HG60 is a polyamide 6 (PA 6) that serves as a resin, binder, and matrix material with the additional benefit of a low carbon footprint. Its features include cost-effectiveness, design flexibility, good strength, heat stabilization, high-temperature resistance, and light weight, making it suitable for various markets including automotive, electrical, electronics, and industrial applications.

Akulon® Ultraflow K-FHGR24 is a high-performance polyamide 6 and polyamide 66 material trusted worldwide for a multitude of applications, including automotive, electronics, electrical, furniture, and packaging. In molded parts, it delivers an exceptional equilibrium between design simplicity and processing ease, accompanied by outstanding mechanical properties over a broad temperature range and in diverse conditions. For extrusion, it sets industry benchmarks, featuring impressive strength, resilience, and ease of processing. Injection molding is the preferred method, and key attributes include 10% glass reinforcement, 20% glass beads reinforcement, heat stabilization, and high flow characteristics.

ForTii® Ace MX53 is a polyphthalamide (PPA) with unique fatigue performance and chemical resistance. Its high aromatic content and high Tg lead to excellent part stiffness and low creep, even at temperatures up to 150 °C. Moisture uptake occurs slowly, with minimal impact on dimensions. ForTii® Ace MX53 is processed using injection molding technology and is heat stabilized. It is 50% glass-reinforced and suitable for automotive applications.

Akulon® Ultraflow K-FKGS6/B is a versatile family of high-performance polyamide 6 and polyamide 66 materials widely employed by global customers in automotive, electronics, electrical, furniture, and packaging applications. In molded parts, these materials deliver an impressive blend of design flexibility and ease of processing, along with exceptional mechanical properties over a broad temperature range and diverse conditions. For extrusion, they set industry benchmarks, featuring remarkable strength, resilience, and ease of processing. The preferred processing technology for these materials is injection molding. Notable features encompass good or high flow characteristics, heat stabilization, and VDE certification.

Akulon® SG-KGS6 is a high-performance material that combines the properties of polyamide 6 and polyamide 66. It is widely used in various industries, including automotive, electronics, electrical, furniture, and packaging. Whether applied in molded parts or extrusion processes, Akulon® SG-KGS6 stands out for its exceptional combination of design flexibility, easy processing, and outstanding mechanical properties. It performs well over a wide temperature range and under diverse conditions.

ForTii® Ace JTX8 is a breakthrough high-temperature polyamide with halogen-free and halogen-containing flame retardant grades. It is designed for demanding applications in the electronics, lighting, automotive, white goods, industrial, and aerospace industries. ForTii® Ace JTX8 is the only polyamide grade that secures the JEDEC MSL 1 rating at all thicknesses in all product designs. It has the highest glass transition temperature (Tg) available in polyamides (160 °C), satisfying various industry requirements such as chemical resistance and high-temperature thermal aging. It offers extremely robust processing performance and allows 100% regrinding while retaining high mechanical properties. ForTii® Ace JTX8 is processed using injection molding technology and features improved resistance to blistering.

EcoPaXX® Q-DWX6 is a long aliphatic polyamide with excellent mechanical and flow performance, suitable for food contact and drinking water applications. It offers exceptional chemical resistance, low moisture absorption, a very high melting point, and a high crystallization rate. The material can be processed using injection molding technology. It has good surface properties and meets the requirements for drinking water contact grade. It is also 30% glass-reinforced and meets the standards for food contact quality.

EcoPaXX® Q-HG6 is a long aliphatic polyamide with excellent chemical and hydrolysis resistance. It is suitable for thermal management applications and other structural parts. It offers exceptional chemical resistance, low moisture absorption, a very high melting point, and a high crystallization rate. The material can be processed using injection molding technology. It is heat stabilized and contains 30% glass reinforcement.

ForTii® Ace MX52 is a polyphthalamide (PPA) with unique fatigue performance and chemical resistance. Its high aromatic content and high Tg lead to excellent part stiffness and low creep, even at temperatures up to 150 °C. Moisture uptake occurs slowly, with minimal impact on dimensions. ForTii® Ace MX52 is processed using injection molding technology and is heat stabilized. It is 40% glass-reinforced and suitable for automotive applications.

Akulon® S223-KG6 is a high-performance material that combines the characteristics of polyamide 6 and polyamide 66. It is widely used by customers across the world in various applications, including automotive, electronics, electrical, furniture, and packaging. In molded parts, this material excels in providing an excellent balance between ease of design and processing, all while delivering outstanding mechanical properties over a wide temperature range and under diverse conditions.

Akulon® K222-KGV4 is a polyamide 6 (PA 6) resin that comes with labeling claims of being halogen-free and phosphorus-free. They feature flame-retardant and heat-stabilized properties, making them suitable for applications in automotive and transportation as well as electrical and electronics markets. Additionally, they are known for their light weight and UL flame rating.

Akulon® SG-KGS6/HV is a high-performance polyamide 6 and polyamide 66 material used worldwide in automotive, electronics, electrical, furniture, and packaging applications. It offers an excellent balance of design flexibility and processing ease with outstanding mechanical properties over a wide temperature range. For extrusion, it sets market standards with its 30% glass reinforcement, high flow, halogen-free, and red phosphorous-free composition.

ForTii® Ace MX53B is a high-TG PPA that combines good toughness at low temperatures with chemical resistance. It is designed to replace metal in structural parts requiring high performance over a broad temperature range, from -35 °C to above 150 °C, in both dry and conditioned environments. ForTii® Ace MX53B is processed using injection molding technology and is heat stabilized. It is 50% glass-reinforced and suitable for structural parts.

Akulon® S223-HG6 is a high-performance material that combines the attributes of polyamide 6 and polyamide 66. It is widely utilized by customers worldwide in various applications, including automotive, electronics, electrical, furniture, and packaging. In molded parts, this material excels in providing an excellent balance between ease of design and processing, all while delivering outstanding mechanical properties over a wide temperature range and under diverse conditions.

Akulon® S223-HG7 is a high-performance material that blends the characteristics of polyamide 6 and polyamide 66. It is widely used by customers worldwide in various applications, including automotive, electronics, electrical, furniture, and packaging. When employed in molded parts, this material excels in providing an excellent balance between ease of design and processing while delivering outstanding mechanical properties over a wide temperature range and under diverse conditions.