Products in Thermoset Resins: Transfer Molding

DAP ID-40 is a general-purpose diallyl ortho-phthalate molding compound filled with Orlon. It is supplied in a granular form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.

Cosmic Epoxy EH61 is an iron-filled epoxy molding compound provided in a black granular form. It is designed for EMI/RFI shielding applications and can be utilized in compression or transfer molding processes to manufacture core rods or encapsulate surface mount and axial leaded inductors. This single molded compound streamlines the manufacturing process, eliminating the labor-intensive over/under molding steps.

DAP D62/6130F is a versatile diallyl ortho-phthalate molding compound, with the added benefits of being flame retardant and long-glass fiber filled. It is supplied in flake form, making it convenient for various applications. This compound can be efficiently molded using compression or transfer equipment and is easily preformed for ease of handling. Notably, it maintains its performance when stored at room temperature for up to one year. Additionally, it has successfully passed NASA outgassing tests, indicating its suitability for a range of applications, including those with stringent requirements.

DAP K31/6220 is a versatile diallyl iso-phthalate molding compound, filled with short glass fibers and supplied in granular form. This compound offers excellent heat resistance and is suitable for a wide range of applications. It is easy to work with, pouring easily and allowing for preforming. Additionally, it molds readily using standard compression, transfer, or injection equipment. One notable feature of K31/6220 is its FDA approval for direct food contact use, making it a reliable choice for applications in the food industry where heat resistance and safety standards are essential.

DAP D33/6120 is a versatile general purpose diallyl ortho-phthalate molding compound that incorporates short glass fibers for added strength. Supplied in a free-flowing granular form, it is designed for ease of use in molding applications. This compound can be easily molded using compression, transfer, or injection equipment, and it can also be readily preformed to suit the specific requirements of the application. Its blend of properties makes it suitable for a range of molding applications where strength and versatility are essential.

Cosmic Alkyd 3D36 is a specialized alkyd molding compound that incorporates long glass fibers for enhanced impact resistance and flame retardant properties. Supplied in flake form, it is designed for ease of use and versatility in molding applications. This compound molds readily using standard compression or transfer equipment, and it maintains its performance for up to one year when stored at temperatures of 100°C or below. Its unique blend of properties makes it suitable for applications that require both impact resistance and flame retardancy.

Cosmic Epoxy EH71 is an iron-filled epoxy molding compound available in a black granular form. It is well-suited for EMI/RFI shielding applications and can be used in either compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to streamline the manufacturing process by eliminating the labor-intensive over/under molding steps.

Cosmic Alkyd 3D94 is a mineral-filled polyester molding compound that is available in sheet form. This compound is designed for ease of use in molding applications and can be readily molded using standard compression or transfer equipment. It offers good moldability, making it suitable for a range of applications where a combination of mechanical strength and cost-effectiveness is desired. When stored at temperatures of 50°C or below, it has a shelf life of six months, providing flexibility in manufacturing and storage.

DAP K66/6230F is a versatile diallyl iso-phthalate molding compound that incorporates long glass fibers for enhanced strength and flame retardant properties. Supplied in flake form, it is designed for ease of use in molding applications. This compound can be readily preformed and molds easily using standard compression or transfer equipment, making it a flexible choice for various applications. Notably, it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.

Cosmic Epoxy EH21 is an iron-filled epoxy molding compound provided in a black granular form. It is well-suited for applications requiring EMI (Electromagnetic Interference) and RFI (Radio-Frequency Interference) shielding. This material can be molded through compression or transfer molding processes to create core rods or to encapsulate surface mount and axial leaded inductors. It offers the advantage of simplifying the molding process by eliminating the need for labor-intensive over/under molding.

Cosmic Epoxy EH40 is an iron-filled epoxy molding compound available in a black granular form. It is suitable for EMI/RFI shielding applications and can be used for compression or transfer molding to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the need for labor-intensive over/under molding.

DAP D72/6120F is a versatile diiallyl ortho-phthalate molding compound, filled with short glass fibers and featuring flame retardant properties. Supplied in a free-flowing granular form, this compound is well-suited for a variety of molding applications. It can be easily molded using compression, transfer, or injection equipment and can be preformed with ease. An important distinction is that it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.

Cosmic Epoxy EH31 is an iron-filled epoxy molding compound available in a granular form with a black color. This material is designed for EMI/RFI shielding applications. It can be used for compression or transfer molding to create core rods and encapsulate surface mount and axial leaded inductors. Using this single molded compound can streamline the manufacturing process and eliminate the need for labor-intensive over/under molding.

Cosmic Epoxy CP7311 is a long-glass reinforced epoxy molding compound that comes in a flake form. It is designed to be an ideal replacement for various aircraft and heavy metal parts, providing a durable and high-strength material suitable for demanding applications in these industries.

DAP K61/6230 is a general-purpose diallyl iso-phthalate molding compound that contains long-glass fiber fillers. It is supplied in flake form, making it suitable for various molding applications. This compound can be preformed and easily molded using standard compression and transfer equipment. It offers good moldability and is designed to meet the requirements of general-purpose molding applications where a balance of mechanical strength and ease of processing is essential.

Farboset® 1115 is a granular, mineral-filled, anhydride epoxy molding compound with fast cure rates and excellent hot strength. It is specially designed for encapsulating various electrical and electronic components, including coils, transformers, bushings, switches, and more. The material offers good hot rigidity during the molding process and is commonly used in injection and transfer molding applications.

Cosmic Epoxy CP7314 is a long-glass reinforced epoxy molding compound provided in flake form. This material is well-suited for serving as a replacement for a wide range of aircraft and heavy metal parts, offering enhanced durability and strength for demanding applications in these industries.

Cosmic Epoxy CP7318 is a long-glass-reinforced epoxy molding compound supplied in flake form. It can be compressed or transfer-moulded and exhibits high physical strength. This material has a shelf life of 12 months when stored at 20°C or lower. It serves as an ideal replacement for numerous aircraft and heavy metal parts.

Cosmic Epoxy EH81 is an iron-filled epoxy molding compound available in a black granular form. It is specifically designed for EMI/RFI shielding applications and can be used in both compression and transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to simplify the manufacturing process by eliminating the labor-intensive over/under molding steps.

DAP D69/6130 is a versatile diallyl ortho-phthalate molding compound with the advantage of being long-glass fiber filled. Supplied in flake form, this compound is convenient to work with. It can be easily molded using compression or transfer equipment and can be preformed for improved handling. Notably, it maintains its performance even when stored at room temperature for up to one year. This makes it a reliable choice for a wide range of applications where long-term performance and ease of use are essential.

Cosmic Epoxy CP7312 is a long-glass-reinforced epoxy molding compound supplied in flake form. It can be compression or transfer-moulded and offers high physical strength. This material has a shelf life of 12 months when stored at 20°C or lower. It is an excellent replacement option for a wide range of aircraft and heavy metal parts, making it a versatile choice for various applications.

DAP ID-50 is a general-purpose diallyl ortho-phthalate molding compound filled with Dacron. It is supplied in a granular form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.

DAP D44/6160 is a mineral-filled, special-purpose diallyl ortho-phthalate molding compound supplied in a free-flowing granular form. It can be easily molded using compression, transfer, or injection equipment and can be readily preformed. It surpasses all mineral compounds available today in terms of mechanical and electrical properties. It boasts extremely low water absorption, high dielectric strength, and a low dissipation factor, along with high tensile strength, exceptional arc resistance, and excellent resistance to high temperatures.

DAP 224 is a general-purpose diallyl ortho-phthalate molding compound filled with Dacroon. It is supplied in a flake form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.

Cosmic Epoxy C102 is a copper-filled molding compound available in a very fine granular form. It is suitable for various molding processes, including injection molding, compression molding, and transfer molding. This material is designed for fabricating parts that demand high strength and excellent electrical conductivity.

DAP K77/6220F is a high-quality diallyl iso-phthalate molding compound that combines short glass fibers and flame retardant properties. Supplied in granular form, it is designed for ease of use in molding applications. This compound has excellent flow characteristics, making it easy to pour and mold in standard compression, transfer, or injection equipment. Its flame retardant properties make it suitable for applications where fire resistance is a critical factor, such as in the production of components for fire safety equipment or other high-temperature environments.

Cosmic Epoxy EH51 is an iron-filled epoxy molding compound available in a black granular form. It is designed for EMI/RFI shielding applications and can be used in compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the labor-intensive over/under molding.

DAP K43/6260 is a versatile diallyl iso-phthalate molding compound that is filled with minerals and supplied in granular form. This compound is designed for ease of use and versatility. It pours easily, can be preformed, and molds readily using standard compression, transfer, or injection equipment. What sets K43/6260 apart is its exceptional heat resistance, high arc resistance, and ease of molding around inserts. These features make it an ideal choice for applications that demand high-temperature performance and electrical insulation properties, while still allowing for straightforward processing and customization.

Durez™ 31735 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used It is available in Granules form.

Duresco NU 505 L is a Mineral filled epoxy molding compound with high temperature resistance and very good dimensional stability. Low and isotropic thermal expansion.

Duresco NU 4414 F is a Epoxy molding compound with good mechanical properties and high temperature resistance.

Duresco NU 5680 V is a Glass fiber reinforced epoxy molding compound with high latency for multi-purpose applications.

Durez™ 00153 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used Durez™ 00153 is certified as UL Flame Rated. It is available in Granules form.

Fudow Company F5982Fis inorganic filler.

Duresco NU 461 R is a Epoxy molding compound with excellent thermal shock and chemical resistance for high temperature applications.

Duresco NU 510-1 F is a Glass fiber reinforced epoxy molding compound with very good mechanical properties for high temperature applications.